converter powertrain Rev. January 2002 M3D797 Prelimina

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converter powertrain Rev. January 2002 M3D797 Prelimina

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PIP201-12M
converter powertrain
Rev. January 2002
M3D797
Preliminary data
Description
PIP201-12M designed power output stage synchronous buck converter. contains MOSFET control power MOSFET transistors. combining power MOSFETs driver circuit into single component, stray inductances virtually eliminated, resulting higher switching frequency, lower switching losses compact, efficient design.
Features
Optimized conversion from Output current Operating frequency High efficiency Low-profile, surface mount package 0.85 Compatible with single multi-phase controller.
Applications
Microprocessor voltage regulators Memory voltage regulators Low-voltage, high-current converters.
Ordering information
Table Ordering information Package Name PIP201-12M MLF68 Description plastic, heatsink very thin quad flat package; leads; terminals; body 0.85 Version SOT687 Type number
Philips Semiconductors
PIP201-12M
converter powertrain
Block diagram
VDDC control supply bootstrap capacitor driveH sourceH PAD3 VDDO PAD1
input
PIP201-12M
driveL sourceL VSSO
VSSC
PAD2 control
03ae80
Block diagram.
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Pinning information
Pinning
VDDO VDDO VDDO
VDDO
VSSO
VDDO VDDO VDDO VDDO VDDO
VDDO VDDO VSSC
PIP201-12M
VSSO VSSO VSSO
VDDC VDDC VSSC
VSSO VSSO VSSO VSSO VSSO
n.c.
n.c.
n.c.
n.c.
VSSC
VSSC
VSSC
n.c.
VSSO
VSSO
VSSO
VSSO
VSSO
VSSO
VSSO
03ae83
configuration (Top view).
description
Table Symbol VDDO VSSC description
Description output stage supply voltage control circuit supply ground output
VDDC
bootstrap capacitor connection control circuit supply voltage
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
description.continued Description pulse width modulated input connected output stage supply ground
Table Symbol n.c. VSSO
pins connected PAD1 pins connected PAD2 pins connected PAD3.
Functional description
Application requirements
output stage supply voltage control circuit supply VDDC VDDO input voltage from controller Lout VSSC VSSO output
03ad36
Simplified functional block diagram synchronous DC-DC converter output stage.
order understand functions performed PIP201-12M, consider requirements synchronous converter output stage, driven from controller (Figure When input voltage HIGH, upper MOSFET must lower MOSFET must off. Current flows from supply (VDDO), through upper MOSFET inductor (Lout), output. When input voltage current flowing inductor, upper MOSFET must lower MOSFET must Current flows from power ground (VSSO), through lower MOSFET inductor (Lout), output. Finally, when switching between states, both MOSFETs must same time.
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
MOSFET driver function
input voltage
upper MOSFET gate drive delay lower MOSFET gate drive delay
output voltage
03ag35
Input, output gate drive waveforms synchronous DC-DC converter output stage.
input, output gate drive waveforms shown Figure When input voltage goes HIGH, gate drive lower MOSFET immediately goes LOW. This causes output current flow through source-drain diode lower MOSFET. This causes output voltage fall from zero approximately -0.7 After delay, input voltage still HIGH, gate drive upper MOSFET goes HIGH. This causes output voltage rise output stage supply voltage, VDDO. When input voltage goes LOW, gate drive upper MOSFET immediately goes LOW. output voltage falls from VDDO, until clamped source-drain diode synchronous approximately -0.7 After delay, input voltage still LOW, gate drive lower MOSFET goes HIGH. lower MOSFET turns output voltage rises from -0.7 zero.
Three-state function
input voltage remains between upper lower switching thresholds longer than (typical), both MOSFETs turned off. This prevents output capacitor bank from discharging through lower MOSFET.
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Limiting values
Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol VDDC VDDO IO(AV) IORM Ptot Tstg
Parameter control circuit supply voltage output stage supply voltage input voltage output voltage bootstrap voltage average output current repetitive peak output current total power dissipation storage temperature operating junction temperature
Conditions
-0.5 -0.5 -0.5 -0.5 -0.5
5.25 +150 +150
Unit
VDDO
VDDC Tpcb Figure VDDC Tpcb Tpcb
Pulse width repetition rate limited maximum value Assumes thermal resistance from junction printed-circuit board K/W.
