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Agilent HMPS-282x Series MiniPak Schottky Diode
Reliability Data Sheet
Introduction following data gathered from product qualification stress tests HMPS-282x series. reliability HMPS-2822, HMPS-2825 cross referenced HMPS-2820 based similarity wafer fabrication process package assembly. product subjected severe environmental conditions electrical stress meet minimum reliability expectations today's requirement. Reliability Prediction Model exponential cumulative failure function (constant failure rate) used reliability prediction model predict failure rate mean time failure (MTTF) various temperatures shown Table wearout mechanisms therefore
considered. Arrhenius temperature de-rating equation used. Agilent assumes failure mechanism change between stress conditions. Bias temperature alterable stresses must considered with thermal resistance devices when determining stress condition. failure rate
will have direct relationship life stress. process tested determine activation energy 1.33 Confidence intervals based upon chi-squared prediction method associated with exponential distribution.
Table Life Tests Demonstrated Performance. Test Name Stress Test Condition 150°C Bias Total Units Tested Total Device Hours 43,680 Failed Units
High Temperature Operating Life
Table Estimates various channel temperatures follows. Channel Temp. (°C)[2] Point Typical Performance MTTF hours[1] 4.36 4.32 5.81 3.29 Confidence MTTF hours 1.89 1.87 2.52 1.43 Point Typical Performance 22935.7 2314.8 172.1 30.4 Confidence 52910.1 5347.6 396.8 69.9
Point MTTF simply total device hours divided number failures. However, cases which failures Thermal Resistance:
observed, point estimate calculated under assumption that unit failed. 300°C/W
Table Product Qualification Operational Life Test Results. Stress High Temperature Operating Life (HTOL) WHTOL Conditions with junction temperature 150°C Avg. Power 85°C/85% Duration hours Failures/ number tested 0/130
hours
0/130
Table Product Qualification Environment Stress Results. Stress TMCL Conditions -65/150°C, minutes dwell Duration cycles Failures/ number tested 0/273
Table Electrostatic Discharge (ESD) test results. Test Human Body Model Machine Model Class voltage level <240 Class voltage level between Class voltage level between 1000 Class voltage level between 1000 2000 Class voltage level between 2000 4000 Class voltage level between 4000 8000 Class voltage level >8000 Class voltage level <200 Class voltage level between Class voltage level Reference: EIA/JESD22-A114-B EIA/JESD22-A115-A Note: device classified sensitive, precaution taken follows: Ensure Faraday cage conductive shield used when device transported from destination another. assembly station, static charge above device sensitivity level, place ionizer near device charge neutralization purpose. Personal grounding worn times when handling device. Results exceed (Class exceed (Class Moisture Sensitivity Classification: Class Preconditioning JESD22A113-A class performed devices prior reliability testing. Flammability Rating: Class 94V-0
www.semiconductor.agilent.com Data subject change. Copyright 2001 Agilent Technologies, Inc. October 2001 5988-4477EN

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