Reliability Test Summary MOSFET DPAK DPAK3 15/12/2003 06/06/2005
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Date: 03/03/2006 Zetex Semiconductors ISO/TS16949:2002 FILE A9273
Reliability Test Summary
MOSFET DPAK DPAK3 15/12/2003 06/06/2005
0893
Device Family Package: Date From: Date
Environmental Trial Data Trial Type (Autoclave) (Cold Store) (Hot Store) RSHD (Resistance Solder Heat Dip) SOLDERABILITY (Solderability) (Temperature Cycle Air) (Temperature Humidity Bias) Devices Tested Devices Failed Cumulative Hours 8640 45360 90720 45360 46440 Failures 0.000% 0.000% 0.000% 0.000% 0.000% 0.000% 0.000%
Electrical Stress Trials
Electrical Trial Type: Service Temperature (Deg Ambient Temperature (Deg Activation Energy (eV): Confidence Level (%): Actual Device Hours: Equivalent Device Hours: Number Devices Tested: Number Devices Failed: Mean Time Failure (Hours): Failure Rate FIT's: Failure Rate %/1000 Hours: HTRB (High Temperature Reverse Bias) 90720 1.155E+08 1.260E+08 7.9354 7.935E-04
David Fitton Quality Engineer
Copyright 2006 Zetex Semiconductors
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