98-04-16 99-11-16 Raymond Monnin Raymond Monnin SHEET SHEET

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98-04-16 99-11-16 Raymond Monnin Raymond Monnin SHEET SHEET

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REVISIONS DESCRIPTION Updated boilerplate. Added device types Moved endurance data retention testing requirements from Section drawing Section drawing. Editorial changes throughout. Updated boilerplate. Added vendor CAGE 01295 source supply. Editorial changes throughout. Changed standoff width package. Added vendor CAGE 0EU86 source supply. DATE (YR-MO-DA) 94-03-25 APPROVED Frye
98-04-16 99-11-16
Raymond Monnin Raymond Monnin
SHEET SHEET STATUS SHEETS SHEET
PREPARED Gary Gross
PMIC
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE
CHECKED Monnin
APPROVED Michael Frye
MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128K FLASH EEPROM, MONOLITHIC SILICON
DRAWING APPROVAL DATE 92-08-31 SIZE REVISION LEVEL CAGE CODE
AMSC
SHEET
67268
5962-90899
DSCC FORM 2233 DISTRIBUTION STATEMENT Approved public release; distribution unlimited.
5962-E050-00
SCOPE Scope. This drawing documents product assurance class levels consisting high reliability (device classes space application (device class choice case outlines lead finishes available reflected Part Identifying Number (PIN). When available, choice Radiation Hardness Assurance (RHA) levels reflected PIN. PIN. shall shown following example: 5962
90899
Federal stock class designator
designator (See 1.2.1)
Device type (See 1.2.2)
Device class designator (See 1.2.3)
Case outline (See 1.2.4)
Lead finish (See 1.2.5)
Drawing number 1.2.1 designator. Device classes marked devices meet MIL-PRF-38535 specified levels marked with appropriate designator. Device class marked devices meet MIL-PRF-38535, appendix specified levels marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) shall identify circuit function follows: Device type Generic number 28F010 28F010 28F010 28F010 28F010 28F010 28F010 28F010 28F010 28F010A 28F010A 28F010A 28F010A Circuit function (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM (128 CMOS flash EEPROM Access time Endurance 10,000 cycles 10,000 cycles 10,000 cycles 10,000 cycles 1,000 cycles 1,000 cycles 1,000 cycles 1,000 cycles 10,000 cycles 100,000 cycles 100,000 cycles 100,000 cycles 100,000 cycles
1.2.3 Device class designator. device class designator shall single letter identifying product assurance level follows:
Device class Device requirements documentation Vendor self-certification requirements MIL-STD-883 compliant, non-JAN class level microcircuits accordance with MIL-PRF-38535, appendix Certification qualification MIL-PRF-38535
1.2.4 Case outline(s). case outline(s) shall designated MIL-STD-1835 follows: Outline letter Descriptive designator figure figure GDIP1-T32 CDIP2-T32 CQCC1-N32 figure Terminals Package style lead chip carrier Flat pack Dual-in-line Rectangular leadless chip carrier Gullwing lead chip carrier
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1.2.5 Lead finish. lead finish specified MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class Absolute maximum ratings. Endurance: Device types 01-04, Device types 05-08 Device types 10-13 Supply voltage range (VCC) Storage temperature range (Tstg) Maximum power dissipation (PD) Lead temperature (soldering, seconds) Junction temperature (TJ) Thermal resistance, junction-to-case (JC) (case outline Thermal resistance, junction-to-case (JC) (case outlines Thermal resistance, junction-to-case (JC) (case outline Voltage with respect ground Voltage with respect ground supply voltage with respect ground supply voltage with respect ground Output short circuit current Data retention Recommended operating conditions. Supply voltage range (VCC) Operating temperature range (Tcase) level input voltage range (VIL) High level input voltage range (VIH) High level input voltage range, CMOS (VIH) Chip clear (VP) Digital logic testing device classes Fault coverage measurement manufacturing logic tests (MIL-STD-883, test method 5012) percent +4.5 +5.5 -55C +125C -0.5 +0.8 +2.0 +0.5 -0.5 +0.5 11.4 12.6
10,000 cycles/byte, minimum 1,000 cycles/byte, minimum 100,000 cycles/byte, minimum -2.0 +7.0 -65C +150C +300C +150C MIL-STD-1835 13C/W 27C/W -2.0 +7.0 -2.0 +13.5 -2.0 +14.0 -2.0 +7.0 years minimum
Stresses above absolute maximum rating cause permanent damage device. Extended operation maximum levels degrade performance affect reliability. Minimum voltage input pins -0.5 During voltage transitions, inputs overshoot -2.0 periods Maximum voltage output pins +0.5 During voltage transitions outputs overshoot +2.0 periods Maximum junction temperature shall exceeded except allowable short duration burn-in screening conditions accordance with method 5004 MIL-STD-883. Minimum input voltage overshoot +14.0 periods less than more than output shorted time. Duration short circuit should greater than second. voltages referenced (ground).
