OPERATING TEMP. -55V+125C BK0603, BK1005 Except BK0603, BK1005

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OPERATING TEMP. -55V+125C BK0603, BK1005 Except BK0603, BK1005

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MULTILAYER FERRITE CHIP BEADS SERIES
OPERATING TEMP.
-55V+125C BK0603, BK1005 Except BK0603, BK1005
YGND DXL() D20MHzZ100MHzV300MHz DZ200MHzV500MHz D200MHz HWDXL DLSI YInternal silver printed layer creates closed circuit which acts magnetic shield minimizing heat generation crosstalk. need grounding provides greater circuit design flexibility. YSeveral material types broad range impedance values provide noise countermeasures various applications. Suppresses component. Helps stop reduction wave- form integrity(digital wave-form overshoot, etc.) Increases characteristic sharply above 20MHz applicable radiated noise 100MHzV300MHz range. Especially effective video signal lines. Designed noise countermeasure 200MHzV500MHz range where rise component high frequency area. Intended noise suppression around 200MHz. Effectively increases attenuation. best material Series suppress component stop reduction wave-form integrity while maintaining attenuation high frequency area. Reduced resistance version noise countermeasures around power supplies.
APPLICATIONS
YPDCPHS YLSI (TS) YHigh frequency noise countermeasure personal computers, digital cameras other information system products. digital product clock lines general signal lines. YRadiated noise suppression computer printer interfaces harness connectors. YNoise suppression video other products. YPrevents interference between circuits cellular phones(PHS, PDC, etc.) YDue closed internal circuit which acts magnetic shield, material extremely effective noise filter power supply lines where downsizing components needed.
ORDERING CODE
1000
fLPWghmmi
0603(0201) 1005(0402) 1608(0603) 2125(0805) 0.6P0.3 1.0P0.5 1.6P0.8 2.0P1.25
Type
Multilayer Ferrite Chip Beads
Material
Refer impedance curves material differences
ImpedancehEi
example 1000
Characteristics
Standard Products
Internal code
Standard Products QWBlank Space
External DimensionsfLPWghmmi
0603(0201) 1005(0402) 1608(0603) 2125(0805) 0.6P0.3 1.0P0.5 1.6P0.8 2.0P1.25
Packaging
Tape Reel
EXTERNAL DIMENSIONS
Type 0.60M0.03 BK0603 f0201g f0.024M0.001g BK1005 1.00M0.05 f0402g f0.039M0.002g 0.30M0.03 f0.012M0.001g 0.50M0.05 f0.020M0.002g 0.30M0.03 0.15M0.05
f0.012M0.001g f0.006M0.002g 0.50M0.05 0.25M0.10 f0.020M0.002g f0.010M0.004g
BK1608 1.6M0.15 0.8M0.15 0.8M0.15 0.3M0.2 f0603g f0.063M0.006g f0.031M0.006g f0.031M0.006g f0.012M0.008g J0.3 1.25M0.2 0.85M0.2 0.5M0.3 K0.1 BK2125 f0805g f0.079J0.012 K0.004 1.25M0.2 f0.049M0.008g f0.033M0.008g f0.020M0.012g f0.049M0.008g UnitDmmfinchg
FERRITE PRODUCTS
AVAILABLE MATERIALS
BK0603
type
type
type
Frequency [MHz] 1000
Frequency [MHz] 1000
Frequency [MHz] 1000
max=200V500mA
max=200mA
max=150V200mA
BK1005
type
1200 1000
type
type
2500 LL241 LL181 LL121 LL680 LL470 LL330 LL220 LL100
type
2500
type
2000
1250
1500
1000
max=300V500mA
max=300V1000mA
max=150V300mA
max=250V500mA max=150mA type
BK1608
type type type
2000 LL241 LL181 LL121 LL680 LL560 LL470 LL300
type
1000
max=300V600mA
max=300V1500mA
max=200V350mA
max=150V500mA
max=150V500mA
Selection Guide
Part Numbers
Electrical Characteristics
Packaging
Reliability Data
Precautions
P.12
P.235
P.237
P.258
P.260
