13.1 Introduction Intel microprocessors become faster, more compl

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Pinned Packaging
13.1 Introduction
Intel microprocessors become faster, more complex more powerful, demand package performance increases. Improvements microprocessor speed functionality drive package design improvements electrical, thermal mechanical performance. Package electrical thermal characteristics become attributes component performance along with mechanical protection offered package. meet these requirements, Intel introduced variety innovative package designs. development plastic grid array (PPGA) package, PPGA2, Flip Chip Grid Array (FC-PGA) have provided improvement path enhanced power distribution improved thermal electrical performance. While each consists organic package materials, primary differences within package that PPGA utilizes wirebond interconnect technology while FC-PGA utilizes Flip Chip Interconnect. Externally, PPGA thermal interface will made integral package heat slug while FC-PGA thermal interface will made directly backside. PPGA FC-PGA both socket compatible.Table 13-1 summarizes attributes PPGA package. following sections detail physical structure, electrical modeling performance attributes PPGA package. Table 13-1. PPGA Package Attributes
PPGA Attributes Physical Appearance Package Body Material Body Thickness Weight Package Trace Metal External Heat Slug External Capacitors Performance Thermal (jc) with Heat Sink Power Distribution Package Trace Propagation Delay Others Thermal Interface Used Heat Sink Attachment Board Mount Thermally conductive electrically non-conductive grease, phase-change material, film, tape PPGA socket 0.30 0.50 °C/W traces multiple planes enhance distribution traces have resistance reduce delay Circuit board, exposed pins laminate, plated heat slug, epoxy encapsulant, bond wires (overall, includes heat slug) grams Copper
Caution: PPGA packages, electrically conductive surfaces should touch part processor except heatslug. example, electrically conductive heat sink should contact exposed pins, external capacitors, exposed metal side package.
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Table 13-2. FC-PGA Package Attributes
FC-PGA Attributes Physical Appearance Package Body Material Body Thickness Weight Package Trace Material External Heat Slug External Capacitors Resistors Performance Thermal (js) with Heat Sink Power Distribution Package Trace Propagation Delay Other Thermal Grease Used Heat Sink Attachment Board Mount Thermally conductive electrically non-conductive Socket only FCPGA packages, electrically conductive surfaces should touch part processor except die. example, electrically conductive heat sink should contact exposed pins, external capacitors, exposed metal side package. °C/W (12-15 lbf. Clip force) traces multiple planes enhance distribution traces have resistance reduce delay Circuit board exposed pins, chip components, Fiber-reinforced resin substrate, epoxy underfill, Au/Niplated Kovar pins 3.18 pins substrate 0.83 (5.11 total) grams Copper (pin side only)
Warning:
Micro Grid Array (µPGA) latest innovative packaging approach, developed conveyance Organic Land Grid Array (OLGA) package technology CPUs thin light configuration mobile notebook computers. µPGA also known Interposer based package. interposer pinned FR-4 carrier which affords OLGA package surface mounted interposer future socketing OEMs. development interposed package result from OEM's requirement manufacturing alternative allowing flexibility selecting whether surface mount OLGA socket onto motherboard final assembly. This High interposed package utilizes one, ball connectivity arrangement. Advantages this packaging technique, it's minimally larger surface area than OLGA itself, that attains height reduction over earlier Mobile Module used notebook computers. entry µPGA packaging technology continues commitment provide packaging solutions that meet Intel's rigorous criteria quality performance.
