µPC2781GR µPC2781GR Silicon monolithic designed demodulator digit

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µPC2781GR µPC2781GR Silicon monolithic designed demodulator digit

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µPC2781GR
µPC2781GR Silicon monolithic designed demodulator digital communication systems. This consists amplifier, dual balanced mixers (DBM), oscillator, quadrature phase shifter output buffer amplifiers. package 20-pin SSOP (shrink small outline package) suitable high-density surface mount.
FEATURES
chip quadrature (90°) phase shifter phase amplitude balance Amplitude Balance degree Phase Balance distortion Supply Voltage Packaged 20-pin SSOP suitable high-density surface mount
ORDERING INFORMATION
PART NUMBER PACKAGE 20-pin plastic SSOP (225 mil) PACKAGE STYLE Embossed tape wide. k/REEL indicates pull-out direction tape
µPC2781GR-E1
evaluation sample order, please contact your local office. (Part number sample order: µPC2781GR)
Caution: electro-static sensitive device
information this document subject change without notice.
Document P12511EJ2V0DS00 (2nd edition) Date Published June 1998 CP(K) Printed Japan
1997
µPC2781GR
INTERNAL BLOCK DIAGRAM CONFIGURATION (Top View)
(IQ) VAGC Buffer MIXER phase shifter Amp. OSC-B1 (PS) Q-OUT Q-OUT I-OUT I-OUT OSC-B2 OSC-C1 OSC-C2
(IF)
(IQ) (IF) (PS)
µPC2781GR
FUNCTIONS
NAME (IQ) VAGC VOLTAGE TYP. Ground outputs block. Power supply I-output. Gain control pin. measurement circuit VAGC Full gain VAGC Full reduction measurement circuit VAGC Full gain VAGC Full reduction
FUNCTION EXPLANATION
EQUIVALENT CIRCUIT
(IF) IFin
Ground MIX, block. input pins. case single input, should grounded through capacitor.
IFin
(IQ) (IF)
Ground outputs block. Power supply MIX, block.
(PS)
Power supply Q-output. Power supply Phase Shifter block.
Qout
Q-signal output pin. balance outputs.
Qout
µPC2781GR
NAME (PS) VOLTAGE TYP. Ground Phase Shifter block. External local OSC-B1 Oscillator signal input pin. case single input, should grounded through capacitor. OSC-C2 OPEN Connected resonator through capacitor. Connected capacitor between oscillate with active feedback loop. OSC-C1 OPEN OPEN Connected capacitor between oscillate with active feedback loop. OSC-B2 Oscillator signal input pin. case single input, should grounded through capacitor.
<External Local> <SAW resonator (single)>
FUNCTION EXPLANATION
EQUIVALENT CIRCUIT
(single) Grounded through 1000 capacitor.
(balance) Connected resonator through capacitor.
Connected resonator through capacitor.
Connected resonator through capacitor.
<SAW resonator (balance)>
Resistor adjust oscillator power.
Oscillator signal output pin.
Iout
I-signal output pin. balance outputs.
Iout
µPC2781GR
ABSOLUTE MAXIMUM RATINGS 25°C unless otherwise specified)
PARAMETER Supply Voltage Power Dissipation Operating Ambient Temperature Storage Temperature Range SYMBOL Tstg 5.25
TEST CONDITION
RATING +150
UNIT
PARAMETER Supply Voltage Power Dissipation Operating Ambient Temperature Storage Temperature Range
SYMBOL Tstg
TEST CONDITION
RATING
UNIT
5.15
+150
Mounted double epoxy glass board.
RECOMMENDED OPERATING RANGE
PARAMETER Supply Voltage Operating Ambient Temperature Input Level Range Gain Control Voltage Range Gain Control Voltage Range SYMBOL VCC1 VAGC1 VAGC2 Vout VP-P TEST CONDITION MIN. 4.75 TYP. MAX. 5.25 UNIT
PARAMETER Supply Voltage Operating Ambient Temperature Input Level Range Gain Control Voltage Range Gain Control Voltage Range
SYMBOL VCC2 VAGC1 VAGC2
TEST CONDITION
MIN. 4.75
TYP.