P.268
AVAILABLE MATERIALS
BK1608
type type
max=200V300mA
max=300V400mA
BK2125
type type type type
max=300V1200mA
max=400V800mA
max=300V600mA
max=200V400mA
PART NUMBERS
BK0603
Ordering code 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 (Environmental Hazardous Substances) RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS Impedance M25L Measuring frequency hMHzi resistance fmax.g 0.075 0.075 0.40 0.50 0.80 1.50 0.40 0.50 0.80 1.50 0.40 0.50 0.80 1.00 Rated current hmAi fmax.g Thickness hmmi finchg
FERRITE PRODUCTS
0.30M0.03 f0.012M0.001g
BK1005
Ordering code 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 1005 (Environmental Hazardous Substances) RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS Impedance M25L 1000 1000 1800 Measuring frequency hMHzi resistance fmax.g 0.17 0.24 0.31 0.50 0.60 0.05 0.10 0.13 0.23 0.33 0.45 0.58 0.58 0.25 0.36 0.56 0.59 0.80 0.15 0.20 0.30 0.35 0.31 0.45 0.53 0.70 1.10 Rated current hmAi fmax.g 1000 Thickness hmmi finchg
0.50M0.05 f0.020M0.002g
PART NUMBERS
BK1608
Ordering code 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 (Environmental Hazardous Substances) RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS Impedance M25L 1000 1000 1500 1800 2500 1000 Measuring frequency hMHzi resistance fmax.g 0.15 0.25 0.30 0.40 0.05 0.08 0.10 0.10 0.10 0.18 0.25 0.45 0.60 0.20 0.35 0.45 0.60 0.70 0.20 0.30 0.30 0.35 0.50 0.65 0.80 0.85 0.85 0.90 1.00 0.60 0.75 0.85 1.10 0.25M30% 0.27M30% 0.30M30% Rated current hmAi fmax.g 1500 1200 Thickness hmmi finchg
0.80M0.15 f0.031M0.006g
BK2125
Ordering code 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 2125 (Environmental Hazardous Substances) RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS Impedance M25L 1000 1000 1500 1800 2500 Measuring frequency hMHzi resistance fmax.g 0.05 0.05 0.05 0.05 0.10 0.10 0.15 0.20 0.25 0.30 0.40 0.15 0.20 0.25 0.25 0.35 0.20 0.30 0.35 0.30 0.35 0.45 0.75 Rated current hmAi fmax.g 1200 1200 1200 1000 1000 Thickness hmmi finchg
0.85M0.2 f0.033M0.008g
1.25M0.2 (0.049M0.008)
ELECTRICAL CHARACTERISTICS
BK0603
BK0603 HS220 BK0603 HS330
Impedance[E]
Impedance[E]
Frequency [MHz]
1000
10000
1000 Frequency [MHz]
FERRITE PRODUCTS
BK0603 HS601
Impedance[E]
Frequency [MHz]
1000
BK0603 HM241
Impedance[E]
Frequency [MHz]
1000
BK0603 HM471
BK0603 LL100
BK0603 LL220
Impedance[E]
Impedance[E]
Frequency [MHz]
Impedance[E]
1000
1000 Frequency [MHz]
10000
1000 Frequency [MHz]
10000
BK0603 LL330
BK0603 LL470
Impedance[E]
Impedance[E]
1000 Frequency [MHz]
10000
1000 Frequency [MHz]
10000
ELECTRICAL CHARACTERISTICS
BK1005
BK1005 HW680 BK1005 HW121 BK1005 HW241
Impedance[E]
Impedance[E]
Impedance[E]
Frequency [MHz]
1000
Frequency [MHz]
1000
Frequency [MHz]
1000
BK1005 HW431 1000
BK1005 HW601
BK1005 HS100
Impedance[E]
Impedance[E]
Impedance[E]
Frequency [MHz]
1000
Frequency [MHz]
1000
Frequency [MHz]
1000
BK1005 HS330
BK1005 HS680
Impedance[E]
Impedance[E]
Frequency [MHz]
1000
Frequency [MHz]
1000
BK1005 HS431 1000
Impedance[E]
Frequency [MHz]
1000
BK1005 HS102 1200 1000
BK1005 HM121
Impedance[E]
Impedance[E]
Frequency [MHz]
1000
Frequency [MHz]
1000
ELECTRICAL CHARACTERISTICS
BK1005 HM102 2000
1500
1000
FERRITE PRODUCTS
1000
BK1005 LL100
BK1005 LL220
BK1005 LL330
1000 10000
1000 10000
1000
10000
BK1005 LL470
BK1005 LL680
1000 10000
1000 10000
BK1005 LM182 2500 2000
1500
1000
1000
