Receiver RFIC Dual-Band Triple Mode FC1703 designed primarily rec
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FC1703
Receiver RFIC Dual-Band Triple Mode
FC1703 designed primarily receiver front-end dual-band, triple-mode system, operating Advanced Mobile Phone System (AMPS), Cellular Code-Division Multiple-Access (CDMA), CDMA. contains low-noise amplifiers (LNA), mixers with balanced outputs. unit operates 2.7V single power designed with filter. possible adjust current level, gain, IIP3 changing resistors. manufactured SiGe BiCMOS process, packaged leadless small package, named MLF-24
FEATURES
Complete Receiver Front-end dual-band Cellular/PCS Mobile-phone System, (AMPS CDMA) Integrated LNA, Down-converting mixers Triple-mode Single voltage operation (2.7V) High Linearity power consumption Adjustable IIP3, Gain Current Small leadless package
CONFIGURATION
PLNA_OUT PMIX_IN
APPLICATIONS
AMPS-mode Cellular mobile phone. CDMA-mode Cellular mobile phone. Japan CDMA-mode Cellular mobile phone.
PLNA_IN
RPMIX
SEL3
SEL2
FM_IF
CDMA-mode -PCS mobile phone.
RLNA
FM_IFB
CDMA-mode Korean-PCS mobile phone. Cellular CDMA/AMPS/US -PCS Dual-band Triple-mode mobile phone. Japan-CDMA/Korea-PCS Dual-band mobile phone General Purpose Down-Converter.
SEL1
BufferEn
RCMIX
CDMA_IF
CLNA_GND
CDMA_IFB
CLNA_IN
LO_OUT
CLNA_OUT
LO/2
CMIX_GND
CMIX_IN
VDD_LO
LO_IN
latest specifications, technical questions additional product information, visit website e-mail Web: http://www.fci.co.kr Inc. E-mail info@fci.co.kr Korea First Bank B/D, Sunae Dong Pundang- Sungnam City, Kyunggi-do, 82-31-711-6444 463-020, KOREA Fax: 82-31- 714-6576
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
DESCRIPTIONS
Function PLNA_IN RLNA SEL1 RCMIX CLNA_GND CLNA_IN CLNA_OUT LO/2 CMIX_GND CMIX_IN VDD_LO LO_IN LO_OUT CDMA_IFB CDMA_IF BufferEn FM_IFB FM_IF RPMIX SEL2 PMIX_IN SEL3 PLNA_OUT Description
High-Band Input. Requires blocking capacitor which used part input matching network Bias-Setting Resistor Connection Control Pin. Truth Table Mode Select Pin. Cellular Mixer Bias-Setting Resistor Connection Ground Reference Cellular LNA. This should connected through ohm. -Band Input. Requires blocking capacitor which used part input matching network -Band Output Port. Connect pull-up inductor external series blocking capacitor which used part output matching network Divider-Select Input. disables divider, HIGH selects divider cellular modes. Truth Table Mode Select Pin. Ground Reference Cellular Mixer. This should connected through ohm. -Band Mixer Input. Requires blocking capacitor which used part input matching network. Power Supply Input Port. Requires external blocking capacitor. Buffer Output Port. Mixer Output. Mixer Output. Pin14 matched Board. they matched differential 1000ohm. Output Buffer Enable. Drive BufferEn HIGH power output buffer associated with selected band. Truth Table Mode Select Pin. Output Output Pin17 matched Board. they matched single-ended 850ohm Mixer Bias Setting Resistor Connection Control Pin. Truth Table Mode Select Pin. High-Band Mixer Input. Requires blocking capacitor which used part input matching network. Power Supply Pin. Control Pin. Truth Table Mode Select Pin. High-Band Output Port. Connect pull-up inductor external series blocking capacitor which used part output matching network