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Table 13-3 summarizes attributes PPGA package. following sections detail physical structure, electrical modeling performance attributes PPGA package. Table 13-3. µPGA Package Attributes
µPGA Lead Count Sq./Rect. Pitch (mm) Interposer Thickness (mm) nominal Socketable length (mm) nominal Weight (grams) Max. Footprint (mm) nominal Shipping Media Trays Desiccant Comments/Footnotes NOTE: Interposer size size dependent. Please contact Intel Technical support latest specifications 34.21 28.27w 37.51 35.56w 1.27 1.25 1.27 1.25
13.2
13.2.1
13.2.1.1
Packages Geometry Materials
PPGA
Package Materials
PPGA package body piece part pinned laminated printed circuit board (PCB) structure. Figure 13-1 illustrates cross section typical PPGA piece part. dielectric material, which chosen high temperature stability, glass reinforced high glass transition temperature (Tg) Bismaleimide Triazine (BT) with ranging from 170° 190° Conductors copper traces. bondability copper (Cu) bond fingers plated with gold (Au) over nickel (Ni). heat slug plated copper, which gives high thermal dissipation. Kovar pins plated with over surrounded solder after insertion into substrate.
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Figure 13-1. Cross Section View PPGA Package
13.2.1.2
Package Outline Drawings
PPGA package Figure 13-2 includes nickel plated copper heatslug eight discrete capacitors. capacitors optional feature used decouple power ground supplies enhance performance packaged device. Figure 13-2. View PPGA Package
Signal Signal Power Copper Slug
Kovar Pins
Solder Reset Core
Copper Preg Slug Adhesive
Chip Solder Solder
A5769-01
A5770-01
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Figure 13-3, Table 13-4 Table 13-5 illustrate package outline drawings dimensions lead PPGA package. package meets JEDEC outline spec MO-128 count package size. package square 1.95 inches side total thickness. index corner chamfer. Table 13-4. PPGA Package Drawing Definitions
Symbol Description Dimensions Package Body Thickness Including Heat Slug Package Body Thickness Heat Slug Thickness Diameter Package Body Dimension Field Width Heat Slug Width Heat Slug Center Package Edge Pitch Outer Chip Heat Slug Center Package Edge Inner Chip Heat Slug Center Package Edge Length Lead Count Outer Center Package Edge
Figure 13-3. Principal Dimensions
Seating Plane
Solder Resist Chip Capacitor
1.65 (Ref)
2.29 1.52 Chamfer (Index Corner)
Heat Slug
measurements
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Table 13-5. PPGA Package Dimensions Tolerances
Family: Plastic Grid Array Package Lead Symbol Minimum
NOTES: Typical Typical Typical
Millimeters Maximum 3.33 2.23 1.00 0.40 49.43 45.59 23.44 24.765 2.29 17.56 23.04 3.05 3.30 1.52 2.54 0.060 0.120 2.79 0.090 0.51 49.63 45.85 23.95 0.016 1.946 1.795 0.923 Minimum 0.107 0.072
Inches Maximum 0.131 0.088 0.039 0.020 1.954 1.805 0.943 0.975 0.110 0.692 0.907 0.130
2.72 1.83
0.100
Table 13-6. PPGA Package Dimensions Tolerances
Family: Plastic Grid Array Package Lead Symbol Minimum 1.52 2.54 3.05 2.29 17.56 23.04 3.30 0.060 0.100 0.120 0.40 49.43 45.59 25.15 23.495 2.79 0.090 0.692 0.907 0.130 2.72 1.83 1.00 0.51 49.63 45.85 25.65 0.016 1.946 1.795 0.990 0.925 0.110 Millimeters Maximum 3.33 2.23 Minimum 0.107 0.072 0.039 0.020 1.954 1.805 1.010 Inches Maximum 0.131 0.088
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Table 13-6. PPGA Package Dimensions Tolerances
NOTES: Typical Typical Typical
13.2.2
13.2.2.1
FC-PGA
Package Materials Geometry
FC-PGA package body piece part pinned, laminated printed circuit board (PCB) structure. Figure 13-4 illustrates cross section typical FCPGA piece part. circuit board laminate dielectric materials: glass-reinforced high glass transition temperature (Tg) core with ranging from outer layers composed non-reinforced resin. Conductors copper traces. Kovar pins plated with over attached substrate with high-temperature solder.