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APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those listed issue Department Defense Index Specifications Standards (DoDISS) supplement thereto, cited solicitation.
SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 MIL-STD-973 MIL-STD-1835 HANDBOOKS DEPARTMENT DEFENSE MIL-HDBK-103 MIL-HDBK-780 List Standard Microcircuit Drawings (SMD's). Standard Microcircuit Drawings. Test Method Standard Microcircuits. Configuration Management. Interface Standard Microcircuit Case Outlines.
(Unless otherwise indicated, copies specification, standards, handbooks available from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094).
Non-Government publications. following documents form part this document extent specified herein. Unless otherwise specified, issues documents which adopted those listed issue DODISS cited solicitation. Unless otherwise specified, issues documents listed DODISS issues documents cited solicitation.
AMERICAN SOCIETY TESTING MATERIALS (ASTM) ASStandard F1192-95 Standard Guide Measurement Single Event Phenomena from Heavy Irradiation Semiconductor Devices.
(Applications copies ASpublications should addressed American Society Testing Materials, 1916 Race Street, Philadelphia, 19103). ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Standard EIA/JESD78 Latch-Up Test.
(Applications copies should addressed Electronics Industries Alliance, 2500 Wilson Blvd., Arlington, 22201.) (Non-Government standards other publications normally available from organizations that prepare distribute documents. These documents also available through libraries other informational services).
Order precedence. event conflict between text this drawing references cited herein, text this drawing shall take precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained.
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REQUIREMENTS Item requirements. individual item requirements device classes shall accordance with MIL-PRF38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. individual item requirements device class shall accordance with MIL-PRF-38535, appendix non-JAN class level devices specified herein. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein device classes MIL-PRF-38535, appendix herein device class 3.2.1 Case outline(s). case outline(s) shall accordance with 1.2.4 herein figure 3.2.2 Terminal connections. terminal connections shall specified figure 3.2.3 Truth tables. truth tables shall specified figure 3.2.3.1 Unprogrammed devices. truth table unprogrammed devices contracts involving altered item drawing shall specified figure herein. When required, screening (see herein), quality conformance inspection groups (see herein), devices shall programmed manufacturer prior test checkerboard similar pattern minimum percent total number bits programmed). 3.2.3.2 Programmed devices. requirements supplying programmed devices part this document. 3.2.3.3 Command definitions. command definitions table shall specified figure 3.2.4 Switching test circuits waveforms. switching test circuits waveforms shall specified figure Electrical performance characteristics postirradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics postirradiation parameter limits specified table shall apply over full case operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table IIA. electrical tests each subgroup defined table Marking. part shall marked with listed herein. addition, manufacturer's also marked listed MIL-HDBK-103. packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. product using this option, designator shall still marked. Marking device classes shall accordance with MIL-PRF-38535. Marking device class shall accordance with MIL-PRF-38535, appendix
3.5.1 Certification/compliance mark. certification mark device classes shall "QML" required MIL-PRF-38535. compliance mark device class shall required MIL-PRF-38535, appendix
Certificate compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see 6.6.1 herein). device class certificate compliance shall required from manufacturer order listed approved source supply MIL-HDBK-103 (see 6.6.2 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this drawing shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 herein device class requirements MIL-PRF-38535, appendix herein.