Note
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
APPLICATIONS
Cellular CDMA/AMPS US-PCS ABSOLUTE MAXIMUM ATINGS
Parameter Supply Voltage Digital Input Voltage Input Power Level Storage Temperature Operating Temperature Junction Temperature Lead Temperature(Soldering, 10sec) Unit Rating -0.5~ -0.3 Vcc+0.3 +150 +150 +240 Note
ELECTRICAL CHARACTERISTICS
(Vcc 3.1V, +80, Typical values 2.7V) Parameter Supply Voltage Unit Specification BufferEn High Cellular mode; LO/2=High Note
Cellular CDMA Mode Mode
US-PCS CDMA Mode
Shutdown Mode
Buffer Supply Current Additional Operational Current Divider Active
ELECTRICAL CHARACTERISTICS
Specification Parameter OVERALL CONDITION Low-Band Frequency Range High-Band Frequency Range Low-Band Frequency Range High-Band Frequency Range Frequency Range Input Level Unit Note
1930 1750
1990 1100 2210
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
Specification
Parameter
Unit
Note
CELLULAR PERFORMANCE HIGH-GAIN MODE Gain Noise Figure IIP3 MID-GAIN MODE Gain Noise Figure IIP3 BYPASS MODE Gain Noise Figure IIP3 US-PCS PERFORMANCE HIGH-GAIN MODE Gain Noise Figure IIP3 BYPASS MODE Gain Noise Figure IIP3 CELLULAR MIXER PERFORMANCE CDMA MODE Gain Noise Figure IIP3 18.5 -3.5 15.5 16.5 18.5 14.5 15.5
MODE
Gain Noise Figure IIP3 US-PCS MIXER PERFORMANCE Gain Noise Figure IIP3 MODES BufferEn HIGH -5dBm *note Gain, IIP3, Current adjustable changing resistor R1,R2 Output Level
Last Update 03/28/03
US-PCS 1930 1990
183.6MHz US-PCS/CDMA IADC
183.6MHz AMPS
US-PCS Duplexer
FC1703
FMIADC
Diplexer
Cellular Duplexer
SYSTEM BLOCK CONFIGURATION
FMQADC
228MHz CDMA/AMPS
QDAC
FC1703
Receiver RFIC Dual-Band Triple Mode
Last Update 03/28/03
Cellular 849MHz
modulator
Cellular Input from 2104 2173MHz Output from FC1703 1052 1077MHz Cellular 2113 2173MHz US-PCS 263MHz US-PCS
US-PCS 1850 1910MHz
IDAC
demodulator QADC
FC1703
Receiver RFIC Dual-Band Triple Mode
YPICAL APPLICATION SCHEMATIC (Cellular CDMA/AMPS US-PCS)
PMIX_IN
*0.15dB Line Loss* 2.7pF 3.9nH SEL3 4.7nH SEL2 27nH 100nF
27nH
10nF
56nH
FM_IF
*0.05dB Line Loss*
1.8pF
PLNA_OUT
*0.15dB Line Loss* 10nF
10nF
ohm(1%)
SEL3
BufferEN
PMIX_IN SEL2 RPMIX
PLNA_OUT
PLNA_IN
*0.15dB Line Loss* 6.8nH SEL1 10nF ohm(1%)
PLNA_IN
FM_IF
RLNA FM_IFB
SEL1
RCMIX
FC1703
CLNA_OUT CMIX_GND CMIX_IN
BufferEn
27nH
10nF
CDMA_IF
*0.05dB Line Loss* *1.5dB Transformer Loss*
CDMA_IF
CLNA_GND CDMA_IFB
CLNA_IN LO_OUT VDD_LO
27nH
ohm(1%)
CLNA_IN
*0.1dB Line Loss* 10nF 3.9nH 10nF
LO_IN
LO/2
10nF
N1:N2=16:1
LO_OUT
*0.2dB Line Loss Cellular* *0.3dB Line Loss PCS*
CLNA_OUT
*0.15dB Line Loss* 3.3pF 8.2nH
LO/2 10nF
LO_IN
*0.2dB Line Loss Cellular* *0.3dB Line Loss PCS*
necessary component. (The distances between FC1703 FC1703 short possible.) **CDMA_IF AMPS_IF tuned 180MHz
CMIX_IN
100nF 12nH 1.8pF *0.2dB Line Loss*
2.7V LO/2
100pF
100nF
NOTE: matching component values dependent board layout, filter frequency selected. Please contact application engineering assistance.
