Semiconductor MSM9802/03/05-xxx Voice Synthesis with Built-in Mas

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Semiconductor MSM9802/03/05-xxx Voice Synthesis with Built-in Mas

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E2D0018-39-93 Semiconductor
Semiconductor MSM9802/03/05-xxx
Voice Synthesis with Built-in Mask
This version: Sep. 1999 MSM9802/03/05-xxx Previous version: May. 1997
GENERAL DESCRIPTION
MSM9802/03/05 voice synthesis with built-in mask ROM. This user selectable playback algorithms, Non-linear straight PCM. also contains current mode 10-bit converter low-pass filter. External control been made easy built-in edit that form sentences linking phrases. using Oki's Sound Analysis Editing Tool, data such Phrase Control Table easily set, created, edited, evaluated. With stand-alone mode/microcontroller interface mode switching pin, MSM9802/03/ support various applications.
FEATURES
Device MSM9802 MSM9803 MSM9805 size* Kbits Mbit Mbits Speech period (sec) fSAM=4.0 16.0 32.4 65.1 fSAM=6.4 10.0 20.2 40.7 fSAM=8.0 16.2 32.5 fSAM=16.0 16.2
Actual voice area smaller Kbits.
custom 8-bit nonlinear method/8-bit straight method Built-in edit Random playback function Sampling frequency kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/ 16.0 Note: oscillation selected, 10.6 kHz, 12.8 kHz, 16.0 cannot selected. Maximum number phrases (Microcontroller interface mode) (Stand-alone mode) Built-in current mode 10-bit converter Built-in low-pass filter Standby function oscillation (256 kHz)/ceramic oscillation (4.096 MHz) selectable Package options: 18-pin plastic (DIP18-P-300-2.54) (Product name: MSM9802-xxxRS/MSM9803-xxxRS/ MSM9805-xxxRS) 24-pin plastic (SOP24-P-430-1.27-K) (Product name: MSM9805-xxxGS-K) 30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name: indicates code number. Chip Note: This data sheet explains stand-alone mode microcontroller interface mode, separately. 1/51
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CONTENTS
Stand-alone Mode BLOCK DIAGRAM CONFIGURATION DESCRIPTIONS ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS FUNCTIONAL DESCRIPTION Playback Code Specification Pull-up/Pull-down Resistor Stand-alone Mode APPLICATION CIRCUITS Microcontroller Interface Mode BLOCK DIAGRAM CONFIGURATION DESCRIPTIONS ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS FUNCTIONAL DESCRIPTION Playback Code Specification Address Data Stop Code Generating Pseudo BUSY Signal through pin. APPLICATION CIRCUIT. Common Sampling Frequency Recording/Playback Time Playback Method Phrase Control Table Oscillation Ceramic Oscillation Low-pass Filter Standby Transition Voice Output Unit Equivalent Circuit (AOUT, VREF Pins) CONVERTER CURRENT CHARACTERISTICS CONFIGURATION
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BLOCK DIAGRAM
STAND-ALONE MODE (CPU/STD: level)
Address Switching Controller
16-Bit (MSM9802) 17-Bit (MSM9803) 18-Bit (MSM9805) Multiplexer
512-Kbit (MSM9802) 1-Mbit (MSM9803) 2-Mbit (MSM9805) (Including Kbits Edit Address ROM)
CPU/STD
Random Circuit
16-Bit (MSM9802) 17-Bit (MSM9803) 18-Bit (MSM9805) Address Counter
DATA Controller Synthesizer
BUSY
Interface
OSC1 OSC2 OSC3/TEST XT/RC Timing Controller
10-Bit
MSM9802/03/05-xxx
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XT/CR
RESET
VREF
AOUT
Semiconductor
MSM9802/03/05-xxx
CONFIGURATION (TOP VIEW)
RESET XT/CR BUSY VREF AOUT
CPU/STD OSC3/TEST OSC2 OSC1
18-Pin Plastic Note: Applicable MSM9802-xxxRS, MSM9803-xxxRS, MSM9805-xxxRS.
OSC1 OSC2 OSC3/TEST CPU/STD
AOUT VREF
BUSY
XT/CR RESET
connection
24-Pin Plastic
Note: Applicable MSM9802-xxxGS-K, MSM9803-xxxGS-K, MSM9805-xxxGS-K.