Certificate conformance. certificate conformance required device classes MIL-PRF-38535 device class MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change device class device class notification DSCC-VA change product (see herein) involving devices acquired this drawing required change defined MIL-STD-973.
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TABLE Electrical performance characteristics. Test Symbol Conditions -55C +125C unless otherwise specified Group Subgroups Device type Limits Units
CHARACTERISTICS Input leakage current Output leakage current max, max, VOUT ±1.0
standby current (TTL) standby current (CMOS) active read current
ICCS1
max,
±0.2
max,
IOUT MHz,
ICCS2
ICC1
programming current erase current standby current
ICC2 ICC3
VIL, programming progress VIL, erasure progress
IPPS
VPPL
read current
IPP1
VPPH VPPL
programming current
IPP2
VPPH, programming progress
footnotes table.
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TABLE Electrical performance characteristics Continued. Test Symbol Conditions -55C +125C unless otherwise specified Group Subgroups Device type Limits Units
CHARACTERISTICS Continued erase current level input voltage High level input voltage (TTL) High level input voltage (CMOS) level output voltage High level output voltage (TTL) High level output voltage (CMOS) IPP3 VPPH erasure progress -0.5
VIH1
VCC+
VIH2
VCC+ 0.45
VOH1
-2.5
VOH2 VOH3
-2.5 -100
0.85 VCC-
auto select voltage auto select current during read only operations during read/write operations Functional tests
11.5
13.0
max,
VPPL
NOTE: erase/program inhibited when VPPL
VCC+ 12.6
VPPH
11.4
4.4.1d
footnotes table.
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TABLE Electrical performance characteristics Continued. Test Symbol Conditions -55C +125C unless otherwise specified Group Subgroups Device type Limits Units
CAPACITANCE Input capacitance CIN1 25C, Mhz, 4.4.1c
Output capacitance
COUT
VOUT 25C, Mhz, 4.4.1c 25C, Mhz, 4.4.1c
input capacitance CIN2
CHARACTERISTICS READ ONLY OPERATIONS (See figure applicable.) Read cycle time tAVAV 01,05,10 02,06,11 03,07,12 04,08,13
Chip enable access time
tELQV
01,05,10 02,06,11 03,07,12 04,08,13 01,05,10 02,06,11 03,07,12 04,08,13
Address access time
tAVQV
footnotes table.
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TABLE Electrical performance characteristics Continued. Test Symbol Conditions -55C +125C unless otherwise specified Group Subgroups Device type Limits Units
CHARACTERISTICS READ ONLY OPERATIONS Continued. (See figure applicable.) Output enable access time tGLQV 01,05 02,06 03,07,10, 11,12 04,08,13
Chip enable output Chip disable output high Output enable output Output disable output high
tELQX
tEHQZ
tGLQX
tGHQZ
01,05 02,06 03,07,10, 11,12 04,08,09,
Output hold from address,
change Write recovery time before read
tAXQX
tWHGL
ERASE PROGRAMMING PERFORMANCE Chip erase Chip program Excludes programming
Excludes system overhead
Case temperatures instant Parameters shall tested part device initial characterization after design process change. Parameter shall guaranteed limits specified table lots specifically tested. Whichever occurs first. Minimum byte programming time excluding system overhead programming +6.0 write recovery), while maximum µs/byte loops allowed algorithm). Maximum chip programming time specified lower than worst case allowed programming algorithm since most bytes program significantly faster than worst case byte.
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Verification review device class device class DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer.
