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LZ0P3817 LZ0P3817 1/4-type (4.5 000pixel built-in lens color CMOS
Top Searches for this datasheetLZ0P3817 LZ0P3817 LZ0P3817 1/4-type (4.5 000pixel built-in lens color CMOS (Complementary Metal Oxide Semiconductor) image sensor that consists timing generator (TG), correlated double sampling (CDS) circuit, auto gain control (AGC) circuit analog-to-digital converter (ADC) circuit. With small lens LCC-type flat package, possible make ultra small color camera easily. 1/4-type Built-in Lens Color CMOS Image Sensor with Pixels CONNECTIONS 36-PIN TYPE REFIN SIGOUT VIEW SIGIN BIAS2 LOAD BIAS1 AGCOUT AGND AVDD STBY SCLK CLP1 CLP2 FEATURES Progressive scan Square pixel Compatible with standard Number image pixels Number optical black pixels Horizontal front rear Vertical front rear Pixel pitch primary color mosaic filters Image inversion function (horizontally and/or vertically) Available types power save mode circuits become power-off with serial data circuits become power-off with STBY Monitoring mode Analog output 8-bit digital output Variable gain control Variable electronic focal plane shutter (1/15 Single +2.8 power supply Built-in cut-off filter Integrated lens horizontal viewing angle Package 36-pin LCC* type Outline dimensions 11.4 11.4 Height Approx. AVDD DGNG AGND DVDD PRECAUTIONS Refer "PRECAUTIONS BUILT-IN LENS CMOS IMAGE SENSORS". absence confirmation device specification sheets, SHARP takes responsibility defects that occur equipment using SHARP devices shown catalogs, data books, etc. Contact SHARP order obtain latest device specification sheets before using SHARP device. Leadless Chip Carrier LZ0P3817 BLOCK DIAGRAM DATA CONTROL 8-BIT ANALOG VIDEO OUTPUT OUTPUT CMOS IMAGE SENSOR 8-BIT DIGITAL VIDEO OUTPUT LZ0P3817 SYMBOL BIAS1 AGCOUT AGND AVDD STBY AGND AVDD DGND DVDD SCLK LOAD CLP2 CLP1 Analog Analog Analog Analog Analog Analog Analog Digital Analog Analog Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital DESCRIPTION Analog bias voltage image sensor output Analog ground Analog power supply Offset bias voltage output Bottom reference voltage reference voltage connection Standby control mode* Analog ground Analog power supply Digital ground Digital power supply Clock input oscillator (12.27 MHz) Clock output oscillator signal output signal output signal output signal output signal output signal output signal output (MSB) Clock output (6.135 MHz) Horizontal drive pulse input Vertical drive pulse input Control data input (AGC gain, offset, shutter control, Digital Digital Analog Analog Analog Analog Analog Analog SIGOUT SIGIN BIAS2 REFIN Standby mode functions High level Standby mode (all circuits power-off), level open Normal mode (all circuits active) image inversion, etc.) Shift clock data Load pulse data input Analog bias voltage clamp circuit Analog bias voltage clamp circuit Analog image signal output Analog image signal input Analog bias voltage image sensor Reference voltage analog input connection signal output (LSB) LZ0P3817 ABSOLUTE MAXIMUM RATINGS PARAMETER Power supply voltage Input signal voltage Storage temperature SYMBOL TSTG RATING -0.3 +4.6 -0.3 UNIT RECOMMENDED OPERATING CONDITIONS PARAMETER Power supply voltage Operating temperature Oscillation frequency Digital input voltage Analog input voltage Analog bias voltage Normal mode Monitoring mode level HIGH level SYMBOL TOPR 0.8VDD (Connect through capacitor) (Connect MIN. TYP. 12.27 0.2VDD MAX. UNIT NOTE NOTES Applied input pins STBY, SDI, SCLK LOAD. Applied input pins SIGIN REFIN. connect directly. Applied pins BIAS1, BIAS2, OFS, ADL, ADH, CLP1 CLP2. connect directly. through capacitor) LZ0P3817 CHARACTERISTICS (1/15 progressive scan readout mode) +25°C, Operating conditions typical values specified "RECOMMENDED OPERATING CONDITIONS". Color temperature light source Measurement point Analog image signal output (pin No.32), before circuit converter. PARAMETER Standard output voltage Saturation output voltage Dark output voltage Sensitivity (Green channel) Vertical line fixed pattern noise Resolution center) Resolution corner) Shading Difference center position Standby current Supply current ISTBY IVDD SYMBOL VSAT VDARK VFPN MIN. TYP. MAX. UNIT NOTE NOTES average output voltage signal central area (H/10, V/10) under uniform illumination. standard exposure conditions defined when average output voltage signal central area (H/10, V/10) under times exposure standard exposure conditions. difference between average output voltage image area that area, under nonexposure conditions. average output voltage signal central