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OSC1 OSC2 OSC3/TEST CPU/STD
AOUT VREF BUSY XT/CR RESET
connection 30-Pin Plastic SSOP Note: Applicable MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, MSM9805-xxxGS-AK.
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DESCRIPTIONS
SSOP Symbol Type Description enters standby state this level. this time, oscillation stops AOUT drives current becomes RESET level, then returns initial state. Apply pulse upon power-on. This internal pull-up resistor. BUSY XT/CR CPU/STD Outputs level while voice being played back. power-on, this level. XT/RC switching pin. level ceramic oscillation used. level oscillation used. Microcontroller interface/stand-alone mode switching pin. level MSM9802/03/05 used stand-alone mode. Volume setting pin. this level, maximum VREF current forced this level, minimum current forced pull-down resistor approx. internally connected this during operation. Voice output pin. AOUT voice signals output current changes. standby state, this drives current becomes level. Ground pin. Power supply pin. Insert bypass capacitor more between pins. Ceramic oscillator connection when ceramic oscillation selected. OSC1 connection when oscillation selected. Input from this external clock used. Ceramic oscillator connection when ceramic oscillation selected. OSC2 connection when oscillation selected. Leave this open external clock used. Outputs level standby state. Leave this open when ceramic oscillation used. OSC3/TEST connection when oscillation selected. Outputs level standby state when oscillation selected. Random playback starts level. Fetches addresses from random address generation circuit fall RND. level when random playback function used. This internal pull-up resistor.
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SSOP
Symbol
Type
Description Phrase input pins corresponding playback sound.
16-18 10-12 13-15
input changes, pins fetch addresses after start voice synthesis. Each these pins internal pull-down resistor. Phrase input pins corresponding playback sound.
13-15 16-18
Input logic becomes invalid random playback function used.
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ABSOLUTE MAXIMUM RATINGS
(GND=0 Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol TSTG Condition Ta=25°C Rating -0.3 +7.0 -0.3 VDD+0.3 +150 Unit
RECOMMENDED OPERATING CONDITIONS
(GND=0 Parameter Power Supply Voltage Operating Temperature Master Clock Frequency Master Clock Frequency Symbol fOSC1 fOSC2 Condition When crystal selected When selected (*1) Min. Range Typ. 4.096 Max. Unit
accuracy oscillation frequency when oscillation selected depends largely accuracy external
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ELECTRICAL CHARACTERISTICS
Characteristics
(VDD=5.0 GND=0 Ta=-40 +85°C, unless otherwise specified) Parameter Input Voltage Input Voltage Output Voltage Output Voltage Input Current Input Current Input Current Input Current Input Current Symbol IIH1 IIH2 IIH3 IIL1 IIL2 IDD1 Condition IOH=-1 IOL=2 VIH=VDD Internal pull-down resistor Applies OSC1 only. VIH=VDD VIL=GND Internal pull-up resistor VREF=VDD, AOUT bias voltage=0V maximum output current Dynamic Supply Current IDD2 VREF=GND, AOUT bias voltage=0V Standby Current Ta=-40 +70°C Ta=70 85°C maximum output current, AOUT Output Current VREF Pull-down Resistance IAOUT RVREF VREF=GND, AOUT bias voltage=0V Min. -200 Typ. Max. Unit
Dynamic Supply Current
Applicable SW0-SW2 Applicable RESET, Dynamic supply current (excluding output current) Dynamic supply current maximum output current
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Characteristics
(VDD=3.1 GND=0 Ta=-40 +85°C, unless otherwise specified) Parameter Input Voltage Input Voltage Output Voltage Output Voltage Input Current Input Current Input Current Input Current Input Current Symbol IIH1 IIH2 IIH3 IIL1 IIL2 IDD1 Condition IOH=-1 IOL=2 VIH=VDD Internal pull-down resistor Applies OSC1 only. VIH=VDD VIL=GND Internal pull-up resistor VREF=VDD, AOUT bias voltage=0V maximum output current Dynamic Supply Current IDD2 VREF=GND, AOUT bias voltage=0V Standby Current Ta=-40 +70°C Ta=70 85°C maximum output current, AOUT Output Current VREF Pull-down Resistance IAOUT RVREF VREF=GND, AOUT bias voltage=0V Min. -100 Typ. 0.15 Max. Unit
Dynamic Supply Current
Applicable SW2-SW0 Applicable RESET, Dynamic supply current (excluding output current) Dynamic supply current maximum output current
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(VDD=5.0 GND=0 Ta=-40 +85°C) Parameter Master Clock Duty Cycle RESET Input Pulse Width RESET Input Time After Power-on Input Pulse Width SW0-SW2 Input Pulse Width BUSY Output Time Chattering Prevention Time Chattering Prevention Time Converter Change Time Standby Transition Time Silence Time Between Phrases Random Address Fetch Time Symbol fduty tw(RST) tD(RST) tw(RAN) tw(SW) tSBS tCHA tCHB tDAR, tDAF tSTB tBLN Condition (note) (note) (note) (note) (note) (note) Min. Typ. Max. Unit
fSAM=8 (note)
(Note) Proportional master periods oscillation frequencies fOSC1 fOSC2. rated values show values when standard master oscillation frequency used.