3.10 Microcircuit group assignment device class Device class devices covered this drawing shall microcircuit group number (see MIL-PRF-38535, appendix
3.11 Processing EEPROMs. testing requirements quality assurance provisions herein shall satisfied manufacturer prior delivery. 3.11.1 Conditions supplied devices. Devices will supplied unprogrammed clear state. provision will made supplying programmed devices. 3.11.2 Erasure EEPROMs. When specified, devices shall erased accordance with procedures characteristics specified 4.5.1. 3.11.3 Programming EEPROMs. When specified, devices shall programmed accordance with procedures characteristics specified 4.5.2. 3.11.4 Verification state EEPROMs. When specified, devices shall verified either written specified pattern cleared. minimum, verification shall consist performing read entire array verify that bits proper state. that does verify proper state shall constitute device failure device shall removed from sample. 3.12 Endurance. reprogrammability test shall completed part vendor's reliability monitors. This reprogrammability test shall done initial characterization after design process changes which affect reprogrammability device. methods procedures vendor specific, shall guarantee number program/erase endurance cycles listed section herein over full military temperature range. vendor's procedure shall kept under document control shall made available upon request acquiring preparing activity, along with test data. 3.13 Data retention. data retention stress test shall completed part vendor's reliability monitors. This test shall done initial characterization after design process change which affect data retention. methods procedures vendor specific, shall guarantee number years listed section herein over full military temperature range. vendor's procedure shall kept under document control shall made available upon request acquiring preparing activity, along with test data.
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Case
NOTE: Metric equivalents given parenthesis. Symbol .057 .122 .010 .055 .014 .000 .540 .400 .500 .440 .300 .400 .043 0.027 .057 0.033 1.09 0.68 .464 11.17 7.62 10.16 1.45 0.84 Typical Inches .080 .159 .014 .065 .018 .004 .565 1.45 3.10 0.25 1.38 0.36 0.00 13.72 10.16 12.70 11.79 Reference Millimeters 2.03 4.04 0.36 1.65 0.46 0.10 14.35 Reference Solid Solid Notes
FIGURE Case outlines.
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Case
Inches .001 .002 .005 .006 .008 .017 .020 .034
0.03 0.05 0.13 0.15 0.20 0.43 0.51 0.86
Inches .040 1.02 .045 1.15 .050 1.27 .132 3.35 .295 7.49 .280 7.11 .410 10.41 .820 20.83
NOTES: Terminal shall identified mechanical index lead body, mark surface within region shown. Terminal identification numbers need appear package. Weight: maximum. Dimensions inches. Metric equivalents given general information only. FIGURE Case outlines Continued.
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Case
Inches Symbol .057 .122 .010 .055 .014 .000
.540
.440 .043
Family: Ceramic leadless chip carrier Millimeters .080 1.45 .159 3.10 .014 0.25 .065 1.40 .018 0.36 .004 0.00 .670 .400 10.16 .560 13.71 .570 .300 7.62 .460 11.18 .057 1.09
2.03 4.04 0.36 1.65 0.46 0.10 17.01 14.22 14.49
Notes Solid Solid
Reference
Reference 11.68 1.45 Typical
FIGURE Case outlines Continued.
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Device types Case outlines Terminal number
Terminal symbol
FIGURE Terminal connections.
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operations
Pins Read only Read Output disable Standby Auto-select manufacturer code Auto-select device code Read/write Read Output disable Standby Write Operation
VPPL VPPL VPPL VPPL VPPL VPPH VPPH VPPH VPPH
Data 3-state 3-state Data 3-state 3-state Data
Refer characteristics. When VPPL memory contents read written erased. VIH. Manufacture device code also accessed command register write sequence. auto select high voltage. Refer characteristics. output shall follows:
DATA DATA output shall follows:
DATA (device types 01-09, 11-13) DATA (device types 01-09) DATA (device types 10-13) Read operations with VPPH access array data auto select codes. With high voltage, standby current equals +IPP (standby). Refer command definitions valid Data-In during write operation.
FIGURE Truth tables.
