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FDS6670AS N-Channel PowerTrench® SyncFETGeneral Description
Top Searches for this datasheetFDS6670AS N-Channel PowerTrench® SyncFET FDS6670AS N-Channel PowerTrench® SyncFETGeneral Description FDS6670AS designed replace single SO-8 MOSFET Schottky diode synchronous DC:DC power supplies. This MOSFET designed maximize power conversion efficiency, providing RDS(ON) gate charge. FDS6670AS includes integrated Schottky diode using Fairchild's monolithic SyncFET technology. Features 13.5 RDS(ON) max= RDS(ON) max= 11.5 Includes SyncFET Schottky body diode gate charge (27nC typical) High performance trench technology extremely RDS(ON) fast switching High power current handling capability RoHS Compliant Applications DC/DC converter side notebook SO-8 Absolute Maximum Ratings Symbol VDSS VGSS Drain-Source Voltage Gate-Source Voltage Drain Current Continuous Pulsed TA=25oC unless otherwise noted Parameter Ratings (Note Units 13.5 +150 Power Dissipation Single Operation (Note (Note (Note TSTG Operating Storage Junction Temperature Range Thermal Characteristics Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note (Note °C/W °C/W Package Marking Ordering Information Device Marking FDS6670AS Device FDS6670AS Reel Size 13'' Tape width 12mm Quantity 2500 units ©2008 Fairchild Semiconductor Corporation FDS6670AS FDS6670AS N-Channel PowerTrench® SyncFET Electrical Characteristics Symbol BVDSS BVDSS IDSS IGSS 25°C unless otherwise noted Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage (Note Test Conditions Referenced 25°C Units Characteristics ±100 mV/°C Characteristics VGS(th) VGS(th) RDS(on) Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance VGS, Referenced 25°C 13.5 11.2 VGS=10 =13.5A, TJ=125°C 13.5 mV/°C 11.5 12.5 ID(on) Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance (Note 1540 Switching Characteristics td(on) td(off) td(on) td(off) Qg(TOT) Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time RGEN RGEN 13.5 Total Gate Charge Vgs=10V Total Gate Charge Vgs=5V Gate-Source Charge Gate-Drain Charge FDS6670AS FDS6670AS N-Channel PowerTrench® SyncFET Electrical Characteristics Symbol Notes: 25°C unless otherwise noted Parameter Drain-Source Diode Forward Voltage Diode Reverse Recovery Time Diode Reverse Recovery Charge Test Conditions 13.5A, diF/dt A/µs Units Drain-Source Diode Characteristics Maximum Ratings (Note (Note (Note junction-to-case case-to-ambient thermal resistance where case thermal reference defined solder mounting surface drain pins. guaranteed design while determined user's board design. 50°C/W when mounted copper 105°C/W when mounted copper 125°C/W when mounted minimum pad. Scale letter size paper Pulse Test: Pulse Width 300µs, Duty Cycle 2.0% "SyncFET Schottky body diode characteristics" below. FDS6670AS FDS6670AS N-Channel PowerTrench® SyncFET Typical Characteristics 6.0V 4.5V 3.0V 3.5V 4.0V DRAIN CURRENT RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 3.0V 3.5V 4.0V 4.5V 6.0V 2.5V VDS, DRAIN-SOURCE VOLTAGE DRAIN CURRENT Figure On-Region Characteristics. Figure On-Resistance Variation with Drain Current Gate Voltage. 