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TIMING DIAGRAMS
Characteristics Power-On
VDDMin
RESET BUSY
SW2-SW0
Characteristics Standby Status when Activated
A2-A0 SW2-SW0 First phrase First phrase
BUSY
AOUT
Standby status
Repeated Playback Timing
A2-A0 SW2-SW0
BUSY AOUT
,,,,
MSM9802/03/05-xxx
tD(RST) tW(RST)
"000" "000" tw(SW) Address data fetch tCHA tSBS tDAR tSTB tDAF Standby transition time Standby status Oscillation start converter change time
First phrase First phrase
"000"
"000"
Single phrase playback
Single phrase repeated playback tBLN
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Timing when Changing from During Playback
A2-A0 First phrase First phrase
SW2-SW0
BUSY
AOUT
MSM9802/03/05-xxx
Second phrase "000" "000" Second phrase "000" tCHB tBLN First phrase playback Second phrase playback First phrase playback stops
Repeated Playback Timing Random Playback
BUSY AOUT First phrase playback Same phrase repeated playback tBLN
Oscillation start
Timing when Changing from During Playback
A2-A0
(Ex.)
SW2-SW0 BUSY AOUT
Second phrase First phrase First phrase tCHA Second phrase Address data fetch "000" First phrase (Second phrase) "000" tBLN First phrase playback Second phrase playback
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FUNCTIONAL DESCRIPTION
Playback Code Specification user specify maximum phrases. Table shows settings A2-A0 SW2-SW0 pins. Table User-specified Phrases
A2-A0 SW2-SW0 Code Details Inhibit code User-specified phrase phrases)
Pull-up/Pull-down Resistor RESET pins have internal pull-up resistors SW2-SW0 pins have internal pull-down resistors. Stand-alone Mode stand-alone mode, input interface function random playback function used. input interface With input interface, speech synthesis starts when state SW2-SW0 pins changed. prevent chattering, address data latched (tCHA) after state SW2SW0 changed. Voice synthesis does start state A2-A0 pins changed. level random playback function used. A2-A0 pins level power-on reset. input interface effective when MSM9802/03/05 operated using push-button switch. Voice synthesis starts when address changed pressing push-button switch. push-button switch released during playback, then playback stops after current phrase completed.
A2-A0 SW2-SW1 BUSY AOUT Oscillation start tCHA tw(SW)
Figure Input Interface Single-Phrase Playback Timing 14/51
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playback attempted unused address phrases, AOUT goes IAOUT playback does occur. Figure shows timing.
A2-A0 SW2-SW1 BUSY AOUT Oscillation start
Figure Timing when Playback Attempted Unused Phrase Address
input interface, phrase triggered when "0". Therefore, when circuit consists diode matrices that push-button switches, maximum playback phrases phrases.
A2-A0 codes SW2-SW0 (000) codes Code Prohibited Phrases
Random playback function random playback function randomly generates different addresses corresponding four bits addresses SW2-SW0 (except "L") after which playback commences. Therefore, input pins from external control invalid. Hold these pins either level. pins held open they have internal pull-down resistor. Playback occur addresses have been assigned phrase. Care must taken when creating data. example, when four phrases, "sunny", "rainy", "cloudy", "snowy", played randomly, phrases shown Table which phrase assigned addresses. four phrases then played back random shown below.
