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HLB123SA EPITAXIAL PLANAR TRANSISTOR Description High V


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Spec. HA200601 Issued Date 2006.12.01 Revised Date 2006.12.28 Page
HLB123SA
EPITAXIAL PLANAR TRANSISTOR
Description
High Voltage, High Speed Power Switch Switch Regulators Inverters Motor Controls Solenoid Relay Drivers Deflection Circuits
TO-92
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (TC=25°C) Maximum Voltages Currents (TC=25°C) VCBO Collector Emitter Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage. Collector Current Continuous Base Current. Continuous 0.3A
Electrical Characteristics (TC=25°C)
Symbol BVCBO BVCEO IEBO ICEX *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *VBE(sat) *hFE1 *hFE2 Min. Typ. Max. Unit IB=1mA IC=10mA VEB=9V VCE=700V, VBE(off)=1.5V IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=1.5A, IB=0.5A IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=0.3A, VCE=5V IC=1A, VCE=5V
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Test Conditions
HLB123SA
HSMC Product Specification
Characteristics Curve
Spec. HA200601 Issued Date 2006.12.01 Revised Date 2006.12.28 Page
VBE(sat)
VCE=5V
VBE(sat)
VBE(sat) IC=5IB
0.001
0.01
0.001
0.01
VBE(sat)
VCE(sat)
VBE(sat)
VCE(sat)
VCE(sat) IC=5IB
VBE(sat) IC=4IB
0.001
0.01
0.01 0.001
0.01
VCE(sat)
Capacitance Reverse-Biased Voltage
Capacitance (pF)
VCE(sat) IC=4IB
VCE(sat)
0.01 0.001
0.01
Reverse-Biased Voltage
HLB123SA
HSMC Product Specification
Spec. HA200601 Issued Date 2006.12.01 Revised Date 2006.12.28 Page
(us)
VCE=125V IC=5IB1=-5IB2
(us)
VCE=125V IC=5IB1=-5IB2
0.01
Toff
(us)
VCE=125V IC=5IB1=-5IB2
HLB123SA
HSMC Product Specification
TO-92 Dimension
Marking:
Free Mark
Pb-Free: (Note) Normal: None
Spec. HA200601 Issued Date 2006.12.01 Revised Date 2006.12.28 Page
Control Code
Date Code
Note: Green label used pb-free packing
Style: 1.Emitter 2.Collector 3.Base Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Min. 4.33 4.33 12.70 0.36 3.36 0.36
Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27
Typical, Unit:
3-Lead TO-92 Plastic Package HSMC Package Code:
TO-92 Taping Dimension
F1,F2 Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 Max. 4.83 4.20 0.53 4.83 2.90 16.50 9.50 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00
Unit:
F1F2
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HLB123SA HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HA200601 Issued Date 2006.12.01 Revised Date 2006.12.28 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly C/sec
Pb-Free Assembly <3oC/sec
150oC 60~120
200oC 60~180
<3oC/sec
<3oC/sec
217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes
60~150 +0/-5 10~30 <6oC/sec minutes
Peak temperature
Dipping time 10sec ±1sec 10sec ±1sec
HLB123SA
HSMC Product Specification

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