SCES308G AUGUST 2001 REVISED JANUARY 2007 Available Texas Instrum

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SCES308G AUGUST 2001 REVISED JANUARY 2007 Available Texas Instrum

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SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES308G AUGUST 2001 REVISED JANUARY 2007
Available Texas Instruments NanoFreePackage Supports Operation Inputs Open-Drain Outputs Accept Voltages Power Consumption, 10-µA ±24-mA Output Drive Typical VOLP (Output Ground Bounce) <0.8 25°C
PACKAGE (TOP VIEW)
Typical VOHV (Output Undershoot) 25°C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds JESD Class Protection Exceeds JESD 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101)
PACKAGE (BOTTOM VIEW)
PACKAGE (TOP VIEW)
mechanical drawings dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver designed 1.65-V 5.5-V operation. output SN74LVC2G07 open drain connected other open-drain outputs implement active-low wired-OR active-high wired-AND functions. maximum sink current NanoFreepackage technology major breakthrough packaging concepts, using package. This device fully specified partial-power-down applications using Ioff. Ioff circuitry disables outputs, preventing damaging current backflow through device when powered down. ORDERING INFORMATION
PACKAGE NanoFree- WCSP (DSBGA) 0.23-mm Large Bump (Pb-free) -40°C 85°C (SOT-23) (SC-70) Reel 3000 Reel 3000 Reel 3000 Reel ORDERABLE PART NUMBER SN74LVC2G07YZPR SN74LVC2G07DBVR SN74LVC2G07DCKR SN74LVC2G07DCKT TOP-SIDE MARKING _CV_ C07_
Package drawings, standard packing quantities, thermal data, symbolization, design guidelines available www.ti.com/sc/package. DBV/DCK: actual top-side marking additional character that designates assembly/test site. YZP: actual top-side marking three preceding characters denote year, month, sequence code, following character designate assembly/test site. identifier indicates solder-bump composition SnPb, Pb-free).
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. NanoFree trademark Texas Instruments.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
Copyright 2001-2007, Texas Instruments Incorporated
SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES308G AUGUST 2001 REVISED JANUARY 2007
FUNCTION TABLE (EACH BUFFER/DRIVER)
INPUT OUTPUT
LOGIC DIAGRAM (POSITIVE LOGIC)
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Supply voltage range Input voltage range Voltage range applied output high-impedance power-off state Voltage range applied output high state Input clamp current Output clamp current Continuous output current Continuous current through package Tstg Package thermal impedance Storage temperature range package package -0.5 -0.5 -0.5 -0.5 ±100 °C/W UNIT
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. input negative-voltage output voltage ratings exceeded input output current ratings observed. value provided recommended operating conditions table. package thermal impedance calculated accordance with JESD 51-7.
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SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES308G AUGUST 2001 REVISED JANUARY 2007
Recommended Operating Conditions
Supply voltage
Operating Data retention only 1.65 1.95 High-level input voltage 1.65 1.95 Low-level input voltage Input voltage Output voltage 1.65 Low-level output current 0.15 Input transition rise fall rate Operating free-air temperature 1.65 0.65
UNIT
0.35 ns/V
unused inputs device must held ensure proper device operation. Refer application report, Implications Slow Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER Ioff inputs GND, input typical values 25°C. Other inputs TEST CONDITIONS 1.65 1.65 1.65 0.45 0.55 0.55 UNIT
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SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES308G AUGUST 2001 REVISED JANUARY 2007
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure
PARAMETER FROM (INPUT) (OUTPUT) 0.15 UNIT
Operating Characteristics
25°C
PARAMETER Power dissipation capacitance TEST CONDITIONS UNIT
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SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES308G AUGUST 2001 REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION (OPEN DRAIN)
VLOAD From Output Under Test (see Note Open TEST tPZL (see Notes tPLZ (see Notes tPHZ/tPZH VLOAD VLOAD VLOAD
LOAD CIRCUIT INPUTS 0.15 tr/tf VCC/2 VCC/2 VCC/2 VLOAD 0.15 0.15 Timing Input Input VOLTAGE WAVEFORMS PULSE DURATION Input tPLH Output tPHL tPHL tPLH Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS Output Waveform (see Note Output Waveform VLOAD (see Note tPZH VOLTAGE WAVEFORMS SETUP HOLD TIMES tPZL tPLZ VLOAD/2 tPHZ Data Input
Output Control
VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING
NOTES: includes probe capacitance. Waveform output with internal conditions such that output low, except when disabled output control. Waveform output with internal conditions such that output high, except when disabled output control. input pulses supplied generators have following characteristics: MHz, outputs measured time, with transition measurement. Because this device open-drain outputs, tPLZ tPZL same tPD. tPZL measured tPLZ measured parameters waveforms applicable devices.
Figure Load Circuit Voltage Waveforms
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PACKAGE OPTION ADDENDUM
4-May-2007
PACKAGING INFORMATION
Orderable Device SN74LVC2G07DBVR SN74LVC2G07DBVRE4 SN74LVC2G07DBVRG4 SN74LVC2G07DCKR SN74LVC2G07DCKRE4 SN74LVC2G07DCKRG4 SN74LVC2G07DCKT SN74LVC2G07DCKTE4 SN74LVC2G07DCKTG4 SN74LVC2G07YEPR SN74LVC2G07YZPR
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE NRND ACTIVE
Package Type SOT-23 SOT-23 SOT-23 SC70 SC70 SC70 SC70 SC70 SC70 WCSP WCSP
Package Drawing
Pins Package Plan 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU SNPB SNAGCU
Peak Temp Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
3000 Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
PACKAGE MATERIALS INFORMATION
31-May-2008
TAPE REEL INFORMATION
*All dimensions nominal
Device
Package Package Pins Type Drawing SOT-23 SOT-23 SC70 SC70 SC70 SC70
Reel Reel Diameter Width (mm) (mm) 180.0 178.0 180.0 180.0 180.0 180.0
(mm)
(mm)
(mm)
(mm)
Pin1 (mm) Quadrant
SN74LVC2G07DBVR SN74LVC2G07DBVR SN74LVC2G07DCKR SN74LVC2G07DCKR SN74LVC2G07DCKT SN74LVC2G07DCKT
3000 3000 3000 3000
3.23 3.23 2.24 2.24 2.24 2.24
3.17 3.17 2.34 2.34 2.34 2.34
1.37 1.37 1.22 1.22 1.22 1.22
Pack Materials-Page
PACKAGE MATERIALS INFORMATION
31-May-2008
*All dimensions nominal
Device SN74LVC2G07DBVR SN74LVC2G07DBVR SN74LVC2G07DCKR SN74LVC2G07DCKR SN74LVC2G07DCKT SN74LVC2G07DCKT
Package Type SOT-23 SOT-23 SC70 SC70 SC70 SC70
Package Drawing
Pins
3000 3000 3000 3000
Length (mm) 205.0 180.0 205.0 202.0 202.0 205.0
Width (mm) 200.0 180.0 200.0 201.0 201.0 200.0
Height (mm) 33.0 18.0 33.0 28.0 28.0 33.0
Pack Materials-Page
IMPORTANT NOTICE
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SCES308G AUGUST 2001 REVISED JANUARY 2007 Available Texas Instrum

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