Figure 13-4. Cross Section View FC-PGA Package
FIBER-REINFORCED RESIN NON-REINFORCED RESIN FILLER MATERIAL COPPER SOLDER RESIST EPOXY UNDERFILL SOLDER AU/NI-PLATED KOVAR CHIP
A7646-01
13.2.2.2
Package Outline Drawings
FCPGA package include combination discrete capacitors resistors. capacitors optional feature used decouple power ground supplies enhance performance packaged device. resistors have variety uses. discrete components located within designated component keepin zone side package.
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Figure 13-5. Top/bottom View FCPGA Package
A7647-01
Figure 13-6, Table 13-7 Table 13-8 illustrate package outline drawings dimensions lead FCPGA package. package meets JEDEC outline spec MO-128 count package size. package nominally 1.95 inches (49.53 each side .076 inches (1.93 total thickness (not including pins). There chamfered corner this package, indicated gold triangle. Table 13-7. FC-PGA Drawing Symbol Definitions
Symbol Description Dimensions Height (including bumps) Substrate Thickness Length (x-direction) Length (y-direction) Epoxy Underfill Length (x-direction) Epoxy Underfill Length (y-direction) Package Body Length Field Width Passive Components Keepin Zone Length (x-direction) Passive Components Keepin Zone Length (y-direction) Passive Components Keepin Zone Height Pitch Length Diameter True Position Tolerance
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Figure 13-6. FC-PGA principal dimensions
Bottom View
View
Capacitor Placement Area
Underfill Area
Side View
Seating Plane
A7648-01
Table 13-8. FC-PGA Package Dimensions
Family: Flip Chip Grid Array Package Symbol Minimum 3.048 0.431 49.428 45.466 0.000 0.000 0.000 2.540 nominal 3.302 0.483 .120 .017 0.787 1.000 19.838 19.838 30.480 35.560 49.632 45.974 17.780 17.780 0.889 1.946 1.790 .100 nominal .130 .019 Millimeters Maximum 0.889 1.200 Minimum .031 .039 .781 .781 1.200 1.400 1.954 1.810 .700 .700 .035 Inches Maximum .035 .047
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13.2.3
13.2.3.1
µPGA
Package Materials Geometry
interposer OLGA carrier, consists double-sided side) copper clad, glass based, epoxy resin impregnated FR-4 laminate. This substrate utilizes copper alloy Kovar pins, reflowed into array plated through holes within substrate. Because material likeness between OLGA package Interposer, assembled package exhibits improved coefficient thermal expansion (CTE) compliant package properties assembled application. interposer specific OLGA land pattern .024" (0.609mm) diameter metal defined lands .050" (1.27mm) pitch. correspondingly accommodates .050" (1.27mm) pitch offset pattern lands. This land pattern offset .025" (0.635mm) directions relation OLGA land pattern. lands land pairs connected each other with .010" (0.254mm) wide trace. Figure 13-7 illustrates this concept.
Figure 13-7. Spacing land offsett .050" (1.27mm) pitch
.035
.050 .025
.031" Land
.025 .025 .025
.0078
.024" Land
.019 .050
A7190-01
base material copper alloy (C19400) Kovar, chosen because excellent electrical characteristics resistance bending. During manufacturing, wire extruded through series progressive dies arrive configuration. sharp edges broken .002" (0.050mm) typical, plated with microinches minimum, nickel then overplated with microinches, minimum gold ensure like metal contact with socket contacts. This configuration specifically developed thin light mobile application. configuration used with interposer interposers contour shoulder type. This configuration illustrated Figure 13-8.
