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Power White Surface Mount Device Package outlines Re-flow Profile
Top Searches for this datasheetPart Number: 61-24UWC Power White Surface Mount Device Package outlines Re-flow Profile Reflow Temp/Time Soldering iron Basic spec 5sec when 260. temperature higher, time should shorter (+10 -1sec ).Power dissipation iron should smaller than 15W, temperatures should controllable .Surface temperature device should under ITEM Resin (mold) Lens color Printed circuit board Emitted color reflow soldering (Propose) Material MATERIALS Epoxy Yellow Diffused White InGaN NOTES: dimensions millimeters (inches); Tolerances ±0.1mm (0.004inch) unless otherwise noted. Polarity referring onto cathode mark reversed red. Part Number: 61-24UWC ELECTRO-OPTICAL CHARACTERISTICS Parameter Viewing angle Forward voltage Luminous intensity Peak pulsing current (1/10 duty f=1kHz) (TA=25) Value MIN. TYP. MAX. Test Condition Symbol IF=10mA IF=20mA IF=20mA*2line 21/2 Unit -7.0 3600 4500 Absolute maximum ratings Parameter Forward current Reverse voltage Reverse current Power Consumptoin Operating temperature range Storage temperature range (TA=25) Symbol Tstg Value ~+85 ~+100 Unit Part Number: 61-24UWC Chromaticity Diagram Part Number: 61-24UWC Typical Electro-Optical Characteristic Curves Part Number: 61-24UWC Taping Dimension (Unit=mm) Part Number: 61-24UWC Precautions Over-current proof Customer must apply resistors protection, otherwise slight voltage shift will cause current change (Burn will happen). Storage open moisture proof before products ready use. Before opening package, LEDs should kept less 90%RH less. LEDs should used within year. After opening package, LEDs should kept less 70%RH less. LEDs should used within hours days) after opening package. moisture absorbent material (silica gel) faded away LEDs have exceeded storage time, baking treatment should performed using following conditions. Baking treatment60±5 hours. Soldering Condition Pb-free solder temperature profile Reflow soldering should done more than times. When soldering, stress LEDs during heating. After soldering, warp circuit board. Soldering Iron Each terminal soldering iron temperature less than seconds within once less than soldering iron capacity 25W. Leave seconds more intervals, soldering each terminal. careful because damage product often started time hand solder. Other recent searchesSI-3011S - SI-3011S SI-3011S Datasheet MF1466-01 - MF1466-01 MF1466-01 Datasheet Max220 - Max220 Max220 Datasheet LIN-18012XX - LIN-18012XX LIN-18012XX Datasheet LIN-18013XX - LIN-18013XX LIN-18013XX Datasheet FSP3124 - FSP3124 FSP3124 Datasheet FL-3620 - FL-3620 FL-3620 Datasheet PT-3610 - PT-3610 PT-3610 Datasheet FL-3620F - FL-3620F FL-3620F Datasheet PT-3610F - PT-3610F PT-3610F Datasheet ELM313 - ELM313 ELM313 Datasheet BDY20 - BDY20 BDY20 Datasheet BDY29 - BDY29 BDY29 Datasheet BDY37 - BDY37 BDY37 Datasheet BDY38 - BDY38 BDY38 Datasheet BDY39 - BDY39 BDY39 Datasheet BDY55 - BDY55 BDY55 Datasheet BDY56 - BDY56 BDY56 Datasheet BDY57 - BDY57 BDY57 Datasheet BDY58 - BDY58 BDY58 Datasheet BDY90 - BDY90 BDY90 Datasheet BDY91 - BDY91 BDY91 Datasheet BDY93 - BDY93 BDY93 Datasheet BDY94 - BDY94 BDY94 Datasheet BDY95 - BDY95 BDY95 Datasheet BLX10 - BLX10 BLX10 Datasheet BLX11 - BLX11 BLX11 Datasheet BLX12 - BLX12 BLX12 Datasheet BLX16 - BLX16 BLX16 Datasheet BLX17 - BLX17 BLX17 Datasheet BLX18 - BLX18 BLX18 Datasheet BLX19 - BLX19 BLX19 Datasheet BLX20 - BLX20 BLX20 Datasheet BLX21 - BLX21 BLX21 Datasheet BLX25 - BLX25 BLX25 Datasheet BLX26 - BLX26 BLX26 Datasheet BLX27 - BLX27 BLX27 Datasheet BLX28 - BLX28 BLX28 Datasheet BLX29 - BLX29 BLX29 Datasheet BLX30 - BLX30 BLX30 Datasheet
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