ELECTRICAL CHARACTERISTICS
BK1608
ELECTRICAL CHARACTERISTICS
FERRITE PRODUCTS
BK1608 LL300
BK1608 LL470
BK1608 LL560
1000 10000
1000 10000
1000 10000
BK1608 LL680 1500
BK1608 LL121
1000 10000
1000
ELECTRICAL CHARACTERISTICS
4000
2000
ELECTRICAL CHARACTERISTICS
BK2125
FERRITE PRODUCTS
ELECTRICAL CHARACTERISTICS
BK2125 HM471 1000
Impedance
Frequency
1000
BK2125 LL121 1000
Impedance
Frequency 1000
PACKAGING
Minimum Quantity FTape Reel Packaging Type Thickness [mm] finchg CK1608f0603g f0.031g 0.85 CK2125f0805g f0.033g 1.25 f0.049g CKP3216f1206g LK1005f0402g LK1608f0603g f0.031g f0.020g f0.031g 0.85 LK2125f0805g f0.033g 1.25 f0.049g HKQ0603f0201g HK0603f0201g HK1005f0402g HK1608f0603g f0.012g f0.012g f0.020g f0.031g 0.85 HK2125f0805g f0.033g f0.039g BK0603f0201g BK1005f0402g BK1608f0603g f0.012g f0.020g f0.031g 0.85 BK2125f0805g f0.033g 1.25 f0.049g BK2010f0804g BK3216f1206g BKP1005f0402g BKP1608f0603g BKP2125f0805g 0.45 f0.018g f0.031g f0.020g f0.031g 0.85 f0.033g 4000 4000 10000 4000 4000 2000 4000 4000 10000 15000 3000 4000 4000 10000 15000 15000 2000 4000 4000 10000 4000 2000 4000 [pcs] Standard Quantity Paper Tape 4000 Embossed Tape
2Taping material
PACKAGING
3Taping Dimensions Y8mm Paper tape (0.315 inches wide) Type CK2125f0805g CKP3216f1206g LK2125f0805g
Thickness hmmi 1.25 f0.049g f0.031g 1.25 f0.049g 0.85 f0.033g f0.039g 1.25 f0.049g f0.031g
Chip cavity 1.5M0.2 f0.059M0.008g 1.9M0.1 f0.075M0.004g 1.5M0.2 f0.059M0.008g 1.5M0.2 f0.059M0.008g 1.5M0.2 f0.059M0.008g 1.9M0.1 f0.075M0.004g 2.3M0.2 f0.091M0.008g 3.5M0.1 f0.138M0.004g 2.3M0.2 f0.091M0.008g 2.3M0.2 f0.091M0.008g 2.3M0.2 f0.091M0.008g 3.5M0.1 f0.138M0.004g
max. Insertion Pitch 4.0M0.1 f0.157M0.004g 4.0M0.1 f0.157M0.004g 4.0M0.1 f0.157M0.004g 4.0M0.1 f0.157M0.004g 4.0M0.1 4.0M0.1 f0.157M0.004g Tape Thickness f0.059g f0.079g f0.157M0.004g f0.079g f0.012g f0.055g f0.012g f0.012g
f0.079g f0.012g f0.055g f0.012g f0.079g f0.012g
FERRITE PRODUCTS
HK2125f0805g Unit (inch) Type CK1608f0603g CK2125f0805g LK1005f0402g LK1608f0603g LK2125f0805g HKQ0603(0201) HK0603(0201) HK1005f0402g HK1608f0603g BK0603f0201g BK1005f0402g BK1608f0603g BK2125f0805g BK2010f0804g BKP1005f0402g BKP1608f0603g BKP2125f0805g Thickness hmmi f0.031g 0.85 f0.033g f0.020g f0.031g 0.85 f0.033g f0.012g f0.012g f0.020g f0.031g f0.012g f0.020g f0.031g 0.85 f0.033g 0.45 f0.018g f0.020g f0.031g 0.85 f0.033g Chip cavity 1.0M0.2 f0.039M0.008g 1.5M0.2 f0.059M0.008g 0.65M0.1 f0.026M0.004g 1.0M0.2 f0.039M0.008g 1.5M0.2 f0.059M0.008g f0.016M0.002g f0.016M0.002g 0.65M0.1 f0.026M0.004g 1.0M0.2 f0.039M0.008g f0.016M0.002g 0.65M0.1 f0.026M0.004g 1.0M0.2 f0.039M0.008g 1.5M0.2 f0.059M0.008g 1.2M0.1 f0.047M0.004g 0.65M0.1 f0.026M0.004g 1.0M0.2 f0.039M0.008g 1.5M0.2 f0.059M0.008g 1.8M0.2 f0.071M0.008g 2.3M0.2 f0.091M0.008g 1.15M0.1 f0.045M0.004g 1.8M0.2 2.3M0.2 Insertion Pitch Tape Thickness 4.0M0.1 4.0M0.1 2.0M0.05 4.0M0.1 4.0M0.1 1.1max 1.1max 0.8max 1.1max 1.1max 0.45max 0.45max 0.8max f0.031maxg 1.1max f0.043maxg 0.45max 0.8max f0.031maxg 1.1max BK3216f1206g BK2125f0805g
f0.157M0.004g f0.043maxg LEADER BLANK PORTION f0.157M0.004g f0.043maxg f0.079M0.002g f0.031maxg
f0.071M0.008g f0.157M0.004g f0.043maxg f0.091M0.008g f0.157M0.004g f0.043maxg f0.028M0.002g f0.079M0.002g f0.018maxg f0.028M0.002g f0.079M0.002g f0.018maxg 1.15M0.1 1.8M0.2 2.0M0.05 4.0M0.1 f0.045M0.004g f0.079M0.002g f0.071M0.008g f0.157M0.004g Reel Size