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Command definitions, device types 01-09 Command cycles required First cycle Operation Write Write Write Write Write Write Write Address Data 00H/FFH 90H/80H Second cycle Operation Read Read Write Read Write Read Write Address Data
Read memory Read auto select codes Setup erase/erase Erase verify Setup program/program Program verify Reset
Refer operations definitions. Address memory location read. Identifier address: 00H/01H manufacturer code, 01H/A7H device code. Address memory location read during erase verify. Address memory location programmed. Address latched falling edge write-enable pulse. Data read from location during read operation. Data read from location during device identification. Data read from location during erase verify. Data programmed location Data latched rising edge write-enable. Data read from location during program verify. latched program command. Following read Auto Select code command, read operations access manufacturer device codes. second cycle must followed desired command register write. Command definitions, device types 10-13 Command cycles required First cycle Operation Write Write Write Write Write Address Data 00H/FFH 80H/90H 10H/50H Second cycle Operation Read Read Write Write Write Address Data
Read memory Read auto select codes Embedded erase setup/erase Embedded program setup/program Reset
00H/01H 01H/A2H
Refer operations definitions. Address memory location read. Address memory location programmed. Address latched falling edge
pulse.
Data read from location during read operation. Data programmed location Data latched rising edge
Following read Auto Select code command, read operations access manufacturer device codes. second cycle must followed desired command register write.
FIGURE Truth tables Continued.
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testing: Inputs driven logic 0.45 logic "0". Input pulse rise fall times
FIGURE Switching test circuits waveforms.
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waveforms read operations
FIGURE Switching test circuits waveforms Continued.
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QUALITY ASSURANCE PROVISIONS Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. device class sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. device classes screening shall accordance with MIL-PRF-38535, shall conducted devices prior qualification technology conformance inspection. device class screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. 4.2.1 Additional criteria device class Delete sequence specified initial (preburn-in) electrical parameters through interim (postburn-in) electrical parameters method 5004 substitute lines through table herein. Prior burn-in, devices shall programmed (see 4.5.2 herein) with checkerboard pattern equivalent (manufacturers their option employ equivalent pattern provided topologically true alternating pattern). pattern shall read before after burn-in. Devices having bits proper state after burn-in shall constitute device failure shall included calculation shall removed from lot. test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015. Dynamic burn-in (method 1015 MIL-STD-883, test condition circuit, 4.2.1c herein).
Interim final electrical parameters shall specified table herein. After completion screening, device shall erased verified prior delivery.
4.2.2 Additional criteria device classes burn-in test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document revision level control device manufacturer's Technology Review Board (TRB) accordance with MILPRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MIL-STD-883. Interim final electrical test parameters shall specified table herein. Additional screening device class beyond requirements device class shall specified appendix MIL-PRF-38535 detailed table herein.
Qualification inspection device classes Qualification inspection device classes shall accordance with MIL-PRF-38535. Inspections performed shall those specified MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). Conformance inspection. Technology conformance inspection classes shall accordance with MIL-PRF38535 including groups inspections specified herein except where option MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection device class shall accordance with MIL-PRF-38535, appendix specified herein. Inspections performed device class shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4).
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TABLE IIA. Electrical test requirements. Line Test requirements Subgroups (per method 5005, table Device class Interim electrical parameters (see 4.2) Static burn-in method 1015 Same line Dynamic burn-in (method 1015) Same line Final electrical parameters Group test requirements Group end-point electrical parameters Group end-point electrical parameters Group end-point electrical parameters 1*,2,3,7*, 8A,8B,9,10, 1*,2,3,7*, 8A,8B,9,10, Required Required required Subgroups (per MIL-PRF-38535, table III) Device class 1,7,9 2,8A,10 required Device class 1,7,9 2,8A,10 required 1*,7*
Required 1*,7*
1*,2,3,7*, 8A,8B,9,10, 1,2,3,4**,7, 8A,8B,9,10, 1,2,3,7, 8A,8B,9,10, 2,3,7 8A,8B 1,7,9
1,2,3,4**,7,8A, 1,2,3,4**,7, 8A,8B,9,10, 8B,9,10, 2,8A,10 1,2,3,7 8A,8B 2,3,7 8A,8B 1,7,9
2,8A,10
1,7,9
Blank spaces indicate test applicable. subgroups combined when using high-speed testers. Subgroups functional tests shall verify truth table. Indicates applies subgroups 4.4.1c. Indicates delta limit (see table IIB) shall required where specified, delta values shall computed with reference previous interim electrical parameters (see line 4.4.1e.
