formerly General Semiconductor Single-Phase Bridge Rectifier

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formerly General Semiconductor Single-Phase Bridge Rectifier

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KBU8A thru KBU8M
formerly General Semiconductor
Single-Phase Bridge Rectifier
Case Style
0.935 (23.7) 0.160 (4.1) 0.140 (3.6) 0.895 (22.7) 0.185 (4.7) 0.165 (4.2) 0.700 (17.8) 0.660 (16.8) 0.075 (1.9) TYP. PLACES) 0.455 (11.3) 0.405 (10.3)
Reverse Voltage 1000 Forward Current
Features
0.085 (2.2) 0.065 (1.7)
0.760 (19.3) MAX.
(25.4) MIN. 0.052 (1.3) 0.048 (1.2) DIA. 0.220 (5.6) 0.180 (4.6)
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 This series listed under Recognized Component Index, file number E54214 High case dielectric strength 1500 VRMS Ideal printed circuit boards High forward surge current capability High temperature soldering guaranteed: 250°C/10 seconds, 0.375 (9.5mm) lead length, lbs. (2.3kg) tension
Mechanical Data
Case: Molded plastic body Terminals: Plated leads solderable MIL-STD-750, Method 2026 Mounting Position: (Note Mounting Torque: -lb. max.
Dimensions inches (millimeters)
0.240 (6.09) 0.200 (5.08)
0.205 (5.2) 0.185 (4.7)
0.280 (7.1) 0.260 (6.6)
Weight: oz., Packaging codes/options: 1/250 Bulk Tray Stack
Ratings 25°C ambient temperature unless otherwise specified.
Maximum Ratings Thermal Characteristics
Symbols Maximum repetitive peak reverse voltage Maximum voltage Maximum blocking voltage Maximum average forward rectified output current TC=100°C TA=45°C VRRM VRMS IF(AV) IFSM
+150
1000 1000
Units °C/W
Peak forward surge current single sine-wave superimposed rated load (JEDEC Method) TJ=150°C Typical thermal resistance
Operating junction storage temperature range TSTG
Electrical Characteristics
Maximum reverse current rated blocking voltage
Ratings 25°C ambient temperature unless otherwise specified.
Maximum instantaneous forward drop 25°C TA=125°C
Notes: Recommended mounting position bolt down heatsink with silicone thermal compound maximum heat transfer with screw Units mounted free air, heatsink, P.C.B. 0.375" (9.5mm) lead length with 0.5" 12mm) copper pads Units mounted 3.0" 0.11" thick (7.5 0.3cm) Plate heatsink
Document Number 88658 09-Jul-02
www.vishay.com
KBU8A thru KBU8M
formerly General Semiconductor
Ratings Characteristic Curves 25°C unless otherwise noted)
Fig. Derating Curve Output Rectified Current
Fig. Maximum Non-Repetitive Peak Forward Surge Current
Peak Forward Surge Current
Average Forward Current
Heatsink Mounting, Plate (7.5 0.3cm)
150°C Single Sine-Wave (JEDEC Method)
P.C.B. Mounting, 0.375" (9.5mm) Lead Length 0.5" 12mm) Copper Pads Resistive Inductive Load
Cycle
Temperature (°C)
Number Cycles
Fig. Typical Instantaneous Forward Characteristics
Instantaneous Reverse Current (µA)
Fig. Typical Reverse Leakage Characteristics
Instantaneous Forward Current
100°C
25°C Pulse Width 300µs Duty Cycle
25°C
0.01
Instantaneous Forward Voltage
Percent Rated Peak Reverse Voltage
Fig. Typical Junction Capacitance
25°C 1.0MHZ Vsig 50mVp-p
Junction Capacitance,
Reverse Voltage www.vishay.com Document Number 88658 09-Jul-02

formerly General Semiconductor Single-Phase Bridge Rectifier

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