0.40M0.06 0.70M0.06 2.0M0.05 0.40M0.06 0.70M0.06 2.0M0.05
160mm f6.3inches moreg
100mm f3.94inches moreg 400mm f15.7inches moreg
Direction tape feed
0.40M0.06 0.70M0.06 2.0M0.05 1.15M0.1 1.8M0.2 2.0M0.05 4.0M0.1
f0.028M0.002g f0.079M0.002g f0.018maxg f0.045M0.004g f0.079M0.002g
2.0M0.5 f0.079M0.031g B13.0M0.2 fB0.512M0.020g
f0.071M0.008g f0.157M0.004g f0.043maxg 4.0M0.1 1.1max 2.3M0.2 f0.091M0.008g f0.157M0.004g f0.043maxg 2.17M0.1 1.15M0.1 1.8M0.2 2.3M0.2 4.0M0.1 2.0M0.05 4.0M0.1 4.0M0.1 0.80max 0.8max f0.031maxg 1.1max 1.1max f0.043maxg 6Top tape strength 0.10.7N tape requires peel-off force 0.1V0.7N direction arrow illustrated below. f0.085M0.004g f0.157M0.004g f0.031maxg f0.045M0.004g f0.079M0.002g
f0.071M0.008g f0.157M0.004g f0.043maxg f0.091M0.008g f0.157M0.004g
Y8mm Embossed Tape (0.312 inches wide)
Unit (inch)
RELIABILITY DATA
Multilayer chip inductors beads
Specified Value Item BK0603 BK1005 BK1608 BK2125 BK2010 BK3216 1.Operating Range 2.Storage Temperature Range 3.Rated Current 100V 150V 150V 200V 100mA 100V 1.0A 1.0V 3.0A 120E 390E M25L 2.0V 4.0A 220E M25L 0.7V 25mA 50mA 150V 110V 150V 300mA K55VJ125C K55VJ85C K40VJ85C K55VJ125C K40VJ85C K55VJ125C K55VJ85C K40VJ85C K55VJ125C K40VJ85C ARRAY BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125 Test Methods Remarks
FERRITE PRODUCTS
BK0603 Series: Measuring frequency: 100M1MHz Measuring equipment: HP4291A Measuring jig: 16193A
500mA 1000mA 1500mA 1200mA 4.Impedance 600E M25L 1000E M25L
200mA
100mA 500mA 1.1A
300mA 400mA 250mA 300mA 300mA
2500E 2500E 600E M25L M25L M25L
1000E M25L M25L
BK1005 Series: BKP1005 Series: Measuring frequency: 100M1MHz Measuring equipment: HP4291A Measuring jig: 16192A, 16193A BK1608, 2125 Series: BKP1608, 2125 Series: Measuring frequency: 100M1MHz Measuring equipment: HP4291A, HP4195A Measuring jig: 16092A 16192A (HW)
BK2010, 3216 Series: Measuring frequency: 100M1MHz Measuring equipment: HP4291A, HP4195A Measuring jig: 16192A 5.Inductance 2.2V 0.1V 1.0V 0.12V 2.2AH 0.047V 0.047V 1.0V5.6nH 1.0V6.2nH 1.0V6.2nH 1.0V5.6nH 1.0V5.6nH 33.0AH 33.0AH DM0.3nH DM0.3nH DM0.3nH DM0.3nH DM0.3nH Series: Measuring frequency: 4MHz (CK1608)
10.0AH 10.0AH 4.7AH
DM20L DM20L DM20L DM10L DM20L DM20L 6.8V10nH 6.8V100nH 6.8V270nH 6.8V470nH 6.8V470nH Measuring frequency: 25MHz (CK2125) DM5L 200mA 0.4V 1.8AH min. 0.10V 0.10V Series: Measuring frequency: 25MHz (LK1005) Measuring frequency: 50MHz (LK1608) Measuring frequency: 50MHz (LK2125) Measuring equipment, jig: HP4194J16085BJ16092A equivalent) HP4195J41951J16092A equivalent) HP4294J16192A HP4291AJ16193A (LK1005) HP4285AJ42841AJ42842CJ 42851-61100 (CKP3216) Measuring current: (0.047 4.7AH) 0.1mA (5.6 33AH) DM5L DM5L DM5L DM5L Measuring frequency: 1MHz (CKP3216)
12.0AH 12.0AH DM10L DM10L
Series: Measuring frequency: 100MHz (HKQ0603,HK0603, HK1005) Measuring frequency: 50/100MHz (HK1608, HK2125) Measuring equipment, jig: HP4291AJ16197A (HKQ0603,HK0603) HP4291AJ16193A (HK1005) HP4291A equivalent)J16092AJ in-house made (HK1608, 2125)
Definition rated current Series, rated current value current which temperature element increased within 20C. Series type Series type, rated current value current which temperature element increased within 40C. Series, rated current either value which internal value decreased within with application bias, value current which temperature element increased within 20C.
