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PART ATS-56001-c3-R0 maxiFloWdesign features profile, spread arra


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DIGI-KEY PART ATS1332-ND
PART ATS-56001-c3-R0
maxiFloWdesign features profile, spread array that maximizes surface area more effective convection (air) cooling Designed specifically ASIc package their unique cooling requirements comes preassembled with high performance thermal interface material
Thermal Performance Table VElocITY
FT/MIN
THERMAl RESISTANcE
°c/W (UNDUcTED) °c/W (DUcTED)
Product Details DIMENSIoN DIMENSIoN DIMENSIoN DIMENSIoN 26.3 c675 FINISH
RED-ANoDIZED
further technical information, please contact Advanced Thermal Solutions, Inc. 1-781-769-2800 www.qats.com
RoHS compliant
Thermal Interface Material Dimensions measured millimeters Dimension height heat sink shown above does include height attachment method
place order, please visit www.digikey.com

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