THREE PHASE MOTOR DRIVER SUPPLY VOLTAGE FROM PEAK CURRENT VALUE 2
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L6234
THREE PHASE MOTOR DRIVER
SUPPLY VOLTAGE FROM PEAK CURRENT VALUE 25°C CROSS CONDUCTION PROTECTION COMPATIBLE DRIVER OPERATING FREQUENCY 50KHz THERMAL SHUTDOWN INTRINSIC FAST FREE WHEELING DIODES INPUT ENABLE FUNCTION EVERY HALF BRIDGE EXTERNAL REFERENCE AVAILABLE UNDERVOLTAGE LOCKOUT DESCRIPTION L6234 triple half bridge drive brushless motor. realized Multipower technology wich combines isolated DMOS power transistors with CMOS Bipolar circuits same chip. using mixed technology been possible optimize logic circuitry power stage achieve best possible performances. output DMOS transistors sustain very high current fact that DMOS structure affected second breakdown efPIN CONNECTION (Top view)
POWER (16+2+2)
PowerSO20 (Jedec MO-166)
ORDERING NUMERS: L6234 (POWER 16+2+2) L6234PD (PowerSO20)
fect, maximum maximum current practically limited dissipation capabilies package. logic inputs TTL, CMOS compatible. Each channel controlled separate logic input. L6234 available POWER package (16+2+2) PowerSO20.
SENSE OUT2 OUT1
D94IN129
SENSE VBOOT VREF OUT3
POWER (16+2+2)
PowerSO20
January 1996
This advanced information product development undergoing evaluation. Details subject change without notice.
L6234
BLOCK DIAGRAM
0.22µF 10nF CHARGE PUMP VREF VBOOT 1N4148
0.1µF OUT1 100µF
OUT2
THERMAL PROTECTION
SENSE1 OUT3
SENSE2
D95IN309
L6234
THERMAL DATA
Symbol j-pin j-amb1 j-amb2 j-case Parameter Thermal Resistance, Junction Thermal Resistance, Junction Ambient (see Thermal Characteristics) Thermal Resistance, Junction Ambient (see Thermal Characteristics) Thermal Residance Junction-case DIP16+2+2 PowerSO20 Unit °C/W °C/W °C/W °C/W
THERMAL CHARACTERISTICS j-pins DIP16+2+2. thermal resistance referred thermal path from dissipating region surface silicon chip, points along four central pins package, distance away from stand-offs. j-amb1 dissipating surface, thick least with surface similar bigger than shown, created making printed circuit. Such heatsinking surface considered bottom side horizontal (worst case). j-amb2 power dissipating pins (the four central
ones), well others, have minimum thermal connection with external world (very thin strips only) that dissipation takes place through still through itself. same situation point above, without heatsinking surface created purpose board. Additional data PowerDip PowerSO20 package found Application Note AN467: Thermal Characteristics PowerDip 20,24 Packages Soldered 1,2,3 Copper Application Note AN668: High Power Surface Mount Package: PowerSO20 Power Packaging from Insertion Surface Mounting.
Figure Printed Heatsink
L6234
ABSOLUTE MAXIMUM RATINGS
Symbol VIN,VEN Ipeak VSENSE Ptot Ptot Tstg, Power Supply Voltage Input Enable Voltage Pulsed Output Current (note) Sensing Voltage Bootstrap Peak Voltage Differential Output Voltage (between pins) Total Power Dissipation Total Power Dissipation L6234D Tpins 90°C L6234D Tamb 70°C Parameter Value Unit
Storage Junction Temperature Range
Note Pulse width limited only junction temperature transient thermal impedance Mounted board with minimized copper area
FUNCTIONS
DIP/SO 14,17 15,16 PowerSO-20 2,19 1,10 11,20 Name SENSE Vref VBOOT Output channels 1/2/3. Function
Logic input channels 1/2/3. logic HIGH level (when corresponding HIGH) switches upper DMOS Power Transistor, while logic switches corresponding side DMOS Power. Enable channels 1/2/3. logic level this switches both power DMOS related channel. Power Supply Voltage. resistance Rsense connected this provides feedback motor current control (the pins must connected together). Internal Voltage Reference. capacitor connected from this increases stability Power DMOS drive circuit. Bootstrap Oscillator. Oscillator output external charge pump. Overvoltage input drive upper DMOS Common Ground Terminal. Powerdip packages these pins used dissipate heat forward PCB.