RELIABILITY DATA
Multilayer chip inductors beads
Specified Item BK0603 BK1005 BK1608 BK2125 BK2010 BK3216 min. ARRAY
Value Test Methods Remarks
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125
15V20 min.
10V20 10V35 15V50 min. min. min. min.
min.
8min.
8V12 10V18 min. min.
Series: Measuring frequency: (CK1608) Measuring frequency: (CK2125)
Series: Measuring frequency: (LK1005) Measuring frequency: (LK1608) Measuring frequency: 50MHz (LK2125) Measuring equipment, jig: HP4194A 16085B +16092A equivalent)
FERRITE PRODUCTS
HP4195A 41951 16092A equivalent) HP4294A 16192A HP4291A 16193A (LK1005) Measuring current: (0.047 4.7AH) 0.1mA (5.6 33AH)
Series: Measuring frequency: 100MHz (HKQ0603,HK0603, HK1005) Measuring frequency: 100MHz (HK1608, 2125) Measuring equipment, jig: HP4291A 16197A(HKQ0603,HK0603) HP4291A 16193A(HK1005) HP4195A 16092A in-house made (HK1608, 2125) 7.DC Resistance 0.075V 0.05V 0.05V 0.05V 0.10V 0.15V 0.140E 0.025V 0.020V 0.30V 0.16V 0.11V 0.7V 1.50E 0.80E 1.10E 0.75E 0.90E 0.80E max. max. max. max. max. max. max. 0.3V 0.20V 0.10V 0.14V 0.08V 0.05V 0.10V 4.8E max. 2.6E max. 1.5E max. Measuring equipment: VOACK7412 (made Iwasaki Tsushinki) VOACK7512 (made Iwasaki Tsushinki) 8.Self Resonance Frequency(SRF) 4000V 900V 400V 300V 200V Series:
0.140E 0.050E 0.90E 0.65E 0.20E 1.70E 2.95E 1.25E 0.83E 4.0E max. max. (M30L) max. max. max. max. max. max. max.
33MHz 235MHz min. min.
180MHz 260MHz 320MHz 10000MHz 10000MHz 10000MHz 10000MHz 4000MHz Measuring equipment: HP4195A min. min. min. min. min. min. min. min. Measuring jig: 41951 16092A equivalent) Series: Measuring equipment: HP8719C YHP8753DfHK2125g
9.Temperature Characteristic
Inductance change: WithinM10%
Series: Temperature range: +85C Reference temperature: +20C
Resistance Flexure Substrate
mechanical damage.
Warp: Testing board: glass epoxy-resin substrate Thickness: 0.8mm
RELIABILITY DATA
Multilayer chip inductors beads
Specified Value Item BK0603 BK1005 BK1608 BK2125 BK2010 BK3216 11.Solderability least terminal electrode covered solder. least terminal electrode covered solder. Solder temperature: 230M5C Duration: sec. ARRAY BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125 Test Methods Remarks
12.Resistance Soldering
Appearance: significant abnormality Impedance change: Within M30%
mechanical damage. Remaining terminal electrode: min. Inductance change R10V4R7: WithinM10% 6R8V100: WithinM15% CKP3216: WithinM30%
mechanical damage. Remaining terminal
mechanical damage. Remaining terminal
Solder temperature: 260M5C Duration: 10M0.5 sec. Preheating temperature: 180C
FERRITE PRODUCTS
electrode: min. electrode: min. Inductance change 47NV4R7: WithinM10% 5R6V330: WithinM15% Inductance change: WithinM5%
Preheating time: min. Flux: Immersion into methanol solution with colophony sec. Recovery: recovery under standard condition after test. (See Note
13.Thermal Shock
Appearance: significant abnormality Impedance change: Within M30%
mechanical damage. Inductance change: Within M20% Qchange: Within M30%
mechanical mechanical damage. mechanical damage. Inductance change: WithinM10% damage. Inductance change: Qchange: WithinM20% Inductance WithinM10% change: Within Qchange: M30% WithinM30%
Conditions cycle step Minimum operating temperature J0/K3C 30M3 min. step Room temperature 3min. step Minimum operating temperature J0/K3C 30M3 min. step Room temperature 3min. Number cycles: Recovery: recovery under standard condition after test. (See Note
(Note When there questions concerning mesurement resultDmeasurement shall made after 48M2 recovery under standard condition.