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These pins nominally .012" (0.304mm) diameter, have .010" (0.254mm) maximum thick .024 (0.609mm) nominal, diameter shoulder. socketable area pin, defined, from bottom side interposer which nominally, .049" (1.25mm) length. This includes .010" (0.254mm) high .030" (0.965mm) diameter zone which accommodates shoulder solder fillet area when inserted into socket. After pins fixtured, solder used reflow pins into interposer. solder height maintained .002" (0.050mm) maximum, above land array pins ensure interference with solderpaste stencil during solder application prior OLGA assembly. Figure 13-8. µPGA Configuration
Soldermask Opening .024" .031" Land Diameter
.014" .002/ -.001 dia. Finished Hole
.002" Solder Protrusion
.010" Thick Zone Includes Solder
.041" Land Diameter Soldermask Opening .030" .049" Insertable Length
.030" dia. zone includes solder
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13.2.3.2
Package Outline Drawings
Interposer configuration dependent upon OLGA package used. This section will indicate reference package dimensions both Interposer applications.
Table 13-9. µPGA Drawing Symbol Definitions
Letter Symbol Description Dimensions Interposer Height Including Insertable Length Interposer Substrate Thickness Insertable Length Diameter Pitch Interposer Width Direction Width Array Interposer Length Direction Length Array Distance First Edge Direction Distance First Column Edge Direction OLGA Pattern Center Distance Interposer Edge Direction OLGA Pattern Center Distance Interposer Edge Direction Fiducial Fiducial Distance Direction Fiducial Fiducial Distance Direction Fiducial Interposer Edge Distance Direction Fiducial Interposer Edge Distance Direction
Figure 13-9. µPGA Principle Dimensions
OLGA Offset Interposer
Seating Plane
A7191-01
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Table 13-10. µPGA Dimensions
Inches Symbol Count Interposer Height Substrate Thickness Socketable length Diameter Pitch Interposer Width Array Width Interposer Length Array Length edge distance along edge distance along OLGA center Offset Interposer edge OLGA center Offset Interposer edge Fiducial Distance Fiducial Distance Fiducial edge distance along Fiducial edge distance along -.033 .047 -1.276 -1.441 -Min .088 .039 .049 .012 .050 1.282 1.200 1.447 1.300 .077 .086 .641 .723 1.369 1.075 .038 .105 -.045 .051 .014 -1.288 -1.453 -0.85 1.19 -32.41 -36.60 -Max Notes Millimeters 2.23 1.00 1.25 0.30 1.27 35.56 30.48 36.75 33.02 1.95 2.18 16.28 18.36 34.77 27.30 0.96 2.66 -1.15 1.31 0.36 -32.71 -36.90 -Max
NOTES: Package dimensions reference only. product drawings specific dimensions.
offset OLGA pattern center offset pattern center direction .013 inches (0.33mm). offset OLGA pattern center offset pattern center direction .010 inches (0.25mm).
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Figure 13-10. µPGA Principle Dimensions
OLGA Offset Interposer
Seating Plane
A7192-01
Table 13-11. µPGA Dimensions
Inches Symbol Count Interposer Height Substrate Thickness Socketable length Diameter Pitch Interposer Width Array Width Interposer Length Array Length edge distance along edge distance along OLGA center Offset Interposer edge OLGA center Offset Interposer edge Fiducial Distance Fiducial Distance Fiducial edge distance along -.033 .047 -1.107 -1.341 -Min .088 .039 .049 .012 .050 1.113 1.000 1.347 1.150 .067 .086 .674 .557 1.270 .925 .038 -.045 .051 .014 -1.119 -1.353 -0.85 1.19 -28.17 -34.06 -Max Notes Millimeters 2.23 1.00 1.25 0.30 1.27 28.27 25.40 34.21 29.21 1.70 2.18 17.11 14.14 32.25 23.49 0.96 -1.15 1.31 0.36 -28.37 -34.36 -Max
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Table 13-11. µPGA Dimensions
Fiducial edge distance along -.096 -2.66
NOTES: Package dimensions reference only. product drawings specific dimensions.
offset OLGA pattern center offset pattern center direction .012 inches (0.30mm). offset OLGA pattern center offset pattern center direction .010 inches (0.25mm).
