8-24 Frequency Multiplier Description Agilent's AMMP-6120 easy-to
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AMMP-6120
8-24 Frequency Multiplier
Description Agilent's AMMP-6120 easy-to-use integrated frequency multiplier (x2) surface mount package designed commercial communication systems. MMIC takes input signal doubles GHz. integrated amplification, matching, harmonic suppression, bias networks. input/output matched fully blocked. MMIC fabricated using PHEMT technology. backside package both ground. This helps simplify assembly process reduces assembly related performance variations costs. surface mount package allows elimination "chip wire" assembly lower cost. This MMIC cost effective alternative hybrid (discrete-FET), passive, diode doublers that require complex tuning assembly processes.
Features 5x5mm Surface Mount Package Frequency Range 8-24 output (Useable GHz) Broad input power range: Output Power Harmonic Suppression (Fundamental) requirements -1.4V Pin= +3dBm Applications Microwave Radio systems Satellite VSAT systems Commercial grade military 802.16 802.20 WiMax systems MMDS loops
RFin
RFout
view package base:
Function
Attention: Observe precautions handling electrostatic sensitive devices. Machine Model (Class Human Body Model (Class Refer Agilent Application Note A004R: Electrostatic Discharge Damage Control.
AMMP-6120 Absolute Maximum Ratings[1]
Symbol Tstg Tmax
Parameters/Conditions Positive Drain Voltage Gate Supply Voltage Drain Current Input Power Operating Channel Temp. Storage Case Temp. Maximum Assembly Temp.(60 sec. max.)
Unit
Minimum -3.0
Maximum +0.5 +150
+150 +300
Note: Operation excess these conditions result permanent damage this device.
AMMP-6120 Specifications/Physical Properties
Symbol Parameters Test Conditions ch-b Drain Supply Current (under power drive temperature) (Vd=5V) Gate Current Thermal Resistance (Backside temperature, 25°C)
Units °C/W
Typ.
Maximum
Notes: Ambient operational temperature TA=25°C unless otherwise noted. Channel-to-backside Thermal Resistance (Tchannel (Tc) 34°C) measured using infrared microscopy. Thermal Resistance backside temperature (Tb) 25°C calculated from measured data.
Specifications (3,4) (TA=25°C, Vd=5V, Vg=-1.4V, Id(Q)=85mA, Zin=Zout=50)
Symbol Parameters Test Conditions Pout Rlin RLout IP-1dB Sup3 Sup4 SSBPN Output Power
Units
Minimum
Typ.
Input Return Loss Output Return Loss Input Power Gain Comp Fundamental Suppresion
Harmonic Suppression Harmonic Suppression Single Side Band Phase Noise (@100kHz offset)
-140 (fout=15.6GHz)
Notes: Small/Large -signal data measured fully de-embedded test fixture form 25°C. Pre-assembly into package performance verified 100% on-wafer. This final package part performance verified functional test correlated actual performance Fout=10GHz output, Pin=+3dBm.
AMMP-6120 Typical Performances 25°C,Zin Zout Vd=5V, Vg=-1.4V)
Output Power (dBm)
Output Power (dBm)
-40°C [2H] +25°C [2H] +85°C [2H] -40°C [1H] +25°C [1H] +85°C [1H]
Output Frequency (GHz)
Figure Output Power Output Freq. Pin=+3dBm
Output Frequency (GHz)
Figure Output Power Output Freq. over temp Pin=+3dBm
Output Frequency (GHz)
Pin=-2dBm Pin= 0dBm Pin=+2dBm Pin=+4dBm
Suppression [1H] (dBc)
Output Power [2H] (dBm)
Output Frequency [GHz]
Pin=-2dBm Pin= 0dBm Pin=+2dBm Pin=+4dBm
Figure Output Power [2H] Output Freq. variable
Figure Fundamental Suppression variable
Return Loss (dB)
Total Drain Current [Id] (mA)
Input Power [1H] (dBm)
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Frequncy (GHz)
Figure Input Output Return Loss
Figure Variation total drain current with input power
Fout=8GHz
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Output Power [2H] (dBm)
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Suppression [1H] (dBc)
Fout=8GHz
Input Power [1H] (dBm)
Input Power [1H] (dBm)
Figure Output Power Input Power Fout=8GHz
Figure Fundamental Supp. Input Power Fout=8GHz
Fout=10GHz
Fout=10GHz Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Output Power [2H] (dBm)
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Suppression [1H] (dBc)
Input Power [1H] (dBm)
Input Power [1H] (dBm)
Figure Output Power Input Power Fout=10GHz
Figure Fundamental Supp. Input Power Fout=10GHz
Output Power [2H] (dBm)
Fout=14GHz Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Fout=14GHz
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Suppression [1H] (dBc)
Input Power [1H] (dBm)
Input Power [1H] (dBm)
Figure Output Power Input Power Fout=14GHz
Figure Fundamental Supp. Input Power Fout=14GHz
Output Power [2H] (dBm)
Fout=16GH Suppression [1H] (dBc)
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Fout=16GHz
Input Power [1H] (dBm)
Input Power [1H] (dBm)
Figure Output Power Input Power Fout=16GHz
Figure Fundamental Supp. Input Power Fout=16GHz
Output Power [2H] (dBm)
Suppression [1H] (dBc)
Fout=20GHz
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Fout=20GHz
Input Power [1H] (dBm)
Input Power [1H] (dBm)
Figure Output Power Input Power Fout=20GHz