RELIABILITY DATA
Multilayer chip inductors beads
Specified Value Item BK0603 BK1005 BK1608 BK2125 BK2010 BK3216 Damp Heat fSteady stateg Appearance: significant abnormality Impedance change: Within M30% mechanica damage. Inductance change: Within M20% change: Within M30% mechanica mechanica damage. damage. Inductance change: Inductance WithinM10% change: Within change: M30% WithinM30% mechanica damage. mechanica Inductance change: damage. WithinM10% Inductance change: WithinM20% change: Within M10% change: Within M30% Series: Temperature: 40M2C Humidity: 95%RH Duration: Recovery: recovery under standard condition after removal from test chamber.fSee Note1g ARRAY BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 LK1005 LK1608 LK2125 HKQ0603 HK0603 HK1005 HK1608 HK2125 Test Methods Remarks
FERRITE PRODUCTS
Series: Temperature: 40M2C (LK, Series) 60M2C Series) Humidity: 95%RH Duration: 500M12 hours Recovery: recovery under standard condition after removal from test chamber. fSee Note1g 15.Loading under Damp Heat mechanical damage, Inductance change withinM30L mechanica damage. Inductance change: Within M20% change: Within M30% mechanica damage. mechanica mechanica mechanica mechanica Inductance change: damage. damage. damage. damage. WithinM10% Inductance change: Within M30% Inductance change: 0.047 12.0AH: Within change: M10% 15.0 Within M30% 33.0AH: Within M15% Inductance change: Within M10% change: Within M30% Inductance change: WithinM20% change: Within M10% change: Within M30% Series: Temperature: 40M2C Series) Humidity: 95%RH Duration: Applied current: Rated current Recovery: recovery under standard condition after removal from test chamber. fSee Note1g
Series: Temperature: 40M2C (LK, Series) 60M2C Series) Humidity: 95%RH Duration: 500M12 Applied current: Rated current Recovery: recovery under standard condition after removal from test chamber. fSee Note1g
16.Loading High Temperature
Appearance: significant abnormality Impedance change: Within M30%
mechanica damage. Inductance change: Within M20% change: Within M30%
mechanica damage. mechanica mechanica mechanica mechanica Inductance change: damage. damage. damage. damage. WithinM10% Inductance change: Within M30% Inductance change: 0.047 12.0AH: Within change: M10% Within 15.0 M30% 33.0AH: Within M15% Inductance change: Within M10% change: Within M30% Inductance change: WithinM20% change: Within M10% change: Within M30%
Series: Temperature: 125M3C Applied current: Rated current Duration: Recovery: recovery under standard condition after removal from test chamber. fSee Note1g
Series, Series type: Temperature: 85M2C (LK, Series) 85M3C Series type) 85M2C 1608, 2125) 85M2C 1005 operating temperature range J85C) 125M2C (HKQ 0603,HK 0603, HK1005) operating temperature range J125C) Applied current: Rated current Duration: 500M12 Recovery: recovery under standard condition after removal from test chamber. fSee Note1g
Note standard condition: "standard condition" referred herein defined follows: temperature, relative humidity, 106kPa pressure. When there questions concerning measurement results: order provide correlation data, test shall conducted under condition 20M2C temperature, relative humidity, 106kPa pressure. Unless otherwise specified, tests conducted under "standard condition."
(Note measurement shall made after 48M2 recovery under standard condition.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages Circuit Design Precautions SVerification operating environment, electrical rating performance malfunction medical equipment, spacecraft, nuclear reactors, etc. cause serious harm human life have severe social ramifications. such, inductors used such equipment require higher safety and/or reliability considerations should clearly differentiated from components used general purpose applications. SOperating Current (Verification Rated current) operating current inductors must always lower than their rated values. apply current excess rated value because inductance reduced magnetic saturation effect. Technical considerations
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Design
SPattern configurations (Design Land-patterns) When inductors mounted PCB, amount solder used (size fillet) directly affect inductor performance. Therefore, following items must carefully considered design solder land patterns: amount solder applied affect ability chips withstand mechanical stresses which lead breaking cracking. Therefore, when designing land-patterns necessary consider appropriate size configuration solder pads which turn determines amount solder necessary form fillets. When more than part jointly soldered onto same land pad, must designed that each component's soldering point separated solder-resist.