Measurement Condition
2.7V Low-Band Frequency (Center MHz) input Power Low-Band Mixer Frequency (Center MHz) input Power Low-Band Mixer Frequency 2098 2148 (Center 2120 MHz) input Power High-Band Frequency 1930 1990 (Center 1960 MHz) input Power High-Band Mixer Frequency :1930 1990 (Center 1960 MHz) input Power High-Band Mixer Frequency :2110 2170 (Center 2140 MHz) input Power Mixer Frequency
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
J-CDMA K-PCS ABSOLUTE MAXIMUM ATINGS
Parameter Supply Voltage Digital Input Voltage Input Power Level Storage Temperature Operating Temperature Junction Temperature Lead Temperature(Soldering, 10sec) Unit Rating -0.5~ -0.3 Vcc+0.3 +150 +150 +240 Note
ELECTRICAL CHARACTERISTICS
(Vcc 3.1V, +80, Typical values 2.7V) Specification Parameter Unit Supply Voltage BufferEn High J-CDMA mode; LO/2=High Note
J-CDMA Mode
K-PCS CDMA Mode
Shutdown Mode
Buffer Supply Current Additional Operational Current Divider Active
ELECTRICAL CHARACTERISTICS
Specification Parameter OVERALL CONDITION J-CDMA Frequency Range K-PCS Frequency Range Frequency Range Frequency Range Input Level Unit Note
1840 2000 183.6
1870 2110
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
Specification Parameter Unit J-CDMA PERFORMANCE HIGH-GAIN MODE Gain Noise Figure IIP3 MID-GAIN MODE Gain Noise Figure IIP3 BYPASS MODE Gain Noise Figure IIP3 K-PCS PERFORMANCE HIGH-GAIN MODE Gain Noise Figure IIP3 BYPASS MODE Gain Noise Figure IIP3 J-CDMA MIXER PERFORMANCE Gain Noise Figure IIP3 K-PCS MIXER PERFORMANCE Gain Noise Figure IIP3 MODES BufferEn HIGH -5dBm *note Gain, IIP3, Current adjustable changing resistor R1,R2 Output Level 18.5 -3.5 15.5 16.5 *note *note *note 18.5 14.5 15.5 *note *note *note Note
*note *note *note
10.5
*note *note *note
Last Update 03/28/03
K-PCS 1840 1870
183.6MHz J-CDMA/K-PCS IADC
K-PCS Duplexer
FC1703
FMIADC
Diplexer
J-CDMA Duplexer
SYSTEM BLOCK CONFIGURATION
FMQADC
128.6 J-CDMA
QDAC
FC1703
Receiver RFIC Dual-Band Triple Mode
Last Update 03/28/03
J-CDMA 886.85 925.35
modulator
J-CDMA 831.85 870.35 273.6 K-PCS
Output from FC1704 1015.45 1053.95MHz J-CDMA 2023.6 2053.6 K-PCS
Input from 2030.9 2107.9 J-CDMA 2023.6 2053.6 K-PCS
K-PCS 1750 1780
IDAC
demodulator QADC
FC1703
Receiver RFIC Dual-Band Triple Mode
YPICAL APPLICATION SCHEMATIC
PMIX_IN
*0.15dB Line Loss* 2.7nH 100nF
(J-CDMA K-PCS)
SEL3 SEL2
4.7nH 10nF
PLNA_OUT
*0.15dB Line Loss*
ohm(1%)
PMIX_IN
PLNA_OUT
RPMIX
SEL3
SEL2
BufferEN
FM_IF
PLNA_IN
*0.15dB Line Loss* 6.8nH SEL1 10nF ohm(1%)
PLNA_IN
RLNA FM_IFB
27nH 10nF
SEL1
RCMIX
FC1703
CLNA_OUT CMIX_GND CMIX_IN
BufferEn
*0.05dB Line Loss* *1.5dB Transformer Loss*
CDMA_IF
CLNA_GND CDMA_IFB
27nH
9.1k ohm(1%)
CLNA_IN LO_OUT VDD_LO LO_IN
LO/2
CLNA_IN
*0.1dB Line Loss* 10nF
10nF
N1:N2=16:1
5.6nH
LO_OUT
10nF *0.2dB Line Loss Cellular* *0.3dB Line Loss PCS*
CLNA_OUT
*0.15dB Line Loss* 3.3pF LO/2 6.8nH
LO_IN
*0.2dB Line Loss Cellular* *0.25dB Line Loss PCS*
necessary component. (The distances between FC1703 FC1704 short possible.) **IF tuned 180MHz
100nF 12nH 1.8pF
CMIX_IN
*0.2dB Line Loss*
LO/2
2.7V
100pF
100nF
NOTE: matching component values dependent board layout, filter frequency selected. Please contact application engineering assistance.
Measurement Condition
2.7V Low-Band Frequency (Center MHz) input Power Low-Band Mixer Frequency (Center MHz) input Power Low-Band Mixer Frequency 2098 2148 (Center 2120 MHz) input Power High-Band Frequency 1930 1990 (Center 1960 MHz) input Power High-Band Mixer Frequency :1930 1990 (Center 1960 MHz) input Power High-Band Mixer Frequency :2110 2170 (Center 2140 MHz) input Power Mixer Frequency
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
TRUTH ABLE SELECT
Mode Selection Gain Control
MODE Cellular CDMA with High-Gain Cellular CDMA with Mid-Gain Cellular CDMA with bypass Cellular CDMA with High-Gain CDMA with bypass Power Down
SEL1
SEL2
SEL3
Divider Control
Band Cellular AMPS CDMA
Mode (Use 1GHz band) LO/2 (User 2.1GHz band)
LO/2
Output Buffer Control
Band Cellular AMPS CDMA
Mode Output Buffer Output Buffer Output Buffer Output Buffer
BufferEN
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
EVALUATION BOARD INFORMATIONS
Board Size 6cm, Board Thickness 0.8mm, Board Material FR-4, Multi-Layer Assembly
Back
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
PACKAGE INFORMATION
4.00 2.00 3.75 1.875 0.50
Line
Device Marking Description FCI's Company Name 1703 Product Name YMDX Code Year code Month code code Manufacture code Identifier
3.75
1703
1.875
4.00
YMDX
View
0.42 0.23
2.00
0.85 0.01
2.34 0.65 1.17 PIN1 0.20 0.20
0.42
0.45
2.34 1.17
2.50
0.25 0.40 0.25 0.50 2.50
Bottom View
Side View
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
RECOMMENDED BOARD LAND PATTERN DIMENSIONS
Size 4.36
2.98
2.78
2.68
0.22
0.28
0.69
Dimensions
solder mask opening should microns larger than size resulting micron clearance between copper solder mask.