MAX. 5.15
UNIT
Vout Vp-p
measurement circuit External Resistance: measurement circuit External Resistance:
µPC2781GR
ELECTRICAL CHARACTERISTICS 25°C, Zout
PARAMETER Circuit Current Input Frequency Output Frequency SYMBOL TEST CONDITIONS input signal MHz, fOSC MIN. 52.0 TYP. 70.0 MAX. 88.0 UNIT
fOSC, Vout VP-P, POSC dBm, (@fIQ MHz) MHz, dBm, fOSC MHz, POSC dBm, MHz, VAGC MHz, dBm, fOSC MHz, POSC dBm, MHz, VAGC
Gain Control Range
GCR1
Gain Control Range
GCR2
Phase Balance
MHz, fOSC MHz, POSC dBm, MHz, Vout VP-P
Amplitude Balance
MHz, fOSC MHz, POSC dBm, MHz, Vout VP-P
-0.5
+0.5
Output Voltage
Vout
VP-P
measurement circuit External Resistance: measurement circuit External Resistance:
µPC2781GR
STANDARD CHARACTERISTICS 25°C, Zout
PARAMETER Conversion Gain SYMBOL TEST CONDITIONS MHz, fOSC MHz, POSC dBm, MHz, VAGC Noise Figure (DSB) MHz, fOSC MHz, POSC dBm, MHz, VAGC Third Intermodulation Distortion fIF1 MHz, fIF2 MHz, fOSC MHz, POSC dBm, 0.708 VP-P/tone Isolation (LO-IF) fOSC MHz, POSC Isolation (LO-IQ) fOSC MHz, POSC Maximum Output Power Output Impedance Input Impedance Input Return Loss (sat) (IQ) (IF) (IF) POSC dBm, MHz, tuning MHz, tuning REFERENCE VALUE UNIT
measurement circuit External Resistance: measurement circuit External Resistance: measurement circuit
µPC2781GR
TYPICAL CHARACTERISTICS
Pout
Pout /1050 Output Power
Curve
Circuit Current
input signal
fOSC POSC Vout VP-P measurement circuit Output Frequency
Supply Voltage
Curve
Pout /1050 Output Power
Pout /1050 Output Power
fOSC POSC measurement circuit 4.75 5.00 5.25 VAGC Voltage
fOSC POSC measurement circuit 4.75 5.00 5.25 VAGC Voltage
µPC2781GR
TYPICAL CHARACTERISTICS
Amplitude Balance fOSC POSC Vout VP-P measurement circuit Phase Balance fOSC POSC Vout VP-P measurement circuit
Amplitude Balance (Q/I)
-0.1 -0.2 -0.3 -0.4
Phase Balance
4.75 5.00 5.25
Input Power
4.75 5.00 5.25 Input Power
Amplitude Balance fOSC POSC Vout VP-P measurement circuit
Phase Balance fOSC POSC Vout VP-P measurement circuit
Amplitude Balance (I/I)
-0.1 -0.2 -0.3 -0.4
Phase Balance
4.75 5.00 5.25
Input Power
4.75 5.00 5.25 Input Power
Amplitude Balance fOSC POSC Vout VP-P measurement circuit
Phase Balance fOSC POSC Vout VP-P measurement circuit
Amplitude Balance (Q/I)
-0.1 -0.2 -0.3 -0.4
Phase Balance
4.75 5.00 5.25 Output Frequency
4.75 5.00 5.25 Output Frequency
µPC2781GR
STANDARD CHARACTERISTICS
Pout
Pout /1050 Output Power Pout /1050 Output Power
Pout
fOSC POSC VAGC measurement circuit 4.75 5.00 5.25 Input Power
fOSC POSC VAGC measurement circuit Input Power
Third intermodulation distortion (2tone 1VP-POutput) Third order intermodulation distortion (2tone 1VP-POutput)
fOSC POSC Vout 0.708 VP-P /tone measurement circuit 4.75 5.00 5.25 PIF/tone Input Power
fOSC POSC Vout 0.708 VP-P /tone measurement circuit PIF/tone Input Power
Pout /1050 )/tone Output Power
fOSC POSC VAGC measurement circuit 4.75 5.00 5.25 PIF/tone Input Power
µPC2781GR
INPUT IMPEDANCE
-5.1648
Units 200.0 mUnits/
START STOP
0.045000000 1.000000000
MARKER 479.52 166.72 -31.203
MARKER 86.18 -70.629
MARKER 102.3 157.49 58.977
OUTPUT IMPEDANCE (VCC
24.541 1.1425 18.185 10.000
START 0.500
STOP 000.000
µPC2781GR
MEASUREMENT CIRCUIT
VAGC 1000 1000 Amp. phase shifter 1000 Buffer 1000 1000 MIXER
case measurement IM3. Vector Signal Analyzer Vector Voltage Meter measurement phase balance amplitude balance. Spectrum Analyzer measurement bandwidth IM3.