13.3
Applications
Both PPGA FC-PGA package been developed Intel's advanced microprocessor family products. They have been designed socketed applications, using socket footprints which compatible with Intel ceramic Grid Array package family. While PPGA package used both Zero Insertion Force sockets (ZIF/LIF), FC-PGA should only used socket application.
13.4
13.4.1
Component Assembly Process
PPGA Component Assembly
PPGA assembly process flow similar CPGA process flow with exception seal operation. preparation attach, wafers mounted pressure sensitive carrier tape diced with high speed saw. wafer washed with detergent solution remove silicon dust. silver filled epoxy adhesive applied package substrate attach. Dice picked from wafer placed adhesive. adhesive then cured. connected gold plated package leads gold wedge wire bond technology. Bond package lead placement accuracy wire pull strength monitors ensure high integrity connections. PPGA packages encapsulated with silica filled liquid epoxy contrast CPGA seal process. encapsulant provides mechanical environmental protection wires. Process trays moved beneath valve which fills package cavity with epoxy transferred in-line oven which epoxy cured. matrix code containing assembly date code information marked side package using laser. mark inspected orientation readability. packages then ready testing, finishing packing processes.
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Figure 13-11. PPGA Generic Process Flow
Wafer Mount Wafer Wash Attach Wire Bond Encapsulation Cure Side Serial Laser Mark Test Mark Pack
A5772-01
13.4.2
FC-PGA Component Assembly
FCPGA assembly process flow similar OLGA process flow without ball attach ball inspection steps with addition inspection step. preparation chip attach, wafer reflow process modify shape surface composition Pb/Sn bumps from as-plated state acceptable chip join. wafers then mounted pressure sensitive carrier tape diced with high speed saw. wafer washed with detergent solution remove silicon dust. picked from wafer mounted package. units then reflowed furnace form solder joints package. FCPGA units then pre-baked oven remove moisture from organic package before epoxy underfill materials dispensed. liquid capillary flow pull underfill materials fill gaps around solder joints between package. epoxy underfill materials then cured oven. units then ready testing finishing process. finishing process includs laser marking human readable product/assembly/test information along with inspection, final visual inspection pack.
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Figure 13-12. FC-PGA Generic Process Flow
Wafer Reflow
Wafer Mount
Deflux
Wafer
Prebake
Test
Chip Attach
Underfill Dispense
Laser Mark
Chip Join
Underfill Cure
Inspection
Packing
A7677-01
13.5
13.5.1
13.5.1.1
Package Usage
PPGA Package
PPGA Package Shipping Media
PPGA shipping trays compliant JEDEC standards. external dimensions PPGA tray same CPGA tray. There slight difference distance from tray seating plane PPGA shipping tray compared CPGA shipping tray. PPGA shipping tray pocket smaller y-axes. This slightly smaller pocket dimension reduces package free-play tray. Refer Chapter dimensions PPGA shipping tray. PPGAs shipped uniquely colored trays separately from CPGAs. This enables manufacturing personnel readily identify which package type being placed into manufacture time. This shipping media minimizes foreign material meets safe shipping requirements.
13.5.1.2
PPGA Moisture Sensitivity
PPGA packages have been designed socketed applications. They neither shipped moisture barrier bags, floor life exposure time tracking needed socketed applications. maximum body temperature which component should 150° component neither intended direct through-hole mounting wave solder processing exposing entire package body surface mount-like reflow profiles. Such thermal profiles recommended PPGA packages.
13.5.1.3
PPGA Socketing
Intel recommends that when performing insertion extraction, maximum force should exceed lbs., should applied uniformly. insertion extraction tool should take into account clearance external capacitors heat slug. PPGA packages used either insertion force (LIF) zero insertion force (ZIF) sockets. lead sockets available PPGA packaged components from many suppliers. socket design standard footprint PCB. Insertion extraction forces were measured sockets from various vendors. socket designs tested, maximum insertion force
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required lbs. Avoid uneven loading during insertion. applied load overcomes frictional resistance applied package pins they inserted into socket. Table 13-12 summarizes average measured insertion extraction force different sockets. Table 13-12. PPGA Insertion/Extraction Force Measurement
Socket1 Preci-Con Mill-Max Robinson Nugent Andon Yamaichi ZIFs Average Insertion Force (LB) 44.69 38.09 78.35 65.06 54.26 Average Extraction Force (LB) 57.43 49.65 73.51 69.91 58.58 80.942
NOTES: This data does constitute recommendation specific supplier part number. This measured when lever actuated ensure that package will pulled during shock vibration test. When lever extraction force "zero".
