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Triacs logic level Glass passivated, sensitive gate triacs full p
Top Searches for this datasheetTriacs logic level Glass passivated, sensitive gate triacs full pack plastic envelope, intended general purpose bidirectional switching phase control applications. These devices intended interfaced directly microcontrollers, logic integrated circuits other power gate trigger circuits. BT137X series QUICK REFERENCE DATA SYMBOL VDRM IT(RMS) ITSM PARAMETER BT137XRepetitive peak off-state voltages on-state current Non-repetitive peak on-state current MAX. MAX. UNIT 500D 600D PINNING SOT186A DESCRIPTION main terminal CONFIGURATION case SYMBOL main terminal gate case isolated LIMITING VALUES Limiting values accordance with Absolute Maximum System (IEC 134). SYMBOL VDRM IT(RMS) ITSM PARAMETER Repetitive peak off-state voltages on-state current Non-repetitive peak on-state current fusing Repetitive rate rise on-state current after triggering full sine wave; full sine wave; prior surge; with reapplied VDRM(max) 16.7 dIG/dt A/µs GT2- GT2- CONDITIONS MIN. -500 5001 MAX. -600 6001 UNIT A/µs A/µs A/µs A/µs dIT/dt PG(AV) Tstg Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature over period Although recommended, off-state voltages 800V applied without damage, triac switch on-state. rate rise current should exceed A/µs. February 1996 1.100 Triacs logic level ISOLATION LIMITING VALUE CHARACTERISTIC unless otherwise specified SYMBOL Visol PARAMETER R.M.S. isolation voltage from three terminals external heatsink CONDITIONS 50-60 sinusoidal waveform; R.H. clean dustfree MIN. BT137X series TYP. MAX. 2500 UNIT Cisol Capacitance from external heatsink THERMAL RESISTANCES SYMBOL j-hs PARAMETER Thermal resistance junction heatsink Thermal resistance junction ambient CONDITIONS full half cycle with heatsink compound without heatsink compound free MIN. TYP. MAX. UNIT STATIC CHARACTERISTICS unless otherwise stated SYMBOL PARAMETER Gate trigger current CONDITIONS GT2- GT2- GT2- GT2- MIN. 0.25 TYP. MAX. 1.65 UNIT Latching current Holding current On-state voltage Gate trigger voltage Off-state leakage current VDRM(max); DYNAMIC CHARACTERISTICS unless otherwise stated SYMBOL dVD/dt PARAMETER Critical rate rise off-state voltage Gate controlled turn-on time CONDITIONS VDRM(max); exponential waveform; VDRM(max); dIG/dt A/µs MIN. TYP. MAX. UNIT V/µs February 1996 1.100 Triacs logic level BT137X series Ptot BT137 Ths(max) IT(RMS) BT137X IT(RMS) Fig.1. Maximum on-state dissipation, Ptot, versus on-state current, IT(RMS), where conduction angle. BT137 time Fig.4. Maximum permissible current IT(RMS) versus heatsink temperature Ths. BT137 1000 ITSM IT(RMS) initial limit quadrant 10us 100us 10ms 100ms 0.01 surge duration Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width sinusoidal currents, 20ms. Fig.5. Maximum permissible repetitive on-state current IT(RMS), versus surge duration, sinusoidal currents, 73°C. VGT(Tj) VGT(25 ITSM BT137 ITSM time BT136 initial Number cycles 50Hz 1000 Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number cycles, sinusoidal currents, Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25°C), versus junction temperature February 1996 1.100 Triacs logic level BT137X series IGT(Tj) IGT(25 BT137D GT2- GT2- BT137 1.264 0.0378 Ohms Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25°C), versus junction temperature IL(Tj) IL(25 Fig.10. Typical maximum on-state characteristic. TRIAC j-hs (K/W) BT137 with heatsink compound without heatsink compound unidirectional bidirectional 0.01 10us 0.1ms 10ms 0.1s Fig.8. Normalised latching current IL(Tj)/ IL(25°C), versus junction temperature IH(Tj) IH(25C) Fig.11. Transient thermal impedance j-hs, versus pulse width dVD/dt (V/us) TRIAC 1000 Fig.9. Normalised holding current IH(Tj)/ IH(25°C), versus junction temperature Fig.12. Typical, critical rate rise off-state voltage, dVD/dt versus junction temperature February 1996 1.100 Triacs logic level MECHANICAL DATA Dimensions Mass: 10.3 BT137X series Recesses (2x) max. depth 15.8 max. max. seating plane 15.8 max. tinned 13.5 min. (2x) 2.54 5.08 Fig.13. SOT186A; seating plane electrically isolated from terminals. Notes Accessories supplied request: refer mounting instructions F-pack envelopes. improved isolation rating applies only SOT186 version envelope. February 1996 1.100 Triacs logic level DEFINITIONS Data sheet status Objective specification Product specification Limiting values BT137X series This data sheet contains target goal specifications product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data published later. Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections this specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. Philips Electronics N.V. 1996 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent other industrial intellectual property rights. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale. 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