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Table Random Address Setup Example
SW2-SW0 0001 0010 0011 0100 0101 Phrase sunny rainy cloudy snowy sunny
1110 1111
rainy snowy
Random playback starts when timing shown Figure input pin. random address fixed based level time during oscillation. Random address captured fall pin, voice playback commences. Therefore, when power turned when RESET input, phrase fixed address "0001" played while random counter remains initialized until random playback initiated.
RESET
(RAN)
Random address fixed time
(RAN)
Random address fixed time
BUSY AOUT Oscillation start
Playback (Address 0001)
Playback (Address random)
Figure Random Address Capture
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Semiconductor Table Random Playback Address
0001 0010 0011 0100
MSM9802/03/05-xxx
Phrase (Sample) White Black Blue Green
1111 0001 0010 0011 0100
1111 0001 0010 0011 0100
1111 0001 1111
random address, phrases each logical condition addresses (i.e., "00", "01", "10", "11"). random playback, four logic states ("000000", "010000", "100000" "110000") userspecified phrases cannot used. Take into consideration when creating data. random address level time pin, same pulse width input microcontroller, random address fixed time becomes constant, random phrase played under these conditions. random address fixed time must inconsistent order produce random playback.
Invalid pulse Pulse input during this time period invalid BUSY
AOUT Oscillation start
Figure Timing when Pulse Input During Random Playback
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Table Random Playback Stop Address
1111 0001 SW2-SW0* 0001 Code Details Random playback address addresses) Stop address
Address(es) corresponding SW2-SW0 pins
Figure Circuit Example Random Playback Stop
unused user-specified address used stop address, therefore enter standby without voice playback, shown Figure 3.2.
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APPLICATION CIRCUITS
AOUT VREF BUSY
XT/CR CPU/STD
RESET
OSC3 OSC2 OSC1
S4="L" S4="H"
Address [HEX]
Application Circuit Playing Phrases Using Four Switches
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VREF BUSY RESET XT/CR CPU/STD OSC3 OSC2 OSC1
AOUT
Application Circuit Using Switches
MSM9802/03/05-xxx
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BLOCK DIAGRAM
MICROCONTROLLER INTERFACE MODE (CPU/STD: level)
Address Controller
16-Bit (MSM9802) 17-Bit (MSM9803) 18-Bit (MSM9805) Multiplexer
512-Kbit (MSM9802) 1-Mbit (MSM9803) 2-Mbit (MSM9805) (Including 11Kbit Edit Address ROM)
CPU/STD
Interface
16-Bit (MSM9802) 17-Bit (MSM9803) 18-Bit (MSM9805) Address Counter
DATA Controller Synthesizer
OSC1 OSC2 OSC3/TEST XT/RC Timing Controller
10-Bit
MSM9802/03/05-xxx
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XT/CR
RESET
VREF
AOUT
Semiconductor
MSM9802/03/05-xxx
CONFIGURATION (TOP VIEW)
RESET XT/CR VREF AOUT
CPU/STD OSC3/TEST OSC2 OSC1
18-Pin Plastic Note: Applicable MSM9802-xxxRS, MSM9803-xxxRS, MSM9805-xxxRS.
OSC1 OSC2 OSC3/TEST CPU/STD
AOUT VREF
XT/CR RESET
connection
24-Pin Plastic
Note: Applicable MSM9802-xxxGS-K, MSM9803-xxxGS-K, MSM9805-xxxGS-K.
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OSC1 OSC2 OSC3/TEST CPU/STD
AOUT VREF XT/CR RESET
connection 30-Pin Plastic SSOP Note: Applicable MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, MSM9805-xxxGS-AK.
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DESCRIPTIONS
SSOP
Symbol
Type
Description enters standby state this level. this time, oscillation stops AOUT drives current becomes
RESET
level, then returns initial state. Apply pulse upon power-on. This internal pull-up resistor. Signal output that indicates whether 6-bit LATCH (see Block
Diagram) idle. level indicates that LATCH empty input enabled. XT/RC switching pin. level ceramic oscillation used. level oscillation used. Microcontroller interface/stand-alone mode switching pin. level MSM9802/03/05 used microcontroller interface mode. Volume setting pin. this level, maximum current forced level, minimum current forced approx. pull-down resistor internally connected this during operation. Voice output pin.
