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PART ATS-56009-c3-R0 maxiFloWdesign features profile, spread arra
Top Searches for this datasheetDIGI-KEY PART ATS1340-ND PART ATS-56009-c3-R0 maxiFloWdesign features profile, spread array that maximizes surface area more effective convection (air) cooling Designed specifically ASIc package their unique cooling requirements comes preassembled with high performance thermal interface material Thermal Performance Table VElocITY FT/MIN THERMAl RESISTANcE °c/W (UNDUcTED) °c/W (DUcTED) Product Details DIMENSIoN DIMENSIoN DIMENSIoN DIMENSIoN 44.3 c675 FINISH BlAcK-ANoDIZED further technical information, please contact Advanced Thermal Solutions, Inc. 1-781-769-2800 www.qats.com RoHS compliant Thermal Interface Material Dimensions measured millimeters Dimension height heat sink shown above does include height attachment method place order, please visit www.digikey.com Other recent searchesTP0002CC01 - TP0002CC01 TP0002CC01 Datasheet IDT5T995 - IDT5T995 IDT5T995 Datasheet IBM04368CXLBC - IBM04368CXLBC IBM04368CXLBC Datasheet IBM04188CXLBC - IBM04188CXLBC IBM04188CXLBC Datasheet HY57V281620B - HY57V281620B HY57V281620B Datasheet GS-R1012 - GS-R1012 GS-R1012 Datasheet BFY196 - BFY196 BFY196 Datasheet AC108 - AC108 AC108 Datasheet
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