µPC2781GR
MEASUREMENT CIRCUIT
VAGC 1000 1000 Amp. phase shifter 1000 Buffer 1000 1000 MIXER
case measurement IM3. Vector Signal Analyzer Vector Voltage Meter measurement phase balance amplitude balance. Spectrum Analyzer measurement bandwidth IM3.
µPC2781GR
MEASUREMENT CIRCUIT
Meter
MIXER
VAGC
1000 1000 Amp. phase shifter Buffer
1000 1000
Noise Source
1000
µPC2781GR
APPLICATION CIRCUIT EXAMPLE
VAGC 1000 1000
application circuits their parameters reference only intended actual design-ins.
MIXER
phase shifter Amp. Buffer
1000 Resonator (MURATA: SAR479.45MB 10X200) 1000
µPC2781GR
ILLUSTRATION APPLICATION CIRCUIT ASSEMBLED EVALUATION BOARD
1000
1000
1000
UPC2781GR
1000
VAGC
NOTES
shows short circuited strip ground Pattern should removed this application shows through holes
µPC2781GR
PACKAGE DIMENSIONS
PLASTIC SSOP (225 mil) (UNIT:
detail lead
NOTE Each lead centerline located within 0.12 (0.005 inch) true position (T.P.) maximum material condition. ITEM MILLIMETERS 7.00 MAX. 0.575 MAX. 0.65 (T.P) 0.22 +0.10 -0.05 0.1±0.1 MAX. 1.5±0.1 6.4±0.2 4.4±0.1 0.15 +0.10 -0.05 0.5±0.2 0.10 0.15 INCHES 0.276 MAX. 0.023 MAX. 0.026 (T.P) 0.009 +0.004 -0.002 0.004±0.004 0.071 MAX. 0.058±0.004 0.253±0.008 0.174±0.004 0.040 0.060 +0.004 -0.002 0.020 +0.008 -0.004 0.004 0.006
µPC2781GR
RECOMMENDED SOLDERING CONDITIONS
following conditions (see table below) must when soldering this product. Please consult with sales officers case other soldering process used case soldering done under different conditions. details recommended soldering conditions surface mounting, refer information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
PC2781GR
Soldering process Infrared reflow Soldering conditions Peak package's surface temperature: 235°C below, Reflow time: seconds below (210 higher), Number reflow process: Exposure limit
Note
Symbol IR35-00-3
None VP15-00-3
Peak package's surface temperature: below, Reflow time: seconds below (200 higher), Number reflow process: Exposure limit
Note
None WS60-00-1
Wave soldering
Solder temperature: below, Reflow time: seconds below, Number reflow process: Exposure limit
Note
None
Partial heating method
Terminal temperature: below, Flow time: seconds below, Exposure limit
Note
None
Note Exposure limit before soldering after dry-pack package opened. Storage conditions: relative humidity less. Caution apply more than single process once, except "Partial heating method".
µPC2781GR
[MEMO]
µPC2781GR
application circuits their parameters reference only intended actual design-ins.
part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customers must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact sales representative advance. Anti-radioactive design implemented this product.
NESAT (NEC Silicon Advanced Technology) trademark Corporation.

µPC2781GR µPC2781GR Silicon monolithic designed demodulator digit

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