Typically each should have solder mask opening with solder mask between adjacent pads.
should noted that inner solder mask should rounded, especially corner leads allow enough solder mask corner area.
recommended that array thermal vias should incorporated 1.2mm pitch with diameter 0.33mm.
mask opening should microns smaller than thermal land size four sides. solder mask diameter should microns larger than diameter.
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
TAPE REEL FORMS DIMENSIONS
Reel Dimension
ORDERING INFORMATION
FC1203_BLK FC1203_TR1 FC1203_TR2 FC1203_EVB Device 1,500 2,500 Container Bulk (Anti-static bag) tape reel tape reel Anti-static
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
RECOMMENDED CONDITION REFLOW OLDERING
Figure shows typical process flow mounting surface mount packages printed circuit boards. same process used mounting MLFs without modifications. important include post print post reflow inspection, especially during process development. volume paste printed should measured either techniques. paste volume should around stencil aperture volume indicate good paste release. After reflow, mounted package should inspected transmission xray presence voids, solder balling, other defects. Cross-sectioning also required determine fillet shape size joint standoff height. typical reflow profile Clean solder paste shown Figure Since actual reflow profile depends solder paste being used board density, specific profile recommended. However, temperature should exceed time above liquidus temperature should less than seconds. maximum temperature increased free solder package been qualified higher temperature moisture sensitivity level. ramp rate during preheat should 3/second lower.
Figure Typical Mounting Process Flow.
Figure Typical Solder Reflow Profile
(from Application Notes Amkor' Package)
Last Update 03/28/03
FC1703
Receiver RFIC Dual-Band Triple Mode
REWORK GUIDELINES
Since solder joints fully exposed case MLFs, retouch limited side fillet. defects underneath package, whole package removed. Rework packages challenge their small size. most applications, MLFs will mounted smaller, thinner, denser PCBs that introduces further challenges handling heating issues. Since reflow adjacent parts desirable during rework, proximity other components further complicate this process. Because product dependent complexities, following only provides guideline starting point development successful rework process these packages. rework process involves following steps: Component Removal Site Redress Solder Paste Application, Component Placement, Component Attachment. These steps discussed following more detail. Prior rework, strongly recommended that assembly baked least hours remove residual moisture from assembly. 4.1. Component Removal first step removal component reflow solder joints attaching component board. Ideally reflow profile part removal should same used part attachment. However, time above liquidus reduced long reflow complete. removal process, recommended that board should heated from bottom side using convective heaters should used side component. Special nozzles should used direct heating component area heating adjacent components should minimized. Excessive airflow should also avoided since this cause skew. velocity liters minute good starting point. Once joints have reflowed, Vacuum lift-off should automatically engaged during transition from reflow cooldown. Because their small size vacuum pressure should kept below This will allow component lifted joints have been reflowed avoid liftoff. 4.2. Site Redress After component been removed, site needs cleaned properly. best combination blade-style conductive tool desoldering braid. width blade should matched maximum width footprint blade temperature should enough cause damage circuit board. Once residual solder been removed, lands should cleaned with solvent. solvent usually specific type paste used original assembly paste manufacturer' recommendations should followed. 4.3. Solder Paste Printing Because their small size finer pitches, solder paste deposition MLFs requires extra care. However, uniform precise deposition achieved miniature stencil specific component used. stencil aperture should aligned with pads under 100X magnification. stencil should then lowered onto paste should deposited with small metal squeegee blade. blade width should same package width ensure single pass paste deposition thus avoiding overprinting. stencil thickness aperture size shape should same used original assembly. Also, no-clean flux should used, small standoff MLFs does leave much room cleaning. 4.4. Component Placement packages expected have superior selfcentering ability their small mass placement this package should similar that BGAs. leads underside package, split-beam optical system should used align component motherboard. This will form image solder balls overlaid mating footprint proper alignment. Again, alignment should done 100X magnification. placement machine should have capability allowing fine adjustments rotational axes. 4.5. Component Attachment reflow profile developed during original attachment removal should used attach component. Since reflow profile parameters have already been optimized, using same profile will eliminate need thermocouple feedback will reduce operator dependencies.
(from Application Notes Amkor' Package)
Preliminary
Last Update 10/16/02
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