XT/CR CPU/STD
VREF
AOUT
voice signals output current changes. standby state, this drives current becomes level. Ground pin. Power supply pin. Insert bypass capacitor more between this pin. Ceramic oscillator connection when ceramic oscillation selected. connection when oscillation selected. Input from this external clock used. Ceramic oscillator connection when ceramic oscillation selected. connection when oscillation selected. Leave this open external clock used. Outputs level standby state. Leave this open when ceramic oscillation used.
OSC1
OSC2
OSC3/TEST
connection when oscillation selected. Outputs level standby state when oscillation selected. Voice synthesis starts fall addresses fetched
16-18
rise Input when NAR, status signal, level. This internal pull-up resistor. Phrase input pins corresponding playback sound.
10-15 13-18
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ABSOLUTE MAXIMUM RATINGS
(GND=0V) Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol TSTG Condition Ta=25°C Rating -0.3 +7.0 -0.3 VDD+0.3 +150 Unit
RECOMMENDED OPERATING CONDITIONS
(GND=0 Parameter Power Supply Voltage Operating Temperature Original Oscillation Frequency Original Oscillation Frequency Symbol fOSC1 fOSC2 Condition When crystal selected When selected (*1) Min. Range Typ. 4.096 Max. Unit
accuracy oscillation frequency when oscillation selected depends largely accuracy external
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ELECTRICAL CHARACTERISTICS
Characteristics
(VDD=5.0 GND=0 Ta=-40 +85°C, unless otherwise specified) Parameter Input Voltage Input Voltage Output Voltage Output Voltage Input Current Input Current Input Current Input Current Symbol IIH1 IIH2 IIL1 IIL2 IDD1 Condition IOH=-1 IOL=2 VIH=VDD Applies OSC1 only. VIH=VDD VIL=GND Internal pull-up resistor VREF=VDD, AOUT bias voltage=0V maximum output current Dynamic Supply Current IDD2 VREF=GND, AOUT bias voltage=0V Standby Current Ta=-40 +70°C Ta=70 85°C maximum output current, AOUT Output Current VREF Pull-down Resistance IAOUT RVREF VREF=GND, AOUT bias voltage=0V Min. -200 Typ. Max. Unit
Dynamic Supply Current
Applicable RESET, Dynamic supply current (excluding output current) Dynamic supply current maximum output current
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(VDD=3.1 GND=0 Ta=-40 +85°C, unless otherwise specified) Parameter Input Voltage Input Voltage Output Voltage Output Voltage Input Current Input Current Input Current Input Current Symbol IIH1 IIH2 IIL1 IIL2 IDD1 Condition IOH=-1 IOL=2 VIH=VDD Applies OSC1 only. VIH=VDD VIL=GND Internal pull-up resistor VREF=VDD, AOUT bias voltage=0V maximum output current Dynamic Supply Current IDD2 VREF=GND, AOUT bias voltage=0V Standby Current Ta=-40 +70°C Ta=70 85°C maximum output current, AOUT Output Current VREF Pull-down Resistance IAOUT RVREF VREF=GND, AOUT bias voltage=0V Min. -100 Typ. 0.15 Max. Unit
Dynamic Supply Current
Applicable RESET, Dynamic supply current (excluding output current) Dynamic supply current maximum output current
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(VDD=5.0 GND=0 Ta=-40 +85°C) Parameter Master Clock Duty Cycle RESET Input Pulse Width RESET Input Time After Power-on Signal Setup Time Input Pulse Width ST-ST Pulse Interval Data Setup Time Data Hold Time Output Time Output Time Output Time Output Time Converter Change Time Standby Transition Time voice output) Silence Time Between Phrases Symbol fduty tw(RST) tD(RST) tSTP t(ST) tSNS tNAA tNAB tNAC tDAR, tDAF tSTB tBLN Condition power-on Upon entering stop code (note) fSAM=8 fSAM=8 (note) fSAM=8 (note) fSAM=8 (note) (note) (note) Min. 0.35 Typ. Max. 2000 Unit
fSAM=8 (note)
(Note) Proportional master periods oscillation frequencies fOSC1 fOSC2. rated values show values when standard master oscillation frequency used.
