0.200 (5.08) 0.180 (4.57) MV8B01 0.040 (1.02) 0.350 (8.

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

0.200 (5.08) 0.180 (4.57) MV8B01 0.040 (1.02) 0.350 (8.

Datasheet Thumbnail

Top Searches for this datasheet

Blue
0.200 (5.08) 0.180 (4.57)
MV8B01
0.040 (1.02)
0.350 (8.89) 0.330 (8.38)
1.00 (25.4)
0.023 (0.58) 0.017 (0.43) TYP. (2X) 0.100 (2.54) 0.230 (5.84)
0.050 (1.27)
FLAT DENOTES CATHODE
NOTES: Dimensions drawings inches (mm). Lead spacing measured where leads emerge from package. Protruded resin under flange 1.5mm (0.059") max.
DESCRIPTION
This super bright moderate viewing angle concentrated light output. made with GaN/SiC technology that emits blue light encapsulated water clear epoxy lens package.
FEATURES
Popular package Solid state reliability Water clear optics Standard mil. lead spacing
2003 Fairchild Semiconductor Corporation
Page
10/31/03
Blue
ABSOLUTE MAXIMUM RATINGS 25°C unless otherwise specified)
Parameter Operating Temperature Storage Temperature Lead Soldering Time Continuous Forward Current Peak Forward Current KHz, Duty Factor 1/10) Reverse Voltage Power Dissipation Symbol TOPR TSTG TSOL Rating +100 Unit
MV8B01
ELECTRICAL OPTICAL CHARACTERISTICS =25°C)
Part Number Luminous Intensity (mcd) Minimum Typical Forward Voltage Typical Maximum Wavelength (nm) Peak Dominant Spectral Line Half Width (nm) Viewing Angle MV8B01A Condition
2003 Fairchild Semiconductor Corporation
Page
10/31/03
Blue
TYPICAL PERFORMANCE CURVES
Fig. Forward Current Forward Voltage
1.25
MV8B01
Fig. Relative Luminous Intensity Forward Current
RELATIVE LUMNOUS INTENSITY (NORMALIZED
FORWARD CURRENT (mA)
0.75
0.25
FORWARD VOLTAGE
FORWARD CURRENT (mA)
Fig. Relative Intensity Wavelength
RELATIVE INTENSITY
WAVELENGTH (nm)
Fig. Radiation Diagram
Fig. Maximum Forward Current Ambient Temperature
RELATIVE RADIANT INTENSITY
FORWARD CURRENT (mA)
RADIATION DIAGRAM
AMBIENT TEMPERATURE (°C)
2003 Fairchild Semiconductor Corporation
Page
10/31/03
Blue MV8B01
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL PRESIDENT FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body, support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user. critical component component life support device system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness.
2003 Fairchild Semiconductor Corporation
Page
10/31/03

0.200 (5.08) 0.180 (4.57) MV8B01 0.040 (1.02) 0.350 (8.

Top Searches for this datasheet

Other recent searches