area (H/10, V/10) when light source with reflector imaged. mean horizontal line signal <bi> obtained adding horizontal line signals <aij> vertically dividing them line number. <xi> deviation center pixel from average successive pixels <bi>. VFPN maximum absolute value <xi>. resolution central area (H/10, V/10) which image resolution chart (ex. EIAJ test chart) distinguished video monitor when converted into composite video signal. resolution peripheral area (image height 0.7) under conditions mentioned above. Defined following formula brightness standard output voltage signal (Vco/Vce) Output voltage edge (image height 0.7) image. Output voltage center image. difference between center position image that monitor. This ratio horizontal underscanning monitor size which includes decentering eccentricity when turning lens head time. Total current power supply standby mode. (Pin No.9 (STBY) fixed level other input pins fixed level level.) Total current analog digital power supplies, dark standard load conditions. line line mVp-p LZ0P3817 LENS SPECIFICATIONS PARAMETER Construction Focal length Viewing angle distortion Focus adjustment range Torque focusing SPECIFICATION Single (non-spherical, plastic) mm±5% [reference] 2.8±5% 62°, 50°, Diagonal [TYP. reference] 0.0005 0.01 NOTE Image area 3.67 2.76 distortion defined formula, (y/y) capturing rectangular pattern sized horizontal vertical defined vertical height center horizontal line. defined difference between vertical height center horizontal line edge careful remove lens head turning counterclockwise much when adjusting macro. best focus point object obtained turning lens head within this range. Torques which necessary turning lens. NOTES LZ0P3817 PIXEL STRUCTURE OPTICAL BLACK PIXELS) OPTICAL BLACK PIXELS) OPTICAL BLACK PIXELS) OPTICAL BLACK PIXELS) 493) COLOR FILTER ARRAY (655, 493) (655, LZ0P3817 TIMING CHART [Normal Mode] HORIZONTAL PULSE TIMING ADOUT (D0-D7) Normal 655OBOB Mirror ADOUT (D0-D7) Normal OBOB Mirror OB655 rising edge pulse must between rising edges (1). falling edge pulse must between rising edges (78) (79). PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) CLOCK (CLK) ADOUT (D0-D7) SYMBOL MIN. Shutter TYP. MAX. UNIT Offset VERTICAL PULSE TIMING SDI, SCLK, LOAD Forbidden Period ADOUT (D0-D7) Normal Mirror rising edge falling edge pulse must high period pulses. SERIAL DATA TIMING (SDI, SCLK, LOAD) Fixed Gain SCLK LOAD Data taken rising edge SCLK. Clock frequency SCLK should less than that CLK. insert SDI, SCLK LOAD pulses between 28H* 29H*. Refer "VERTICAL PULSE TIMING". Refer "SERIAL DATA INPUTS" contents serial data from D37. means ordinal number pulse. LZ0P3817 [Monitoring Mode] HORIZONTAL PULSE TIMING ADOUT (D0-D7) Normal 655OB Mirror ADOUT (D0-D7) Normal Mirror OB655 rising edge pulse must between rising edges (1). falling edge pulse must between rising edges (78) (79). PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) CLOCK (CLK) ADOUT (D0-D7) SYMBOL MIN. Shutter TYP. MAX. UNIT Offset VERTICAL PULSE TIMING SDI, SCLK, LOAD Forbidden Period ADOUT (D0-D7) Normal Mirror rising edge falling edge pulse must high period pulses. SERIAL DATA TIMING (SDI, SCLK, LOAD) Fixed Gain SCLK LOAD Data taken rising edge SCLK. Clock frequency SCLK should less than that CLK. insert SDI, SCLK LOAD pulses between 15H* 16H*. Refer "VERTICAL PULSE TIMING". Refer "SERIAL DATA INPUTS" contents serial data from D37. means ordinal number pulse. LZ0P3817 SERIAL DATA INPUTS DATA MAX2 (MSB) MAX1 MAX0 (LSB) OFS7 (MSB) OFS6 OFS5 OFS4 OFS3 OFS2 OFS1 OFS0 (LSB) SHT9 (MSB) SHT8 SHT7 SHT6 SHT5 SHT4 SHT3 SHT2 SHT1 SHT0 (LSB) MIRH MIRV NAME AGC6 (MSB) AGC5 AGC4 AGC3 AGC2 AGC1 AGC0 (LSB) Selection fixed gain Offset level control (0.9 Auto gain control FUNCTION Shutter speed control SAD2 (MSB) SAD1 SAD0 (LSB) LPMD1 LPMD0 (Normal mode Exposure time 1/525 frame period.) (Monitoring mode Exposure time 1/262 frame period.) Horizontal mirror inversion image, Normal image Vertical mirror inversion image, Normal image Monitoring mode, Normal mode Phase selection clock D32/D33/D34 L/L/L -30° D32/D33/D34 L/H/L Power save mode D35/D36 Normal mode D32/D33/D34 L/L/H -15° D32/D33/D34 L/H/H +15° D35/D36 D35/D36 D35/D36 Inhibited mode Inhibited mode, Normal mode used. (Fix level.) LZ0P3817 Setting Auto Gain Control gain code represents approximately 0.156 Nominal gain values typical codes shown below. AUTO GAIN CONTROL (dB) Setting Fixed Gain FIXED GAIN (dB) gain code represents LZ0P3817 Setting Offset Level offset code represents approximately 0.002 Nominal offset values typical codes shown below. OFFSET LEVEL