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TIMING DIAGRAMS
Characteristics Power-On
VDDMin
RESET
Characteristics Standby Status when Activated
I5-I0
AOUT
MSM9802/03/05-xxx
tD(RST) tW(RST) tSTP
t(ST)
tSNS
tNAA
tDAR Oscillation start
Voice playback
tSTB
tDAF
Standby transition time converter change time
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Playback Timing
I5-I0
phrase address
phrase address
phrase address
tNAC tNAB AOUT tDAR
Oscillation start phrase playback phrase playback phrase playback
tBLN
MSM9802/03/05-xxx
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FUNCTIONAL DESCRIPTION
Playback Code Specification user specify maximum phrases. Table shows settings I5-I0 pins. Table User-specified Phrases
I5-I0 000000 000001 111111 Code Details Stop code User-specified phrase Phrases)
Address Data phrase input I5-I0 pins address data, pulse then applied, voice playback starts. Figure shows voice start timing. Figure shows timing when address other than phrase input.
I5-I0 AOUT Oscillation start
User phrase
Voice
Figure Voice Start Timing
I5-I0 AOUT Oscillation start
Address other than user phrase
Figure Timing when Address Other than Phrase Input Stand-by Mode
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Stop Code I5-I0 "000000" during voice playback, signal input, playback stops regardless whether level, then AOUT becomes IAOUT. Stop code becomes valid falling edge Figure shows stop code input timing.
I5-I0 "000000" User phrase
AOUT Voice stop
Figure Stop Code Input Timing stop code does initialize internal units only stops playback. initialize internal register, RESET pin.
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Generating Pseudo-BUSY Signal through application requires BUSY signal when this used microcontroller interface mode, pseudo-BUSY signal generated through controlling signal timing, shown below. When edit used
I5-I0 (Phrase
(Phrase (Phrase (Silence phrase more)
30ms more (Pseudo-BUSY) AOUT tDAR Phrase Phrase tNAB Phrase tNAB
Silence phrase
30ms more
30ms more
tSTB
tDAF
tNAB
When edit used
I5-I0 (Phrases 1+2+3) (Silence phrase more)
30ms more (Pseudo-BUSY) AOUT tDAR Phrase Phrase tBLN Phrase tBLN
Silence phrase
tSTB
tDAF
tNAB
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APPLICATION CIRCUIT
P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 P2.2 P2.1 P3.0 RESET CPU/STD XT/CR OSC2 OSC1 VREF
MSC1157 (Speaker AMP)
MSM83C154 (MCU)
MSM9802/03/05
AOUT
RESET XTAL1 XTAL2
OSC3
STBY
Application Circuit Microcontroller Interface
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Common
Sampling Frequency shown Table 1.1, sampling frequencies available. sampling frequency selected assigned each phrase data. Table Sampling Frequency
Sampling Frequency standard oscillation frequency 10.6 12.8 16.0 Frequency diving ratio XT/CR="H" Ceramic Oscillation fOSC1/1024 fOSC1/768 fOSC1/640 fOSC1/512 fOSC1/384 fOSC1/320 fOSC1/256 XT/CR="L" Oscillation fOSC2/64 fOSC2/48 fOSC2/40 fOSC2/32 Unavailable Unavailable Unavailable
Note: When oscillation selected, 10.6 kHz, 12.8 kHz, cannot selected.
Recording/Playback Time Figure below shows memory allocation on-chip Mask ROM. About Kbits data area allocated Phrase Control Table, Phrase Data Control Test Data. Therefore, actual data area storing sound data equals total Mask capacity minus Kbits.
Phrase Control Table Area Pharase Data Control Area Test Data Area
On-chip Mask Capacity 512K (MSM9802) (MSM9803) (MSM9805)
User's Area
501K (MSM9802) 1013K (MSM9803) 2037K (MSM9805)
Figure Memory Allocation On-chip Mask
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playback time obtained dividing memory capacity rate. playback time 8-bit algorithm obrained using following equation.
Playback time [sec] Memory capacity [bit] rate [bps] Memory capacity [bit] Sampling frequency [Hz] [bit]
example, phrases stored MSM9802 sampling frequency, maximum playback time follows.