manufacturing flow requires inserting package after heat sink applied component, then same suggested force applied uniformly across surface heatsink.
13.5.2
13.5.2.1
FC-PGA Package
FC-PGA package shipping media
FCPGA shipping trays JEDEC style thin thick configuration. external dimensions perimeter handling features FC-PGA tray same CO028 CO-029 registered standards. internal features compliant Intel Standard requirements. Density trays been optimized thus negates possibility automated empty-tray handling vacuum pickup features. currently true shipping trays, seating plane been adjusted accommodate these packages within bottom planes tray with appropriate head clearance. Pocket dimensions specific form factor, specified tray drawing, larger than previous form factors PLGA PPGA. Tray temperature rating non-SMT products will Intel approved temperature no-bake material. Shipping trays longer color coded particular product. Color standardization process type will result low-temperature no-bake trays meeting requirements drawing regardless form factor. Shipping trays will meet safe shipping requirements.
13.5.2.2 13.5.2.3
FC-PGA Moisture Sensitivity FC-PGA Socketing
FC-PGA packages zero insertion force (ZIF) lead sockets which available from many suppliers. Intel recommends that before performing insertion, package pins have manually aligned socket. After insertion, FC-PGA locked using single lever actuation socket. Avoid package walkout (package being pushed upward) during insertion cause unnecessary tilt heatsink assembly. Actuating force only require less than without lubricant. movement socket cover limited plane parallel motherboard.
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13.5.3
µPGA Package
interposer /OLGA package designed applications where socketability, height, footprint geometry weight high priority. Most importantly, interposer/OLGA affords OEMs option reflow either OLGA socket motherboard assembly. accomplish this objective, necessary have interposer land diameter equal that motherboard location. With this requirement, suggested that OEMs .024" diameter metal defined land motherboard design. general, .050" (1.27mm) pitch OLGA designs from Intel, require .024" metal defined solderable land diameter. exact diameter given OLGA package design should obtained from Intel prior start motherboard design ensure equivalent solderball height after reflow.
13.5.3.1
µPGA Package Shipping Media
OLGA Interposer assembly shipped temperature thin matrix tray that complies with JEDEC standards. This shipping media minimizes foreign material meets safe shipping requirements. Typically, JEDEC trays have same outer dimensions easily stacked storage manufacturing. tray dimensions please refer chapter this data book. JEDEC trays returnable Intel reuse. Chapter contains detailed information return addresses different types shipping trays.
13.5.3.2
µPGA Moisture Sensitivity
Most OLGA components sensitive moisture exposure before reflow temperature exposure. Maintaining proper control moisture uptake OLGA components critical.
13.5.3.3
OLGA µPGA Assembly
Pick place accuracy placement system governs package placement rotational (theta) alignment. Slightly miss-aligned parts (less than center land), will automatically self align during reflow solder surface tension properties. Grossly missaligned OLGA packages interposer lands (greater than center land) should removed prior reflow they develop electrical shorts result solder bridging) they subjected reflow.
13.5.3.4
µPGA Socketing
Intel recommends that when performing insertion extraction, maximum force should exceed pounds pressure surface, should applied uniformly.
13.6
Heat Sink Attachment
Intel recommends that when performing heatsink attach package supported only periphery (such shipping tray), maximum force should exceed lbs.