IO(AV)
03ae74
Tpcb (°C)
VDDC VDDO kHz;
Average output current function printed-circuit board temperature.
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Thermal characteristics
Table Symbol Rth(j-pcb) Thermal characteristics Parameter thermal resistance from junction printed-circuit board thermal resistance from junction ambient device mounted printed-circuit board; copper area around device thermal vias with thermal vias Conditions Unit
Rth(j-a)
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Characteristics
Table Characteristics VDDC unless otherwise specified. Symbol IDDC Ptot Parameter HIGH-level input voltage LOW-level input voltage input leakage current control circuit supply current total power dissipation Conditions VDDC kHz; Figure VDDO IO(AV) 12.5 kHz; Tpcb Figure
2.55 1.95
3.05 2.25
Unit
Static characteristics
Dynamic characteristics td(on)(IH-OH) turn-on delay time input HIGH VDDO IO(AV) 12.5 output HIGH td(off)(IL-OL) turn-off delay time input output to(r) to(f) td(3-state)
output rise time output fall time 3-state enable delay time
input voltage remains between (2.5 typ) longer than td(3-state), then both MOSFETs turned off.
Ptot
03ae77
03ae73
Ptot
O(AV)
VDDO
VDDC VDDO kHz.
VDDC kHz; IO(AV) 12.5
Total power dissipation function average output current; typical values.
Total power dissipation function output stage supply voltage; typical values.
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
03ae76
Ptot
03ae78
Ptot
(kHz)
1000
VDDC VDDO 500kHz; IO(AV) 12.5
VDDC VDDO 1.6V; IO(AV) 12.5
Total power dissipation function output voltage; typical values.
IDDC (mA)
Total power dissipation function input frequency; typical values.
03ae75
(kHz)
1000
VDDC VDDO IO(AV) 12.5 kHz.
Control circuit supply current function input frequency; typical values.
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Application information
11.1 Typical application
control circuit supply conversion supply VDDC VDDO VDDC VDDO Current Sense Controller VDDC VDDO VDDC VDDO VSSC output voltage (1.1
03ae81
PIP201-12M
VSSC VSSO
PIP201-12M
VSSC VSSO
PIP201-12M
VSSC VSSO
PIP201-12M
VSSO
Typical application circuit using PIP201-12M four-phase converter.
typical four-phase buck converter shown Figure This system uses four PIP201-12M devices deliver continuous output current operating frequency kHz. dissipation each PIP201-12M read from Figure 12.5 output current, dissipation each PIP201-12M typical computer motherboard application, thermal resistance each PIP201-12M from junction ambient K/W. Assuming maximum ambient temperature maximum junction temperature (Tj(max)) given 109°C
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
thermal resistance between junction printed-circuit board K/W. Therefore, maximum printed-circuit board temperature (Tpcb(max)) given 95.5°C
11.2 Advantages integrated driver
problem design low-voltage, high-current converters using discrete components, stray inductance between various circuit elements. Stray inductance gate drive circuit increases switching times MOSFETs causes high-frequency oscillation gate voltage. Stray inductance high-current loop between VDDO VSSO causes switching losses electromagnetic interference. discrete designs, high-frequency electric magnetic fields radiate from tracks couple into adjacent circuits. integrating power MOSFETs their drive circuits into single package, stray inductance virtually eliminated, resulting compact, efficient design. discrete designs, delays MOSFET drivers must long enough ensure cross-conduction even when using slowest MOSFETs. integrated driver allows propagation delays MOSFET drivers precisely matched MOSFETs. This minimizes switching losses eliminates cross-conduction whilst allowing circuit operate higher frequency.
11.3 Switching frequency
high operating frequency reduces size number capacitors needed filter output current, also reduces size output inductors. disadvantage higher dissipation switching MOSFET driver losses. example, doubling operating frequency circuit Figure from would increase power dissipation each PIP201-12M from output current 12.5 each PIP201-12M. maximum switching frequency limited thermal considerations, dissipation four PIP201-12M devices thermal resistance from junction ambient.
11.4 Thermal design
PIP201-12M three pads underside. These designated PAD1, PAD2 PAD3 (Figure PAD1 connected VDDO, PAD2 connected VSSC PAD3 connected addition providing inductance electrical connections, these pads conduct heat away efficiently from MOSFETs control printed-circuit board. thermal resistance from junction printed-circuit board approximately K/W. order take full advantage thermal resistance this package, printed-circuit board must designed that heat conducted away efficiently from package. This achieved maximizing area copper around each pad, incorporating thermal vias conduct heat inner and/or bottom layers printed-circuit board. example thermal pattern shown Figure typical computer
9397 09032 Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
motherboard application, with forced cooling, thermal holes typically reduces thermal resistance from K/W. additional small reduce this further approximately K/W.