Playback time (512-11) 1024 [bit] 8000 [Hz] [bit] [sec]
Table Maximum playback time
Maximum playback time (sec) fSAM=4.0kHz fSAM=6.4kHz fSAM=8.0kHz fSAM=16.0kHz 16.0 32.4 65.1 10.0 20.2 40.7 16.2 32.5 16.2
Model MSM9802 MSM9803 MSM9805
capacity 512K
User's area 501K 1013K 2037K
Playback Method This provides kinds playback methods, non-linear algorithm straight algorithm. When 8-bit non-linear algorithm selected, sound quality improved because resolution equivalent 10-bit straight available around waveform center. select either non-linear algorithm straight algorithm each phrase. Table shows relationship between playback methods applicable sounds. recommended evaluate sound quality before actual use. Table Relationship between playback methods applicable sounds
Playback method 8-bit straight algorithm Applicable sound BEEP tone, sound effects
8-bit non-linear algorithm Human voice
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Semiconductor Phrase Control Table
MSM9802/03/05-xxx
Because contains Phrase Control Table, possible play back multiple phrases succession single easy control operation like controlling single regular phrase playback. combined phrases including silence registered single address Phrase Control Table. Further, maximum memory space data storage because required have same phrase data. show example, let's assume that your application needs speak similar sentences, fine today" rainy today." sentences have common words "it", "is" "today". What have prepare these common sound data, sentences words, store each combined phrase data Phrase Control Table shown Table Figure Multiple phrases played continuously merely specifying desired phrase using address. example from Table 4.1, when address "01" specified, fine today" played, when address"02" specified, rainy" played. Phrase Control Table, silence inserted without using User's Area. Minimum time silence Maximum time silence Time unit setting silence 2016
Table Matrix Phrase Control Table
X-Address (HEX)
Y-Address phrases) [01] [02] Silence [10] [03] [01] [02] Silence [12] [03]
Sound Data (silence) fine today. (silence) rainy today.
[01] [02] [10] [21] [11] [12] [22] [03] fine becoming cloudy, rainy some areas today.
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Figure Phrase Combination Matrix Phrase Control Table
Phrase Control Table Area X-Address Silence time setting (32ms Silence time 2016 Phrase Addigned [01] [02] [12] [03] rainy today
Phrase Data Registration Area Y-Address Phrase today fine cloudy rainy snowy ocasionally becoming some areas
Silence (64ms)
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Semiconductor Oscillation
MSM9802/03/05-xxx
Figure shows external circuit using oscillation. Figure shows oscillation frequency characteristics.
OSC1 OSC2 OSC3
Figure Oscillation
Oscillaiton Frequency fOSC (kHz)
VDD=3 C=47 VDD=5 C=47 VDD=5 C=30
R1=100
VDD=3 C=30
Load Resistance (kW)
Figure Oscillation Frequency Characteristics
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Semiconductor Determining constants
MSM9802/03/05-xxx
oscillation frequency characteristics shown Figure 5.2. fosc kHz, following values guide (see Figure 5.2) that printed-circuit board type used. R1=100 R2=30 C=30 When choosing oscillation, oscillation frequency varies according fluctuation external Fluctuation oscillation frequencies When choosing oscillation, error oscillation frequency process variations maximum, fluctuation oscillation frequency when using capacitor accuracy resistor (R2) accuracy maximum approximately.
Ceramic Oscillation Figure shows external circuit using ceramic oscillator.
OSC1
OSC2
Figure Ceramic Oscillation Diagram
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example, following table shows optimum load capacitances, power supply voltage ranges, operating temperature ranges when ceramic oscillators made Murata Co., Ltd., Kyocera Co., Ltd. Co., Ltd. used.
Ceramic oscillator Maker
Murata MFG.
Optimal load capacity (pF) Built Built Built Built Built (pF) Built
Type CSA4.09MGU CST4.09MGWU CSTCC4.00MG CSTCC4.00MGU PBRC4.00A KBR-4.0MSB PBRC4.00B KBR-4.0MKC
Frequency (MHz) 4.096
supply voltage range
Operating temperature range (°C)
Kyocera
CCR4.00MC3
(Note)
When ceramic oscillator used, playback speed MSM9802/03/05 slower percent than that analysis tool demonstration board.
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Semiconductor Low-Pass Filter
MSM9802/03/05-xxx
this voice outputs through built-in low-pass filter (LPF). Figure Table show frequency characteristics cutoff frequency respectively. Only voice output through enabled this
[dB] [Hz]
Figure. Frequency Characteristics (fSAM=8 kHz)
Table Cutoff Frequency
Sampling Frequency (kHz) (fSAM) 10.6 12.8 16.0 Cutoff Frequency (kHz) (fCUT)
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Semiconductor Standby Transition
MSM9802/03/05-xxx
When playback phrase finished, playback next phrase does start within tSTB (0.25 sec. typ.), enters standby status entire operation stops.