4.4.1 Group inspection. Tests shall specified table herein. Subgroups table method 5005 MIL-STD-883 shall omitted.
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Subgroup (CIN COUT measurements) shall measured only initial qualification after process design changes which affect input output capacitance. Capacitance shall measured between designated terminal frequency MHz. Sample size devices with failures input output terminals tested. device class subgroups tests shall sufficient verify truth table. device classes subgroups shall include verifying functionality device; these tests shall have been fault graded accordance with MIL-STD-883, test method 5012 (see herein). (latch-up) tests shall measured only initial qualification after design process changes which affect performance device. device class procedures circuits shall maintained under document revision level control manufacturer shall made available preparing activity acquiring activity upon request. device classes procedures circuits shall under control device manufacturer's accordance with MIL-PRF-38535 shall made available preparing activity acquiring activity upon request. Testing shall pins, five devices with zero failures. Latch-up test shall considered destructive. Information contained JEDEC Standard EIA/JESD78 used reference. devices selected testing shall programmed with checkerboard pattern equivalent. After completion testing, devices shall erased verified, (except devices submitted groups testing).
4.4.2 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.2.1 Additional criteria device class Steady-state life test conditions, method 1005 MIL-STD-883: device selected testing shall programmed with checkerboard pattern. After completion testing, devices shall erased verified (except devices submitted group testing). Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005. +125(C, minimum. Test duration: 1,000 hours, except specified method 1005 MIL-STD-883.
devices requiring end-point electrical testing shall programmed with checkerboard equivalent alternating pattern. After completion testing, devices shall cleared verified prior delivery.
4.4.2.2 Additional criteria device classes steady-state life test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. test circuit shall maintained under document revision level control device manufacturer's TRB, accordance with MIL-PRF-38535, shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. 4.4.3 Group inspection. group inspection end-point electrical parameters shall specified table herein. devices selected testing shall programmed with checkerboard pattern. After completion testing, devices shall erased verified.
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TABLE IIB. Delta limits 25(C. Test Device types ICCS2 standby percent specified value table percent specified value table percent specified value table
above parameter shall recorded before after required burn-in life tests determine delta. 4.4.4 Group inspection. Group inspection required only parts intended marked radiation hardness assured (see herein). levels device classes shall specified MIL-PRF-38535. End-point electrical parameters shall specified table herein. device classes devices test vehicle shall subjected radiation hardness assured tests specified MIL-PRF-38535 level being tested. device class devices shall subjected radiation hardness assured tests specified MIL-PRF-38535, appendix level being tested. device classes must meet postirradiation end-point electrical parameter limits defined table +25(C ±5(C, after exposure, subgroups specified table herein. When specified purchase order contract, copy delta limits shall supplied.
Methods inspection. Methods inspection shall specified appropriate figures tables follows. 4.5.1 Erasing procedures. erasing procedures shall specified device manufacturer shall available upon request. 4.5.2 Programming procedure. programming procedures shall specified device manufacturer shall made available upon request. Delta measurements device class Delta measurements, specified table IIA, shall made recorded before after required burn-in screens steady-state life tests determine delta compliance. electrical parameters measured, with associated delta limits listed table IIB. device manufacturer may, option, either perform delta measurements within hours after burn-in perform final electrical parameter tests, subgroups PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. 6.1.1 Replaceability. Microcircuits covered this drawing will replace same generic device covered contractor-prepared specification drawing.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
REVISION LEVEL
5962-90899
SHEET
6.1.2 Substitutability. Device class devices will replace device class devices. Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished accordance with MIL-STD-973 using Form 1692, Engineering Change Proposal. Record users. Military industrial users should inform Defense Supply Center Columbus when system application requires configuration control which SMD's applicable that system. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0525. Comments. Comments this drawing should directed DSCC-VA, Columbus, Ohio 43216-5000, telephone (614) 692-0674. Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MILPRF-38535, MIL-STD-1331, follows: CIN, COUT Input bidirectional output, terminal-to-GND capacitance. Ground zero voltage potential. Supply current. Input current low. Input current high. Case temperature. Ambient temperature. Positive supply voltage. Output enable Write enable voltage during chip erase. Latchup over-voltage.
