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Power Sunset White Surface Mount Device Package outlines Re-flow Profi
Top Searches for this datasheetPart Number: 61-23SWC Power Sunset White Surface Mount Device Package outlines Re-flow Profile Reflow Temp/Time Soldering iron Basic spec 5sec when 260. temperature higher, time should shorter (+10 -1sec ).Power dissipation iron should smaller than 15W, temperatures should controllable .Surface temperature device should under ITEM Resin (mold) Lens color Printed circuit board Emitted color reflow soldering (Propose) Material MATERIALS Epoxy Yellow Diffused Sunset White InGaN NOTES: dimensions millimeters (inches); Tolerances ±0.1mm (0.004inch) unless otherwise noted. Polarity referring onto cathode mark reversed red. Part Number: 61-23SWC ELECTRO-OPTICAL CHARACTERISTICS Parameter Viewing angle Forward voltage Luminous intensity Peak pulsing current (1/10 duty f=1kHz) (TA=25) Value MIN. TYP. MAX. Test Condition Symbol IF=10mA IF=20mA IF=60mA 21/2 Unit -3.8 2900 3250 Absolute maximum ratings Parameter Forward current Reverse voltage Reverse current Power Consumptoin Operating temperature range Storage temperature range (TA=25) Symbol Tstg Value ~+85 ~+100 Unit Part Number: 61-23SWC Chromaticity Diagram Color Ranks Part Number: 61-23SWC Typical Electro-Optical Characteristic Curves Part Number: 61-23SWC Taping Dimension (Unit=mm) Part Number: 61-23SWC Precautions Over-current proof Customer must apply resistors protection, otherwise slight voltage shift will cause current change (Burn will happen). Storage open moisture proof before products ready use. Before opening package, LEDs should kept less 90%RH less. LEDs should used within year. After opening package, LEDs should kept less 70%RH less. LEDs should used within hours days) after opening package. moisture absorbent material (silica gel) faded away LEDs have exceeded storage time, baking treatment should performed using following conditions. Baking treatment60±5 hours. Soldering Condition Pb-free solder temperature profile Reflow soldering should done more than times. When soldering, stress LEDs during heating. After soldering, warp circuit board. Soldering Iron Each terminal soldering iron temperature less than seconds within once less than soldering iron capacity 25W. Leave seconds more intervals, soldering each terminal. careful because damage product often started time hand solder. Other recent searchesTLVH431 - TLVH431 TLVH431 Datasheet TLVH431A - TLVH431A TLVH431A Datasheet TLVH431B - TLVH431B TLVH431B Datasheet TLVH432 - TLVH432 TLVH432 Datasheet TLVH432A - TLVH432A TLVH432A Datasheet TLVH432B - TLVH432B TLVH432B Datasheet SLVS555F - SLVS555F SLVS555F Datasheet PD60030 - PD60030 PD60030 Datasheet IR2213 - IR2213 IR2213 Datasheet PCI-1760 - PCI-1760 PCI-1760 Datasheet NJU6465 - NJU6465 NJU6465 Datasheet NJU6620 - NJU6620 NJU6620 Datasheet MS-324 - MS-324 MS-324 Datasheet MS-324- - MS-324- MS-324- Datasheet LM3205 - LM3205 LM3205 Datasheet LH15A1 - LH15A1 LH15A1 Datasheet
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