PAD1
PAD3 PAD2
03ag36
holes diameter, spacing.
Printed-circuit board thermal pattern.
thermal resistance particular design measured passing known current through source-drain diode lower MOSFET. direction current flow into VSSO volt drop between VSSO then measured used calculate power dissipation PIP201-12M. case temperature PIP201-12M measured using infra-red thermometer. thermal resistance then calculated using following equation: case -(3) where Tcase measured case temperature, Tamb ambient temperature, MOSFET current volt drop between VSSO multi-phase design, thermal resistance each PIP201-12M should measured with current flowing phases.
Test information
Figure shows test circuit used measure power loss PIP201-12M. output voltage measured using averaging circuit. This eliminates losses output inductor tracks. calculated power loss, using this method, includes losses input filter capacitors. This must subtracted from total loss give loss PIP201-12M.
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
IDDO output stage supply control circuit supply (12V) VDDC VDDO input voltage from pulse generator VSSC VSSO IDDC VDDO
load
averaging circuit
VO(AV)
03ai73
Power loss (Ptot) test circuit.
Marking
terminal index area
TYPE
DIFFUSION MANUFACTURING CODE COUNTRY ORIGIN
Assembly centre Anam Korea
03ag38
Design centre Hazel Grove, Diffusion centre Hazel Grove,
Release status code Development Sample Customer Qualification Sample blank Released Supply
hfkYYWWY
Date code last digits year week number
03ai72
TYPE PIP201-12M DIFFUSION characters MANUFACTURING CODE: Figure COUNTRY ORIGIN: Korea
SOT687 marking.
Interpretation manufacturing code.
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Package outline
HVQFN68: plastic, heatsink very thin quad flat package; leads; terminals; body 0.85
SOT687
terminal index area detail
index
scale
DIMENSIONS original dimensions) UNIT max. 0.05 0.80 0.65 0.30 0.18 10.15 9.85 9.75 10.15 9.85 9.75 7.85 7.55 0.50 0.60 0.24 0.75 0.50
OUTLINE VERSION SOT687
REFERENCES JEDEC JEITA
EUROPEAN PROJECTION
ISSUE DATE 01-12-04
SOT687; plastic, heatsink, very thin quad flat package; leads; terminals; body 0.85
9397 09032 Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Soldering
15.1 Introduction soldering surface mount packages
This text gives very brief insight complex technology. more in-depth account soldering found Data Handbook IC26; Integrated Circuit Packages (document order number 9398 90011). There soldering method that ideal surface mount packages. Wave soldering still used certain surface mount ICs, suitable fine pitch SMDs. these situations reflow soldering recommended.
15.2 Reflow soldering
Reflow soldering requires solder paste suspension fine solder particles, flux binding agent) applied printed-circuit board screen printing, stencilling pressure-syringe dispensing before package placement. Several methods exist reflowing; example, convection convection/infrared heating conveyor type oven. Throughput times (preheating, soldering cooling) vary between seconds depending heating method. Typical reflow peak temperatures range from top-surface temperature packages should preferable kept below thick/large packages, below small/thin packages.
15.3 Wave soldering
Conventional single wave soldering recommended surface mount devices (SMDs) printed-circuit boards with high component density, solder bridging non-wetting present major problems. overcome these problems double-wave soldering method specifically developed. wave soldering used following conditions must observed optimal results:
double-wave soldering method comprising turbulent wave with high
upward pressure followed smooth laminar wave.
packages with leads sides pitch (e):
larger than equal 1.27 footprint longitudinal axis preferred parallel transport direction printed-circuit board; smaller than 1.27 footprint longitudinal axis must parallel transport direction printed-circuit board. footprint must incorporate solder thieves downstream end.
packages with leads four sides, footprint must placed angle
transport direction printed-circuit board. footprint must incorporate solder thieves downstream side corners.
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
During placement before soldering, package must fixed with droplet adhesive. adhesive applied screen printing, transfer syringe dispensing. package soldered after adhesive cured. Typical dwell time seconds mildly-activated flux will eliminate need removal corrosive residues most applications.