BUSY
AOUT
Figure Timing Voice Playback during Converter Change Time (Stand-alone Mode)
AOUT
Figure Timing Voice Playback during Converter Change Time (Microcontroller Interface Mode)
playback attempted during converter change time shown figures 8.2, exits from standby status output from converter begins going IAOUT level. When output reaches IAOUT, voice playback starts.
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Voice Output Unit Equivalent Circuit (AOUT, FREF Pins)
Current-Sourcing Type Converter VREF 10kW (TYP) Value
AOUT IAOUT
Standby Signal
(The above switch positions show those when circuit active.)
Figure Voice Output Unit Equivalent Circuit
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CONVERTER OUTPUT CURRENT CHARACTERISTICS
Power Supply Voltage Output Current Characteristics (Ta=25°C, VAOUT=0V)
AOUT Output Current [mA]
Power Supply Voltage
Temperature Output Current Characteristics (VDD=5V, VAOUT=0V)
AOUT Output Current [mA]
Ambient Temperature [°C]
VREF Voltage Output Current Characteristics (Ta=25°C, VDD=5V, VAOUT=0V)
AOUT Output Current [mA]
VREF
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CONFIGURATION MSM9802
Layout Chip size Chip thickness size Substrate potential X=3.22mm Y=3.17mm 350µm 30µm 110µm 110µm
Y-axis MSM9802
X-axis
(NC)
Coordinates (Chip center located Y=0)
(Unit: Name (A0) (A1) (A2) RESET XT/CR VREF AOUT X-axis -415 -816 -1460 -1460 -1458 -1460 -1460 -1135 -585 Y-axis 1385 1385 1385 1049 -899 -1375 -1333 -1333 Name OSC1 OSC2 OSC3 CPU/STD ST/(RND) I0/(SW0) I1/(SW1) I2/(SW2) X-axis 1349 1460 1389 1389 1389 Y-axis -1347 -1333 -1333 -972 1058 1385 1385 1385
name parentheses stand-alone mode. 46/51
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MSM9803
Layout Chip size Chip thickness size Substrate potential X=3.22mm Y=4.06mm 350µm 30µm 110µm 110µm
Y-axis
MSM9803
X-axis
(NC)
Coordinates (Chip center located Y=0)
Name (A0) (A1) (A2) RESET XT/CR VREF AOUT X-axis -415 -816 -1460 -1460 -1458 -1460 -1460 -1135 -585 Y-axis 1829 1829 1829 1493 -1342 -1818 -1776 -1776 Name OSC1 OSC2 OSC3 CPU/STD ST/(RND) I0/(SW0) I1/(SW1) I2/(SW2) X-axis 1349 1460 1389 1389 1389
(Unit: Y-axis -1788 -1776 -1776 -1415 1502 1829 1829 1829
name parentheses stand-alone mode.
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MSM9802/03/05-xxx
MSM9805
Layout Chip size Chip thickness size Substrate potential X=3.22mm Y=5.96mm 350µm 30µm 110µm 110µm
Y-axis
MSM9805 X-axis
(NC)
Coordinates (Chip center located Y=0)
Name (A0) (A1) (A2) RESET XT/CR VREF AOUT X-axis -415 -816 -1460 -1460 -1458 -1460 -1460 -1136 -585 Y-axis 2777 2777 2777 -1546 -2768 -2726 -2726 Name OSC1 OSC2 OSC3 CPU/STD ST/(RND) I0/(SW0) I1/(SW1) I2/(SW2) X-axis 1349 1460 1453 1455 1432
(Unit: Y-axis -2723 -2726 -2726 -1532 1338 2777 2777 2777
name parentheses stand-alone mode. 48/51
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PACKAGE DIMENSIONS
(Unit
DIP18-P-300-2.54
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 1.30 TYP.
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MSM9802/03/05-xxx
(Unit
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.58 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
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Semiconductor
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(Unit
SSOP30-P-56-0.65-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.19 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
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E2Y0002-29-62
NOTICE
information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents contained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation.
Copyright 1999 Electric Industry Co., Ltd.
Printed Japan

Semiconductor MSM9802/03/05-xxx Voice Synthesis with Built-in Mas

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