SHIELD 100MS epoxy encapsulated electromagnetic/ electrostatic in

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SHIELD 100MS epoxy encapsulated electromagnetic/ electrostatic in

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100MS
SHIELD
100MS epoxy encapsulated electromagnetic/ electrostatic interference (EMI) shield with circuits where sensitivity critical. designed attenuate converting electromagnetic field energy into heat that absorbed shield shunting electrostatic fields common. 100MS used applications either confine exclude EMI. cavity designed 28.45mm 28.45mm 7.24mm, 20-pin hybrid packages. shields cover base plate separate halves maintain electrical isolation between adjacent rows pins module encloses. Because spacing between shield halves epoxy flow holes, 100MS provides partial, adequate reluctance path electromagnetic flux. 100MS well suited with isolation modules such Burr-Brown 3656, 722, 724. over module tabs aligned into slots base plate. Bend four wide shield soldering tabs protruding from cover make contact with bare metal base plate. Solder these four tabs insure integrity their connection base plate. 100MS module contains mounted secured printed circuit board (PCB) soldering narrow solder tabs appropriate common. solder closest input side module should soldered input common. other should soldered output common. Figure illustrates assembly 100MS.
Cover
ASSEMBLY INSTRUCTIONS
Assemble base plate module pushing pins module through beveled holes base plate until base plate bottom module contact with each other. Place cover
Epoxy Encapsulant
Shield Solder Solder
Shield Solder
Module (reference only)
Half Cover Shield
Half Cover Shield
Base Plate Shield VISO Connection Input Common VISO Isolation Voltage Connection Output Common
Base Plate
FIGURE Cross-Sectional Side View 100MS.
International Airport Industrial Park Mailing Address: 11400 Tel: (520) 746-1111 Twx: 910-952-1111 Cable: BBRCORP
FIGURE Assembly Diagram.
Tucson, 85734 Street Address: 6730 Tucson Blvd. Tucson, 85706 Telex: 066-6491 FAX: (520) 889-1510 Immediate Product Info: (800) 548-6132
1979 Burr-Brown Corporation
PDS-421A
Printed U.S.A. October, 1993
SBFS013
SPECIFICATIONS
ELECTRICAL
Specifications apply between solder tabs. 100MS PARAMETER Isolation Voltage Rated Continuous, Rated Continuous, Test Capacitance Resistance Leakage Current CONDITIONS 3500 2000 8000 1010 0.23 UNITS Vrms
Seconds
120V, 60Hz
NOTE: Temperature changes (T/t) greater than minute below long term storage above 100°C recommended.
PACKAGE INFORMATION(1)
MODEL 100MS PACKAGE Shield PACKAGE DRAWING NUMBER
NOTE: detailed drawing dimension table, please data sheet, Appendix Burr-Brown Data Book.
APPLICATIONS INFORMATION
MULTIPLE DEVICE ORIENTATION typical application 100MS shown Figure Using multiple devices within 30mm each other cause them interact forming beat frequency interference outputs. 100MS reduce this interference much factor 200:1 depending distance between devices their relative orientation. Minimum results when gaps both shields paralleled Figure
3656 19.6k C(1) Power C(1) Supply Common VOUT1 100k
C(1) Thermocouple +VCC
100k
Shield
3656 19.6k
100MS
VOUT2
Power C(1) C(1) Supply Common
Shield
100MS
Optimum Layout.
C(1) Thermocouple NOTE: 0.47µF. +VCC
FIGURE Optimum Layout. Orientation minimum EMI.
FIGURE Isolated Data Acquisition Input Circuitry. Orientation Minimum EMI.
information provided herein believed reliable; however, BURR-BROWN assumes responsibility inaccuracies omissions. BURR-BROWN assumes responsibility this information, such information shall entirely user's risk. Prices specifications subject change without notice. patent rights licenses circuits described herein implied granted third party. BURR-BROWN does authorize warrant BURR-BROWN product life support devices and/or systems.
100MS
IMPORTANT NOTICE Texas Instruments subsidiaries (TI) reserve right make changes their products discontinue product service without notice, advise customers obtain latest version relevant information verify, before placing orders, that information being relied current complete. products sold subject terms conditions sale supplied time order acknowledgment, including those pertaining warranty, patent infringement, limitation liability. warrants performance semiconductor products specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques utilized extent deems necessary support this warranty. Specific testing parameters each device necessarily performed, except those mandated government requirements. Customers responsible their applications using components. order minimize risks associated with customer's applications, adequate design operating safeguards must provided customer minimize inherent procedural hazards. assumes liability applications assistance customer product design. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right covering relating combination, machine, process which such semiconductor products services might used. TI's publication information regarding third party's products services does constitute TI's approval, warranty endorsement thereof.
Copyright 2000, Texas Instruments Incorporated

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