following diagrams tables show some examples recommended patterns prevent excessive solder amounts (larger fillets which extend above component terminations). Examples improper pattern designs also shown. Recommended land dimensions typical chip inductor land patterns PCBs
Recommended land dimensions wave-soldering (unit: Type 1608 0.8V1.0 0.5V0.8 0.6V0.8 2125 1.25 1.0V1.4 0.8V1.5 0.9V1.2 3216 1.8V2.5 0.8V1.7 1.2V1.6
Recommended land dimensions reflow-soldering (unit: Type 0603 0.20V0.30 0.20V0.30 0.25V0.40 1005 0.45V0.55 0.40V0.50 0.45V0.55 1608 0.6V0.8 0.6V0.8 0.6V0.8 2125 1.25 0.8V1.2 0.8V1.2 0.9V1.6 3216 1.8V2.5 0.6V1.5 1.2V2.0
Excess solder affect ability chips withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Recommended land dimension Reflow-soldering (unit: 3216 0.7V0.9 0.8V1.0 0.4V0.5 2010 0.5V0.6 0.5V0.6 0.2V0.3
Size Size
Size
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 2.PCB Design Precautions Technical considerations Examples good solder application recommended
Mixed mounting leaded components Component placement close chassis
Recommended
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Hand-soldering leaded components near mounted components Horizontal component placement
1-1. following examples good inductor layout; inductors SPattern configurations (Inductor layout panelized [breakaway] boards) After inductors have been mounted boards, chips subjected mechanical stresses subsequent manufacturing processes (PCB cutting, board inspection, mounting additional parts, assembly into chassis, wave soldering reflow soldered boards etc.) this reason, planning pattern configurations position inductors should carefully performed minimize stress. should located minimize possible mechanical stresses from board warp deflection.
Item
recommended
Recommended
Deflection board
1-2. layout inductors breakaway board, should noted that amount mechanical stresses given will vary depending inductor layout. example below should counted better design.
1-3. When breaking boards along their perforations, amount mechanical stress inductors vary according method used. following methods listed order from least stressful most stressful: push-back, slit, V-grooving, perforation. Thus, ideal inductor layout must also consider splitting procedure.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 3.Considerations automatic placement Precautions SAdjustment mounting machine Excessive impact load should imposed inductors when mounting onto boards. maintenance inspection mounter should conducted periodically. Technical considerations
lower limit pick-up nozzle low, much force imposed inductors, causing damage. avoid this, following points should considered before lowering pick-up nozzle: (1)The lower limit pick-up nozzle should adjusted surface level board after correcting deflection board. (2)The pick-up pressure should adjusted between static loads. (3)To reduce amount deflection board caused impact pickup nozzle, supporting pins back-up pins should used under board. following diagrams show some typical examples good pick-up nozzle placement:
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Improper method
Proper method
Single-sided mounting
Double-sided mounting
alignment wears out, adjustment nozzle height cause chipping cracking inductors because mechanical impact inductors. avoid this, monitoring width between alignment stopped position, maintenance, inspection replacement should conducted periodically.
SSelection Adhesives Mounting inductors with adhesives preliminary assembly, before soldering stage, lead degraded inductor characteristics unless following factors appropriately checked; size land patterns, type adhesive, amount applied, hardening temperature hardening period. Therefore, imperative consult manufacturer adhesives proper usage amounts adhesive use.
Some adhesives cause reduced insulation resistance. difference between shrinkage percentage adhesive that inductors result stresses inductors lead cracking. Moreover, little much adhesive applied board adversely affect component placement, following precautions should noted application adhesives. (1)Required adhesive characteristics adhesive should strong enough hold parts board during mounting solder process. adhesive should have sufficient strength high temperatures. adhesive should have good coating thickness consistency. adhesive should used during prescribed shelf life. adhesive should harden rapidly adhesive must contaminated. adhesive should have excellent insulation characteristics. adhesive should toxic have emission toxic gasses.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 3.Considerations automatic placement Precaution Technical considerations
When using adhesives mount inductors PCB, inappropriate amounts adhesive board adversely affect component placement. little adhesive cause inductors fall board during solder process. much adhesive cause defective soldering excessive flow adhesive land solder pad. [Recommended conditions] Figure 0805 case sizes examples 0.3mm
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V120 Area with adhesive
4.Soldering
SSelection Flux Since flux have significant effect performance inductors, necessary verify following conditions prior use; (1)Flux used should with less than equal (Chlorine conversion method) halogenated content. Flux having strong acidity content should applied. (2)When soldering inductors board, amount flux applied should controlled optimum level. (3)When using water-soluble flux, special care should taken properly clean boards.
1-1. When much halogenated substance (Chlorine, etc.) content used activate flux, highly acidic flux used, excessive amount residue after soldering lead corrosion terminal electrodes degradation insulation resistance surface Inductor. 1-2. Flux used increase solderability flow soldering, much applied, large amount flux emitted detrimentally affect solderability. minimize amount flux applied, recommended flux-bubbling system. 1-3. Since residue water-soluble flux easily dissolved water content air, residue surface Inductor high humidity conditions cause degradation insulation resistance therefore affect reliability components. cleaning methods capability machines used should also considered carefully when selecting watersoluble flux.