L6234
ELECTRICAL CHARACTERISTICS 25°C unless otherwise specified)
Symbol Vref Parameter Supply Voltage Reference Voltage Quiescent Supply Current Commutation Frequency Thermal Shutdown Dead Time Protection Under Voltage Upper Threshold Under Voltage Lower Threshold Test Condition Min. Typ. Max. Unit
OUTPUT DMOS TRANSISTOR
Symbol IDSS (ON) Vsense Parameter Leakage Current Resistance Sensing Voltage Test Condition Min. Typ. Max. Unit
SOURCE DRAIN DIODE
Symbol Parameter Forward Voltage Reverse Recovery Time Forward Recovery Time Test Condition 1.2A; 1.2A Min. Typ. Max. Unit
LOGIC LEVELS
Symbol VINL, VENL VINH, VENH IINL, IENL IINH, IENH Parameter Input Voltage Input HIGH Voltage Input Current Input HIGH Current VIN,VEN VIN,VEN Test Condition Min. -0.3 Typ. Max. Unit
CIRCUIT DESCRIPTION L6234 triple half bridge designed drive brushless motors. Each half bridge power DMOS transistors with RdsON 0.3. half bridges controlled independently means inputs IN1, IN2, inputs EN1, EN2,
EN3. external connection common side DMOS sources provided connect sensing resistor constant current chopping application. driving stage logic stage designed work from 52V.
L6234
Figure PowerSO-20 Transient Thermal Resistance Figure PowerSO-20 Thermal Resistance (Mounted Aluminium substrate)
Figure PowerSO-20 Thermal Resistance (Mounted monolayer substrate)
Figure PowerSO-20: with external heatsink
Figure Thermal Impedance PowerSO-20 standard SO20
L6234
PowerSO-20 PACKAGE MECHANICAL DATA
DIM. MIN. 10.0 0.80 10.90 0.40 0.23 15.80 13.90 1.27 11.43 11.10 2.90 0.10 1.10 1.10 0.0314 (max.) (max.) 0.3937 0.4291 0.10 TYP. MAX. 3.60 0.30 3.30 0.10 0.53 0.32 16.00 14.50 0.0157 0.009 0.6220 0.5472 0.050 0.450 0.437 0.1141 0.0039 0.0433 0.0433 0.0039 MIN. inch TYP. MAX. 0.1417 0.0118 0.1299 0.0039 0.0209 0.0126 0.6299 0.570
include mold flash protrusions Mold flash protrusions shall exceed 0.15mm (0.006")
DETAILB
DETAIL
lead
DETAIL
DETAIL
Gage Plan 0.35
slug
SEATING PLANE (COPLANARITY)
PSO20MEC
L6234
POWERDIP PACKAGE MECHANICAL DATA
DIM. MIN. 3.30 1.27 8.80 2.54 22.86 7.10 5.10 0.130 0.050 0.38 0.51 0.85 0.50 0.50 24.80 0.346 0.100 0.900 0.280 0.201 0.015 1.40 TYP. MAX. MIN. 0.020 0.033 0.020 0.020 0.976 0.055 inch TYP. MAX.
L6234
Information furnished believed accurate reliable. However, SGS-THOMSON Microelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights SGS-THOMSON Microelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. SGS-THOMSON Microelectronics products authorized critical components life support devices systems without express written approval SGS-THOMSON Microelectronics. 1996 SGS-THOMSON Microelectronics Rights Reserved SGS-THOMSON Microelectronics GROUP COMPANIES Australia Brazil France Germany Hong Kong Italy Japan Korea Malaysia Malta Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thaliand United Kingdom U.S.A.
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