Setting Shutter Speed shutter speed code represents where pulse period. Shutter speed values typical codes shown below normal mode, monitoring mode mode. SHUTTER SPEED (Exposure Time Unit Normal Monitoring Setting Driving Modes FUNCTION Normal mode Monitoring mode Insert capacitors more than between AVDD AGND between DVDD DGND. Capacitors whose values shown must (6.135 MHz) DVDD DGND AVDD AGND Digital Power Supply Oscillator (12.27 MHz) AVDD BIAS1 AGND AGCOUT CLP2 CLP1 SCLK LOAD LZ0P3817 (TOP VIEW) EXAMPLE OPERATION CIRCUIT SIGOUT SIGIN BIAS2 REFIN STBY Analog Power Supply LZ0P3817 LZ0P3817 PACKAGE OUTLINES TYPE Center effective imaging area 11.40±0.1 Center package 0.70 3-C0.2 11.40±0.1 P10.80±0.05 Under development (Unit 0.65±0.1 P10.80±0.05 36-1.27 Index mark 11.20±0.1 (M7XP0.35) R0.20 No.1mark 3-R0.30±0.05 1.20 36-R0.15 32-1.00 Approx.7.0 (INF) 5.70±0.2 +0.1 0.30-0 0.70 3.00±0.2 P10.80±0.05 11.40±0.1 0.50±0.1 1.20 1.80 LZ0P3817 36-0.60 11.40±0.1 R0.4 11.20±0.1 36-0.30 LZ0P3817 PRECAUTIONS BUILT-IN LENS CMOS IMAGE SENSORS Package Breakage order prevent package, lens holder, lens from being broken, follow instructions below built-in lens CMOS image sensor precise optical component packagebase material ceramic. Therefore, Take care drop device when mounting, handling, transporting. Avoid giving shock package. Especially when pins fixed socket circuit board, small shock could break package more easily than when package isn't fixed. damage breakage occurs surface lens, characteristics could deteriorate. Therefore, lens. give shock large enough cause distortion. scrub scratch surface lens. Even soft cloth applicator, dry, could cause flaws scratch lens. avoid generating static electricity, scrub lens package with cloth etc. attach tape labels. When storing transporting device, container conductive material. Dust Contamination Dust contamination surface lens inside lens holder could deteriorate output characteristics cause scar. order minimize dust contamination device, take following precautions remove lens from body. Especially when adjusting macro, careful remove lens turning counterclockwise much. touch surface lens with fingers. dust contamination gets surface lens, following cleaning method recommended Handle built-in lens CMOS image sensor clean environment such cleaned booth. (The cleanliness level should possible, class least.) Dust from static electricity should blown with ionized blower. antielectrostatic measures, however, ground pins device before blowing dust. contamination surface lens should wiped with clean applicator soaked isopropyl alcohol. Wipe slowly gently direction only. Frequently replace applicator same applicator clean more than device. Make sure there dust contamination lens screw lens holder. Electrostatic Damage compared with general MOS-LSI, CMOS image sensor lower ESD. Therefore, take following antistatic measures when handling CMOS image sensor Always discharge static electricity grounding human body instrument used. ground human body, provide resistance about between human body ground safe side. When directly handling device with fingers, hold lens holder touch pin. LZ0P3817 Other Soldering should manually performed within seconds 400°C maximum soldering iron. ESD-measured soldering iron conditions soldering time which soldering iron touches package. case where soldering exceed seconds pin, resume work after device returns normal temperature. much force onto lens lens holder while soldering. careful soldering iron touch lens holder. Soldering quickly/neatly done laying soldering iron lightly touches border between package circuit board sliding sideways. There guarantee performance device which been removed resoldered after being soldered once under conditions mentioned above. Avoid using storing built-in lens CMOS image sensor high temperature high humidity precise optical component. give mechanical shock built-in lens CMOS image sensor. expose device strong light. color device, long exposure strong light will fade color color filters. Other recent searchesXDUR46A - XDUR46A XDUR46A Datasheet MSC23436C-xxBS10 - MSC23436C-xxBS10 MSC23436C-xxBS10 Datasheet DS10 - DS10 DS10 Datasheet MAX9247 - MAX9247 MAX9247 Datasheet MAX9248 - MAX9248 MAX9248 Datasheet MAX9247ECM+ - MAX9247ECM+ MAX9247ECM+ Datasheet MAX9247GCM+ - MAX9247GCM+ MAX9247GCM+ Datasheet MAX9248ECM+ - MAX9248ECM+ MAX9248ECM+ Datasheet MAX9248GCM+ - MAX9248GCM+ MAX9248GCM+ Datasheet LC875064B - LC875064B LC875064B Datasheet 2SC4616 - 2SC4616 2SC4616 Datasheet 1333100000 - 1333100000 1333100000 Datasheet
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