SSoldering Temperature, time, amount solder, etc. specified accordance with following recommended conditions.
1-1. Preheating when soldering Heating: Chip inductor components should preheated within 130C soldering. Cooling: temperature difference between components cleaning process should greater than Chip inductors susceptible thermal shock when exposed rapid concentrated heating rapid cooling. Therefore, soldering process must conducted with great care prevent malfunction components excessive thermal shock.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 4.Soldering Precautions SAnd please contact about peak temperature when lead-free paste. Technical considerations Recommended conditions soldering [Reflow soldering] Temperature profile
TemperaturefCg
Preheating 150C
free solderingg
Peak 260C Gradually cooling
Heating above 230C
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Ceramic chip components should preheated within 130C soldering. Assured reflow soldering times.
Caution ideal condition have solder mass (fillet) controlled thickness inductor, shown below:
Because excessive dwell times detrimentally affect solderability, soldering duration should kept close recommended times possible. [Wave soldering] Temperature profile
TemperaturefCg
Preheating 150C
free solderingg
Peak 260C Gradually cooling
Ceramic chip components should preheated within 130C soldering. Assured wave soldering time. Except reflow soldering type.
Caution Make sure inductors preheated sufficiently. temperature difference between inductor melted solder should greater than 130C Cooling after soldering should gradual possible. Wave soldering must applied inductors designated reflow soldering only.
[Hand soldering] Temperature profile
TemperaturefCg
free solderingg
350C Gradually cooling
fT190C f3216Type maxg, T130C f3225 Type mingg recommended soldering iron less. soldering iron should directly touch components. Assured soldering iron time. Note: above profiles maximum allowable soldering condition, therefore these profiles always recommended.
Caution soldering iron with maximum diameter soldering iron should directly touch inductor. 5.Cleaning SCleaning conditions When cleaning board after Inductors mounted, select appropriate cleaning solution according type flux used purpose cleaning (e.g. remove soldering flux other materials from production process.) inappropriate solutions cause foreign substances such flux residue adhere inductor, resulting degradation inductor's electrical properties (especially insulation resistance).
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 5.Cleaning Precautions Cleaning conditions should determined after verifying, through test run, that cleaning process does affect inductor's characteristics. Technical considerations
Inappropriate cleaning conditions (insufficient excessive cleaning) detrimentally affect performance inductors. (1)Excessive cleaning case ultrasonic cleaning, much power output cause excessive vibration board which lead cracking inductor soldered portion, decrease terminal electrodes' strength. Thus following conditions should carefully checked; Ultrasonic output Below Ultrasonic frequency Below Ultrasonic washing period min. less
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Post cleaning processes
SApplication resin coatings, moldings, etc. components. With some type resins decomposition chemical reaction vapor remain inside resin during hardening period while left under normal storage conditions resulting deterioration inductor's performance. When resin's hardening temperature higher than inductor's operating temperature, stresses generated excess heat lead inductor damage destruction. Stress caused resin's temperature generated expansion contraction damage inductors. such resins, molding materials etc. recommended.
Handling
SBreakaway boards (splitting along perforations) When splitting board after mounting inductors other components, care required give stresses deflection twisting board. Board separation should done manually, using appropriate devices. SGeneral handling precautions Always wear static control bands protect against ESD. Keep inductors away from magnets magnetic objects. non-magnetic tweezers when handling inductors. devices used with inductors (soldering irons, measuring instruments) should properly grounded. Keep bare hands metal products (i.e., metal desk) away from chip electrodes conductive areas that lead chip electrodes. Keep inductors away from items that generate magnetic fields such speakers coils.
SMechanical considerations careful subject inductors excessive mechanical shocks. inductors dropped floor hard surface they should used. (2)When handling mounted boards, careful that mounted components come contact with bump against other boards components.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages Storage conditions Precautions SStorage maintain solderability terminal electrodes keep packaging material good condition, care must taken control temperature humidity storage area. Humidity should especially kept possible. Recommended conditions Ambient temperature Humidity Technical considerations
parts stocked high temperature humidity environment, problems such reduced solderability caused oxidation terminal electrodes deterioration taping/packaging materials take place. this reason, components should used within months from time delivery. exceeding above period, please check solderability before using inductors
Below Below
FERRITE PRODUCTS
ambient temperature must kept below Even under ideal storage conditions inductor electrode solderability decreases time passes, inductors should used within months from time delivery. *The packaging material should kept where chlorine sulfur exists air.

OPERATING TEMP. -55V+125C BK0603, BK1005 Except BK0603, BK1005

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