Power White Surface Mount Device Package outlines Re-flow Profile

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

Power White Surface Mount Device Package outlines Re-flow Profile

Datasheet Thumbnail

Top Searches for this datasheet

Part Number: 61-23UWC
Power White Surface Mount Device Package outlines Re-flow Profile
Reflow Temp/Time
Soldering iron Basic spec 5sec when 260. temperature higher, time should shorter (+10 -1sec ).Power dissipation iron should smaller than 15W, temperatures should controllable .Surface temperature device should under
ITEM
Resin (mold) Lens color Printed circuit board Emitted color reflow soldering (Propose) Material
MATERIALS
Epoxy Yellow Diffused White InGaN
NOTES:
dimensions millimeters (inches); Tolerances ±0.1mm (0.004inch) unless otherwise noted. Polarity referring onto cathode mark reversed red.
Part Number: 61-23UWC ELECTRO-OPTICAL CHARACTERISTICS Parameter
Viewing angle Forward voltage Luminous intensity Peak pulsing current (1/10 duty f=1kHz)
(TA=25) Value
MIN. TYP. MAX.
Test Condition Symbol
IF=10mA IF=20mA IF=40mA*3line 21/2
Unit
-3.8
2600 3250
Absolute maximum ratings Parameter
Forward current Reverse voltage Reverse current Power Consumptoin Operating temperature range Storage temperature range
(TA=25) Symbol
Tstg
Value
~+85 ~+100
Unit
Part Number: 61-23UWC
Chromaticity Diagram Color Ranks
Part Number: 61-23UWC
Typical Electro-Optical Characteristic Curves
Part Number: 61-23UWC
Taping Dimension (Unit=mm)
Part Number: 61-23UWC
Precautions
Over-current proof Customer must apply resistors protection, otherwise slight voltage shift will cause current change (Burn will happen). Storage open moisture proof before products ready use. Before opening package, LEDs should kept less 90%RH less. LEDs should used within year. After opening package, LEDs should kept less 70%RH less. LEDs should used within hours days) after opening package. moisture absorbent material (silica gel) faded away LEDs have exceeded storage time, baking treatment should performed using following conditions. Baking treatment60±5 hours. Soldering Condition Pb-free solder temperature profile
Reflow soldering should done more than times. When soldering, stress LEDs during heating. After soldering, warp circuit board. Soldering Iron Each terminal soldering iron temperature less than seconds within once less than soldering iron capacity 25W. Leave seconds more intervals, soldering each terminal. careful because damage product often started time hand solder.

Power White Surface Mount Device Package outlines Re-flow Profile

Top Searches for this datasheet

Other recent searches