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13.6.1
Thermal Interface Material
ensure PPGA packages mechanically compatible with CPGA, comprehensive evaluation effective method heat sink attachment been performed. suggested that interface material used heat sink attachment should have thermal conductivity greater than W/mK, electrically non-conductive. volume resistivity material should greater than 1x106 Ohm-cm.
13.6.2
Clip Design Attach
minimum clip force five pounds recommended. Clips retain heat sink assembly socket exerting force heat sink socket. clip force, turn, aids forcing grease fill many microscopic peaks valleys heat sink package surface, thereby reducing interface thermal resistance. Since different clip forces result different amounts grease squeezed out, corresponding bond line thickness grease will affect thermal performance. effect foil sizes, clip force voiding Thermalcote Conductacoat* thermal performance also explored. there grease foil, then voiding will exist bond line. This results higher values. While grease voiding tolerated without impact PPGA thermal performance, zero voiding strongly recommended heat sink attachment methods. larger foil size will cover larger area with grease, smaller foil size preferred handling. example, thermal resistance measured with standard sized foil (1.0" 1.0") lower than measured with smaller foil (0.7" 0.7"). Note that foil carrier specific Thermalcote Conductacoat* grease volume manufacturing. decision foils should based OEMs particular heat sink attachment methods assembly line(s). Clip force determines thermal grease bond line thickness directly impacts thermal performance. determine effect clip force thermal performance, values heat sink assemblies were measured different clip forces. actual clip forces these modified clips were individually measured using Material Testing System (MTS) before thermal resistance measurement. clip forces were also verified using after thermal resistance measurement. Figure 13-13 shows values versus clip force. clip force higher than five pounds (corresponding psi), then there significant effect clip force PPGA thermal performance.
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Figure 13-13. Comparison Different Clip Forces
[C/W]
[C/W]
Clip Force [lb]
Clip Force [lb]
NOTES: Junction Ambient Case Sink Thermal Resistance (°CW)
A5562-01
13.6.3
Heat Sink Design
PPGA package affect some existing heat sink designs. design, shown Figure 13-14, heat sink designed CPGA package prevent movement heat sink relative package, socket clip during mechanical shock tests. However, PPGA package heatslug, external capacitors, exposed pins side package. PPGA package, heat sink slips secured position, touch exposed pins. Therefore, should extended proper length lock heat sink secured position. Intel's evaluations indicate that adequate that required ensure reliable performance during shock vibration testing. Tests also show that works well with CPGA packages. addition, side package electrically conductive. heat sink electrically conductive, touches side package, then electrical shorting occur, causing damage processor. addition, side package exposed metal that electrically conductive. heat sink electrically conductive, touches side package, then electrical shorting occur, causing damage processor. Manufacturers should work with their heat sink suppliers ensure that their heat sink designs accommodate both PPGA CPGA packages.
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Figure 13-14. Heat Sink Design with
Heat Sink Clip Socket PPGA Package Socket Lever Heat Sink
Board
A5773-01
13.6.4
Method PPGA Heatsink Attach
impact PPGA package board assembly studied assembling PPGA packages into sockets soldered boards. suggested sequence mounting PPGA packages With package socket, place Conductacoat foil package. process flow this step slightly different versus sockets. sockets grease foil placed before insertion into socket. sockets place thermal grease foil after inserted into socket. However, manufacturing controls when stacking CPU, thermal interface heat sink avoid foil misplacement PPGA slug. Place heat sink package hook heat sink clip onto socket.
Note:
Components top, exposed metal side PPGA package shorted electrically conductive material including heat sinks, thermal grease electrically conductive) thermal grease foil carriers.
13.7
13.7.1
PPGA Performance Characteristics
Thermal Characteristics
improve thermal performance, PPGA package uses high thermal conductivity heat slug. attached directly nickel plated copper heat slug, resulting lower thermal resistance than comparable ceramic version. effectively spreading heat flux, PPGA package able lower thermal resistance. data covered this section specific P54CS size only. However, trend advantage PPGA over CPGA identical different sizes. Similar advantages PPGA over CPGA expected other sizes. Based measurements components, Figure 13-15 demonstrates advantage PPGA over CPGA terms thermal resistance.