Figure Fundamental Supp. Input Power Fout=20GHz
Fout=22GHz Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Suppression [1H] (dBc)
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Output Power [2H] (dBm)
Fout=22GHz
Input Power [1H] (dBm)
Input Power [1H] (dBm)
Figure Output Power Input Power Fout=22GHz
Figure Fundamental Supp. Input Power Fout=22GHz
Suppression [1H] (-dBc)
Fout=26GHz Vd=4.5V, Vg=-1.2V
Fout=26GHz Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Output Power [2H] (dBm)
Vg=-1.2V, Vd=4.5V Vg=-1.2V, Vd=5.0V Vg=-1.4V, Vd=4.5V Vg=-1.4V, Vd=5.0V
Input Power [1H] (dBm) Figure. Output Power Input Power Fout=26GHz
-100 -110 -120 -130 -140 -150 -160 -170 1.E+02
Input Power [1H] (dBm)
Figure. Fundamental Supp. Input Power Fout=26GHz
Phase Noise (dBc/Hz)
Fout=15.6GHz
Active Balun
Filter
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
Offset Frequency [Hz]
Figure.21 Phase Noise frequency doubler (Pin=+2dBm, fout=15.6GHz)
Figure Level Schematic Frequency doubler
Biasing Operation frequency doubler MMIC consists balun. outputs this balun feed gates balanced FETs drains connected form single-ended output. This results fundamental frequency harmonics cancellation. even harmonic drain currents phase thus phase. input matching network (M/N) designed provide good match fundamental frequencies produces high impedance mismatch higher harmonics. AMMP-6120 biased with single positive drain supply single negative gate supply using separate bypass capacitors. normally biased with drain supply connected gate supply connected most applications recommended =-1.2V -1.4V Vd=4.5V 5.0V. input output ports coupled thus voltage present either port. ground connection made package base." AMMP-6120 performance changes with Drain Voltage (Vd) Gate bias (Vg) shown previous graphs. Improvements output power fundamental suppression performance possible optimizing from -1.2V -1.4V and/or from 5.0V. simplified schematic frequency multiplier shown figure active balun circuit output amplifier circuit self biased. negative bias (below pinch off) only applied FETs `F1' `F2'. FETs `F1' `F2' have significant contribution total drain current therefore cannot used drain current. should only used optimize output power fundamental higher harmonics suppression doubler. Refer Absolute Maximum Ratings table allowed thermal conditions.
Outline Drawing
Recommended Attachment AMMP Packaged Devices compatible with high volume surface mount assembly processes.
AMMP XXXX YWWDNN
Front View
material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available from www.agilent.com/view/ upon request from Agilent Application Engineering.
Side View
Symbol
0.198 (5.03) 0.0685 (1.74)
0.213 (5.4) 0.088 (2.25)
Evaluation Test Circuit (Demo Board) (Available customer qualified request)
Dimensions inches (mm)
.011 [0.28] .018 [0.46] .114 [2.9] .014 [0.365] .016 [0.40] .126 [3.2] .059 [1.5] .100 [2.54] .029 [0.75] .100 [2.54] .028 [0.70] .016 [0.40] .093 [2.36] Back View
.012 [0.30]
Dimensional Tolerance back view: 0.002" (0.05mm) Notes: Indicates Dimensions inches [millimeters] Grounds must soldered Ground
Suggested Material Land Pattern
0.093 (2.36) 0.010 (0.25) 0.011 (0.28) 0.016(0.40) 0.0095 (0.24)
0.126 0.059 0.020 (3.20) (1.50) (0.50)
0.016 (0.40) 0.012 (0.30) GROUND VIAS SHOULD SOLDER FILLED
0.018 (0.46) 0.018 (0.46) 0.114 (2.90) INCHES (MILLIMETERS). MATERIAL ROGERS RO4350, 0.010-INCH THICK.
0.0095 (0.024)
Manual Assembly Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Conductive epoxy recommended. Hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temperature avoid damage thermal shock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that profile will expose device beyond these limits. Solder Reflow Profile most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only. Recommended solder reflow profile
Peak 250°C Melting point 218°C
Temp (°C)
Stencil Design Guidelines properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127 mils) thick stainless steel which capable producing required fine stencil outline. combined stencil layout shown below.
0.70 0.60 0.9550 1.60 0.95 0.36 1.80 0.36 0.27
0.36 0.40 R0.14
Figure Stencil outline drawing (mm).
0.40 0.46 0.60 0.67
Ramp Preheat Ramp Seconds Reflow Cooling
3.20 1.80 0.40 0.36
0.36 0.40 0.27 0.30 1.60
Figure Suggested lead-free reflow profile SnAgCu solder paste.
2.90
Stencil Opening
Figure Combined stencil layouts (mm).
AMMP-6120 Part Number Ordering Information
Part Number Devices Container Container Antistatic Reel Reel AMMP-6120-BLK AMMP-6120-TR1 AMMP-6120-TR2
Device Orientation (Top View)
12mm
AMMP XXXX
AMMP XXXX
AMMP XXXX
Carrier Tape Pocket Dimensions
Notes: measure 0.3mm above base pocket pitches cumulative tol. ±0.2mm
product information complete list distributors, please site: www.avagotech.com Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2006 Avago Technologies Pte. rights reserved. Obsoletes 5989-3983EN AV01-0119EN April 2006
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