0.025 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 13.5A RDS(ON), ON-RESISTANCE (OHM) 6.75A 0.02 0.015 0.01 JUNCTION TEMPERATURE 0.005 VGS, GATE SOURCE VOLTAGE Figure On-Resistance Variation with Temperature. Figure On-Resistance Variation with Gate-to-Source Voltage. REVERSE DRAIN CURRENT DRAIN CURRENT 125oC 0.01 125oC 25oC VGS, GATE SOURCE VOLTAGE 0.001 VSD, BODY DIODE FORWARD VOLTAGE Figure Transfer Characteristics. Figure Body Diode Forward Voltage Variation with Source Current Temperature. FDS6670AS FDS6670AS N-Channel PowerTrench® SyncFET Typical Characteristics (continued) VGS, GATE-SOURCE VOLTAGE =13.5A 2400 1MHz CAPACITANCE (pF) 1800 Ciss 1200 Coss Crss GATE CHARGE (nC) VDS, DRAIN SOURCE VOLTAGE Figure Gate Charge Characteristics. P(pk), PEAK TRANSIENT POWER RDS(ON) LIMIT 100µs 10ms 100ms Figure Capacitance Characteristics. SINGLE PULSE 125°C/W 25°C DRAIN CURRENT SINGLE PULSE 125oC/W 0.01 0.01 VDS, DRAIN-SOURCE VOLTAGE 0.001 0.01 TIME (sec) 1000 Figure Maximum Safe Operating Area. Figure Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 0.05 0.02 0.01 RJA(t) r(t) °C/W P(pk) SINGLE PULSE 0.01 RJA(t) Duty Cycle, 0.001 0.0001 0.001 0.01 TIME (sec) 1000 Figure Transient Thermal Response Curve. Thermal characterization performed using conditions described Note Transient thermal response will change depending circuit board design. FDS6670AS A2(X) FDS6670AS N-Channel PowerTrench® SyncFET Typical Characteristics (continued) SyncFET Schottky Body Diode Characteristics Fairchild's SyncFET process embeds Schottky diode parallel with PowerTrench MOSFET. This diode exhibits similar characteristics discrete external Schottky diode parallel with MOSFET. Figure shows reverse recovery characteristic FDS6670AS. Schottky barrier diodes exhibit significant leakage high temperature high reverse voltage. This will increase power device. IDSS, REVERSE LEAKAGE CURRENT 0.01 125oC 0.001 100oC CURRENT 0.4A/div 0.0001 25oC 0.00001 VDS, REVERSE VOLTAGE Figure SyncFET body diode reverse leakage versus drain-source voltage temperature. TIME 12.5ns/div Figure FDS6670AS SyncFET body diode reverse recovery characteristic. comparison purposes, Figure shows reverse recovery characteristics body diode equivalent size MOSFET produced without SyncFET (FDS6670A). CURRENT 0.4A/div TIME 12.5ns/div Figure Non-SyncFET (FDS6670A) body diode reverse recovery characteristic. FDS6670AS TRADEMARKS following includes registered unregistered trademarks service marks, owned Fairchild Semiconductor and/or global subsidianries, intended exhaustive list such trademarks. ACEx® Build Transfer LogicEcoSPARK® EfficentMaxEZSWITCH* Fairchild® Fairchild Semiconductor® FACT Quiet SeriesFACT® FAST® FastvCoreFlashWriter® FPSF-PFSFRFET® Global Power ResourceSM Green FPSGreen OPTOPLANAR® PDP-SPMPower-SPMPowerTrench® Programmable Active DroopQFET® QSQuiet SeriesRapidConfigureSaving world timeSmartMaxSMART STARTSPM® STEALTHSuperFETSuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SuperMOS® Power Franchise® TinyBoostTinyBuckTinyLogic® Ultra FRFETUniFETVCXVisualMax EZSWITCHand FlashWriter® trademarks System General Corporation, used under license Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION, DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. THESE SPECIFICATIONS EXPAND TERMS FAIRCHILD'S WORLDWIDE TERMS CONDITIONS, SPECIFICALLY WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user. critical component component life support, device, system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data; supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice improve design. This datasheet contains specifications product that discontinued Fairchild Semiconductor. datasheet reference information only. Rev. Preliminary First Production Identification Needed Obsolete Full Production Production FDS6670AS Other recent searchesXMURG30A-1A - XMURG30A-1A XMURG30A-1A Datasheet ST280CH - ST280CH ST280CH Datasheet PD-21016 - PD-21016 PD-21016 Datasheet MH18BC - MH18BC MH18BC Datasheet MH14BC - MH14BC MH14BC Datasheet MH10BC - MH10BC MH10BC Datasheet LMH0356 - LMH0356 LMH0356 Datasheet DS22EV5110 - DS22EV5110 DS22EV5110 Datasheet
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