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Figure 13-15. PPGA Better Thermal Conduction Spreading
CPGA
PPGA
Large
Small
PPGA Thermal Benefits Improvements) More Pronounced When: Absolute Power Higher.Because Lower Thermal Size Smaller.Better Spreading Concentrated Heat Flux
A5774-01
PPGA about 1.1° lower than that CPGA. Table 13-13 Table 13-18 detail thermal resistance values components ceramic grid array plastic grid array packages. Table 13-13. [°C/W] Different Heat Sink Heights Flow Rates (CPGA) [oC/W] Flow Rate [LFM]
Heat Sink Height 0.25" 0.35" 0.45" 0.55" 0.65" 0.80" 1.00" 1.20" 1.40" 1.50" None
NOTE:
14.5
13.8
12.6
10.5
case-to-ambient thermal resistance. values shown this table typical values. actual values
depend heat sink design, interface between heat sink package, flow system, thermal interactions between surrounding components through ambient.
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Table 13-14. [°C/W] CPGA Package with without Heat Sink (CPGA)
Heat Sink Average With Heat Sink 1.25
Table 13-15. [°C/W] Different Heat Sink Heights Flow Rates (CPGA) [oC/W] Flow Rate [LFM]
Heat Sink Height 0.25" 0.35" 0.45" 0.55" 0.65" 0.80" 1.00" 1.20" 1.40" 1.50" None 10.6 10.3 16.2 15.5 14.3 12.2 10.3
Table 13-16. [°C/W] Different Heat Sink Heights Flow Rates (PPGA) [oC/W] Flow Rate [LFM]
Heat Sink Height 0.25" 0.35" 0.45" 0.55" 0.65" 0.80" 1.00" 1.20" 1.40" 1.50" None 13.0 12.3 11.4
NOTE: case-to-ambient thermal resistance. values shown this table typical values. actual values depend heat sink design, interface between heat sink package, flow system, thermal interactions between surrounding components through ambient.
Table 13-17.
[°C/W] PPGA CPGA Package with without Heat Sink (PPGA)
Heat Sink Average With Heat Sink 0.50
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Table 13-18.
[°C/W] Different Heat Sink Heights Flow Rates (PPGA)
[oC/W] Flow Rate [LFM]
14.3 13.6 12.7
Heat Sink Height 0.25" 0.35" 0.45" 0.55" 0.65" 0.80" 1.00" 1.20" 1.40" 1.50" None
13.8
Electrical Characteristics
Electrical characteristic discussed below. more indepth coverage electrical information please refer Chapter Performance Characteristics Packages.
13.8.1
Buffer
package model components PPGA packages shown Figure 13-16 first order buffer model. values independent package. package inductance includes bond wire inductance, trace inductance, inductance socket inductance. package capacitance consists primarily trace capacitance socket capacitance. this model, effective inductance used bond wire. Both self mutual inductance taken into account. socket considered single entity typical inductance value used. typical value used socket capacitance.
Figure 13-16. First Order Buffer Model PPGA
dV/dt
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13.8.2
Signal Quality
Intel performed noise measurements components both CPGA PPGA packages. results show that component level, PPGA packages comparable CPGA packages. addition, results indicate that PPGA parts have higher mean-core-power supply level than CPGA parts.
13.8.3
Federal Communications Commission (FCC) limits maximum radiation from electrical systems. Each component system should exceed level that allocated Electromagnetic Interference (EMI) levels from components CPGA PPGA packages have been measured with without heat sinks attached. Measurements were performed core clock frequency MHz. levels well below critical levels clock speeds tested. There significant performance difference between CPGA PPGA.
13.9
Revision History
Added µPGA Added FC-PGA General review chapter with modifications
13-26
2000 Packaging Databook

13.1 Introduction Intel microprocessors become faster, more compl

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