ABRACON MICRF Chip ABLS-6.7458MHz-20-R60-D ABLS-13.560MHz-10-R20-D ABL

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ABRACON MICRF Chip ABLS-6.7458MHz-20-R60-D ABLS-13.560MHz-10-R20-D ABL

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ABRACON Crystal Specification Micrel Semiconductor MICRF Series Transceiver
ABRACON MICRF Chip ABLS-6.7458MHz-20-R60-D ABLS-13.560MHz-10-R20-D ABLS-4.897MHz-20-R70-D ABLS-9.84375MHz-10-R20-D ABLS-9.7941MHz-10-R20 ABLS-13.94916MHz-10-R20 ABLS-12.1875MHz-10-R20 ABLS-13.0625MHz-10-R20 ABLS-13.6050MHz-20-R50-D ABLS-13.94916MHz-10-R20-D ABLS-14.3359MHz-20-R50 ABM9-16.000MHz-10-D-1-U ABM3B-12.1875MHz-10-D4 ABM3B-13.0625MHz-10-D4
with Micrel Chip MICRF011-002-007 MICRF102 MICRF011-002-007 MICRF102 MICRF009-010 MICRF009-010 MICRF112 MICRF112 MICRF505 MICRF009-010 MICRF505 MICRF505-509 MICRF112 MICRF112
PROPRIETARY NOTICE These documents, contained information herein, proprietary reproduced, used disclosed others manufacture other purpose, except specifically authorized, writing, ABRACON Corporation. WARNING: SENSITIVE PRODUCT
ABRACON CORPORATION
Headquarters 30332 Esperanza, Rancho Santa Margarita California, USA. 949-546-8000 Fax: 949-546-8001
ABRACON
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TITLE
PREP.
DATE 4/18/2007 DATE
ENGR. APP'D
ABRACON Crystal Specification Micrel Semiconductor MICRF Series Transceiver DRAWING DATE SCALE REV. 4/18/2007 None DATE PAGE -4/18/2007
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SCOPE This specification describes specifications ABRACON's crystals Micrel Semiconductor's IC's.
ELECTRICAL SPECIFICATIONS Individual Specifications
ABRACON ABLS-6.7458MHz-20-R60-D ABLS-13.560MHz-10-R20-D ABLS-4.897MHz-20-R70-D ABLS-9.84375MHz-10-R20-D ABLS-9.7941MHz-10-R20 ABLS-13.94916MHz-10-R20 ABLS-12.1875MHz-10-R20 ABLS-13.0625MHz-10-R20 ABLS-13.6050MHz-20-R50-D ABLS-13.94916MHz-10-R20-D ABLS-14.3359MHz-20-R50 ABM9-16.000Mhz-10-D-1-U ABM3B-12.1875MHz-10-D4 ABM3B-13.0625MHz-10-D4 Frequency (MHz) 6.74580 13.56000 4.89700 9.84375 9.79410 13.94916 12.18750 13.06250 13.60500 13.94916 14.33590 16.00000 12.18750 13.06250 Load Cap. (pF) Operating Temp. (°C) Storage Temp. (°C) (ohms) +105
Frequency Temperature
Tolerance (ppm) Stability (ppm)
Common Specifications Shunt capacitance Operation mode: Drive level: Aging year Insulation resistance: Spurious responses: max. AT-cut Fundamantal max., 100µW Typical (ABLS) max., 10µW Typical (AM9 max. min. 100Vdc -3dB max.
SPECIAL REQUIREMENT This product RoHS compliant free.
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MARKING Marking Method Laser Marking ABLS Series
Frequency (MHz) 16.00
ABM9 Series
Traceability Code (Internal) Year e.g. 2007 (See table below) Month (See table below)
Frequency (MHz) 8.00
Traceability Code (Internal) Year e.g. 2007 (See table below) Month (See table below) ABRACON's
ABM3B Series
XX.XXX
4.2.1 Marking Method Laser Marking Date Code Month January February March April June July August September October November December
Frequency (MHz) 13.062 13.0625
Traceability Code (Internal) Year e.g. 2007 (See table below) Month (See table below) ABRACON's
Code
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OUTLINE DIMENSIONS ABLS Series
ABM9 Series
ABM3B Series
Chamfer (See note) Note: availability materials, this part manufactured with chamfer advised that this does affect electrical characteristics crystal way. Chamfer (Default)
Dimension TOLERANCES: UNLESS OTHERWISE SPECIFIED:
(0.25)
.XX: 0.01 (0.025)
.XXX: 0.005 (0.013)
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RELIABILITY TEST Test Items
Temperature Cycling:
Test Conditions
component shall remain within electrical specification max) after cycles high temperature testing (-40°C +85°C) hours max. component shall remain within electrical specification after exposure extreme temperature -40°C +85°C minutes cycles. component shall remain within electrical specification after loaded vibration 10Hz 55Hz, amplitude 1.5mm, within minute hours minimum each axis (X,Y,Z). component shall remain within electrical specifications after natural drop (3X) hard wooden board component shall remain within electrical specifications after being kept condition ambient temperature +85°C, hours minimum. Expose samples 60PSIG Helium hours. leak rate 2X10-8atmcc/s. Submerge samples 100% De-ionized water Perfluorocarbon 85°C least minute. Check bubbles. Solderability terminals shall kept more than after dipped solder flux 260°C seconds. component shall withstand maximum bend 90°C reference base bends. Solder tinning must microns thick minimum.
Thermal Shock:
Vibration:
Drop Test:
Humidity:
Fine Leak Test:
Gross Leak Test:
Solderability:
Lead Bend: (ABLS only)
REFLOW PROFILE
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PACKING ABLS Series tape reel (1,000pcs/reel)
ABM9 Series tape reel (1,000pcs/reel)
ABM3B Series tape reel (1,000pcs/reel)
Dimension TOLERANCES: UNLESS OTHERWISE SPECIFIED:
0.25
.XX: 0.025
.XXX: 0.013
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NOTE parts manufactured accordance with this specification. other conditions specifications which required this specification, please contact ABRACON more information. ABRACON will supply parts accordance with this specification unless receive written request modify prior order placement. case shall ABRACON liable product failure from appropriate handling operation item beyond scope this specification. When changing your production process, please notify ABRACON immediately. intend product listed application which possibly cause loss life assets, please notify ABRACON advance. (For example, Medical, Aerospace, Aeronautic equipment, Safety control equipment well safety related.) specifications Marking will subject change without notice. ABRACON website (www.abracon.com) additional Terms Conditions.

ABRACON MICRF Chip ABLS-6.7458MHz-20-R60-D ABLS-13.560MHz-10-R20-D ABL

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