6.5.1 Timing limits. table timing values shows either minimum maximum limit each parameter. Input requirements specified from external system point view. Thus, address setup time shown minimum since system must supply least that much time (even though most devices require it). other hand, responses from memory specified from device point view. Thus, access time shown maximum since device never provides data later than that time. 6.5.2 Timing parameter abbreviations. timing abbreviations lower case characters with upper case subscripts. initial character always followed four descriptors. These characters specify signal points arranged "fromto" sequence that define timing interval. descriptors each signal specify signal name signal transition. Thus format
Signal name from which interval defined Transition direction first signal Signal name which interval defined Transition direction second signal Signal definitions: Address Data Data Write enable Chip enable Output enable
Transition definitions: Transition high Transition Transition valid Transition invalid don't care Transition (high impedance)
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
REVISION LEVEL
5962-90899
SHEET
6.5.3 Waveforms.
WAVEFORM SYMBOL
INPUT MUST VALID CHANGE FROM CHANGE FROM DON'T CARE CHANGE PERMITTED
OUTPUT WILL VALID WIIL CHANGE FROM WILL CHANGE FROM CHANGING STATE UNKNOWN HIGH IMPEDANCE
Sources supply.
6.6.1 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed QML-38535 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing. 6.6.2 Approved sources supply device class Approved sources supply class listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
REVISION LEVEL
5962-90899
SHEET
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN DATE: 99-11-16 Approved sources supply 5962-90899 listed below immediate acquisition only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-HDBK-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This bulletin superseded next dated revision MIL-HDBK-103 QML38535. Standard microcircuit drawing 5962-9089901QXA 5962-9089901MXX 5962-9089901QYA 5962-9089901MYX 5962-9089901MTX 5962-9089901MZX 5962-9089901QUA 5962-9089901MUX 5962-9089902QXA 5962-9089902MXX 5962-9089902QYA 5962-9089902MYX 5962-9089902MTX 5962-9089902MZX 5962-9089902QUA 5962-9089902MUX 5962-9089903QXA 5962-9089903MXX 5962-9089903QYA 5962-9089903MYX 5962-9089903MTX 5962-9089903MZX 5962-9089903QUA 5962-9089903MUX 5962-9089904QXA 5962-9089904MXX 5962-9089904QYA 5962-9089904MYX 5962-9089904MTX 5962-9089904MZX 5962-9089904QUA 5962-9089904MUX Vendor CAGE number 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 Vendor similar SMJ28F010B-25JDDM AM28F010-250/BXA MD28F010-25/B SMJ28F010B-25FEM AM28F010-250/BUA MR28F010-25/B MT28F010-25/B MZ28F010-25/B SMJ28F010B-25HKM MF28F010-25/B SMJ28F010B-20JDDM AM28F010-200/BXA MD28F010-20/B SMJ28F010B-20FEM AM28F010-200/BUA MR28F010-20/B MT28F010-20/B MZ28F010-20/B SMJ28F010B-20HKM MF28F010-20/B SMJ28F010B-15JDDM AM28F010-150/BXA MD28F010-15/B SMJ28F010B-15FEM AM28F010-150/BUA MR28F010-15/B MT28F010-15/B MZ28F010-15/B SMJ28F010B-15HKM MF28F010-15/B SMJ28F010B-12JDDM AM28F010-120/BXA MD28F010-12/B SMJ28F010B-12FEM AM28F010-120/BUA MR28F010-12/B MT28F010-12/B MZ28F010-12/B SMJ28F010B-12HKM MF28F010-12/B
footnotes table.