15.4 Manual soldering
component first soldering diagonally-opposite leads. voltage less) soldering iron applied flat part lead. Contact time must limited seconds When using dedicated tool, other leads soldered operation within seconds between
15.5 Package related soldering information
Table Package BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, PLCC[3], LQFP, QFP, TQFP SSOP, TSSOP,
Suitability surface mount packages wave reflow soldering methods Soldering method Wave suitable suitable[2] suitable recommended[3][4] recommended[5] Reflow[1] suitable suitable suitable suitable suitable
surface mount (SMD) packages moisture sensitive. Depending upon moisture content, maximum temperature (with respect time) body size package, there risk that internal external package cracks occur vaporization moisture them (the called popcorn effect). details, refer Drypack information Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages suitable wave soldering. versions with heatsink bottom side, solder cannot penetrate between printed-circuit board heatsink. versions with heatsink side, solder might deposited heatsink surface. wave soldering considered, then package must placed angle solder wave direction. package footprint must incorporate solder thieves downstream side corners. Wave soldering only suitable LQFP, TQFP packages with pitch equal larger than definitely suitable packages with pitch equal smaller than 0.65 Wave soldering only suitable SSOP TSSOP packages with pitch equal larger than 0.65 definitely suitable packages with pitch equal smaller than
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Mounting
shown Figure terminals underside package rectangular shape with rounded edge inside. Electrical connection between package printed-circuit board made printing solder paste onto footprint followed component placement reflow soldering. footprint shown Figure designed form reliable solder joints. addition dimensions shown, least recommended between each metal pads underside package, also between metal pads edge terminations. These clearances need increased prevent solder bridging. solder resist between each recommended. Good surface flatness footprint desirable ensure accuracy placement after soldering. Printed-circuit boards that finished with roller process tend leave small lumps corners each land. Levelling with knife improves flatness. Alternatively, electro-less silver silver immersion process produces completely flat pads.
10.36 8.48 8.28
8.18
0.15 0.94
03ag37
dimensions
0.28
footprint SOT687 package (reflow soldering).
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Revision history
Table Revision history CPCN Description Preliminary data (9397 09032); initial version.
Date 20020124
9397 09032
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Data sheet status
Data sheet status[1] Objective data Preliminary data Product status[2] Development Qualification Definition This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice. This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, order improve design supply best possible product. This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Changes will communicated according Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Product data
Production
Please consult most recently issued data sheet before initiating completing design. product status device(s) described this data sheet have changed since this data sheet published. latest information available Internet
Definitions
Short-form specification data short-form specification extracted from full data sheet with same type number title. detailed information relevant data sheet data handbook. Limiting values definition Limiting values given accordance with Absolute Maximum Rating System (IEC 60134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Applications that described herein these products illustrative purposes only. Philips Semiconductors make representation warranty that such applications will suitable specified without further testing modification.
Disclaimers
Life support These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips Semiconductors customers using selling these products such applications their risk agree fully indemnify Philips Semiconductors damages resulting from such application. Right make changes Philips Semiconductors reserves right make changes, without notice, products, including circuits, standard cells, and/or software, described contained herein order improve design and/or performance. Philips Semiconductors assumes responsibility liability these products, conveys licence title under patent, copyright, mask work right these products, makes representations warranties that these products free from patent, copyright, mask work right infringement, unless otherwise specified.
Contact information
additional information, please visit sales office addresses, send e-mail
9397 09032
Fax: 24825
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Preliminary data
Rev. January 2002
Philips Semiconductors
PIP201-12M
converter powertrain
Contents
11.1 11.2 11.3 11.4 15.1 15.2 15.3 15.4 15.5 Description Features Applications Ordering information Block diagram Pinning information Pinning description Functional description Application requirements MOSFET driver function Three-state function Limiting values. Thermal characteristics. Characteristics Application information. Typical application Advantages integrated driver. Switching frequency Thermal design Test information. Marking Package outline Soldering Introduction soldering surface mount packages Reflow soldering Wave soldering Manual soldering Package related soldering information Mounting. Revision history Data sheet status Definitions Disclaimers.
Koninklijke Philips Electronics N.V. 2002. Printed Netherlands
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights. Date release: January 2002 Document order number: 9397 09032

converter powertrain Rev. January 2002 M3D797 Prelimina

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