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN- continued. Standard microcircuit drawing 5962-9089905QXA 5962-9089905MXX 5962-9089905QYA 5962-9089905MYX 5962-9089905MTX 5962-9089905MZX 5962-9089905QUA 5962-9089905MUX 5962-9089906QXA 5962-9089906MXX 5962-9089906QYA 5962-9089906MYX 5962-9089906MTX 5962-9089906MZX 5962-9089906QUA 5962-9089906MUX 5962-9089907QXA 5962-9089907MXX 5962-9089907QYA 5962-9089907MYX 5962-9089907MTX 5962-9089907MZX 5962-9089907QUA 5962-9089907MUX 5962-9089908QXA 5962-9089908MXX 5962-9089908QYA 5962-9089908MYX 5962-9089908MTX 5962-9089908MZX 5962-9089908QUA 5962-9089908MUX 5962-9089909MXX 5962-9089909MYX 5962-9089909MTX 5962-9089909MZX 5962-9089909MUX 5962-9089910QXA 5962-9089910MXX 5962-9089910QYA 5962-9089910MYX 5962-9089910QUA Vendor CAGE number 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 Vendor similar SMJ28F010B-25JDDM AM28F010-250C3/BXA MD28F010-25/B SMJ28F010B-25FEM AM28F010-250C3/BUA MR28F010-25/B MT28F010-25/B MZ28F010-25/B SMJ28F010B-25HKM MF28F010-25/B SMJ28F010B-20JDDM AM28F010-200C3/BXA MD28F010-20/B SMJ28F010B-20FEM AM28F010-200C3/BUA MR28F010-20/B MT28F010-20/B MZ28F010-20/B SMJ28F010B-20HKM MF28F010-20/B SMJ28F010B-15JDDM AM28F010-150C3/BXA MD28F010-15/B SMJ28F010B-15FEM AM28F010-150C3/BUA MR28F010-15/B MT28F010-15/B MZ28F010-15/B SMJ28F010B-15HKM MF28F010-15/B SMJ28F010B-12JDDM AM28F010-120C3/BXA MD28F010-12/B SMJ28F010B-12FEM AM28F010-120C3/BUA MR28F010-12/B MT28F010-12/B MZ28F010-12/B SMJ28F010B-12HKM MF28F010-12/B MD28F010-90/B MR28F010-90/B MT28F010-90/B MZ28F010-90/B MF28F010-90/B SMJ28F010B-25JDDM AM28F010A-250/BXA SMJ28F010B-25FEM AM28F010A-250/BUA SMJ28F010B-25HKM
footnotes table.
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN- continued.
Standard microcircuit drawing 5962-9089911QXA 5962-9089911QYA 5962-9089911MXX 5962-9089911MYX 5962-9089911QUA 5962-9089912QXA 5962-9089912QYA 5962-9089912MXX 5962-9089912MYX 5962-9089912QUA 5962-9089913QXA 5962-9089913QYA 5962-9089913MXX 5962-9089913MYX 5962-9089913QUA
Vendor CAGE number 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86
Vendor similar SMJ28F010B-20JDDM SMJ28F010B-20FEM AM28F010A-200/BXA AM28F010A-200/BUA SMJ28F010B-20HKM SMJ28F010B-15JDDM SMJ28F010B-15FEM AM28F010A-150/BXA AM28F010A-150/BUA SMJ28F010B-15HKM SMJ28F010B-12JDDM SMJ28F010B-12FEM AM28F010A-120/BXA AM28F010A-120/BUA SMJ28F010B-12HKM
lead finish shown each representing hermetic package most readily available from manufacturer listed part. desired lead finish listed, contact Vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing. longer available from approved source.
Vendor CAGE number 0EU86
Vendor name address Austin Semiconductor Inc. 8701 Cross Park Drive Austin, 78754-4566
Manufacturer code
Device code
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies this information bulletin.

98-04-16 99-11-16 Raymond Monnin Raymond Monnin SHEET SHEET

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