Surface mounted, package Package outline Inches 0.086 0.094 0.005
|
|
|
Top Searches for this datasheet
Package information DPAK
Surface mounted, package Package outline
Inches 0.086 0.094 0.005 0.020 0.035 0.030 0.045 0.205 0.215 0.018 0.024 0.018 0.023 0.213 0.245 0.205 0.250 0.265 0.170
Millimeters 2.18 2.39 0.127 0.508 0.89 0.762 1.14 5.21 5.46 0.457 0.61 0.457 0.584 5.41 6.22 5.21 6.35 6.73 4.32
Inches 0.090 0.370 0.410 0.055 0.070 0.108 0.020 0.035 0.065 0.025 0.040 0.045 0.060
Millimeters 2.29 9.40 10.41 1.40 1.78 2.74 0.508 0.89 1.65 0.635 1.016 1.14 1.52
Note: Controlling dimensions inches. Approximate dimensions provided millimeters
Soldering footprint
0.244 0.118
0.228
0.063
6.17 0.243
2.58 0.101
inches
Issue March 2007
Zetex Semiconductors 2007
www.zetex.com
Package information DPAK
Nominal weight
Nominal weight device 93mg.
Tape reel information
Orientation Tape width (mm) Reel size (inches) components Tape option indicator
Direction unreel
2,500
Embossed carrier tape configuration
cover tape pitches culmulative tolerance tape ±0.2mm (±0.008")
Note
Note
Note
Embossment Center lines cavity
User direction feed
Dimensions (inches) (max.) (max.)
Tape size (mm) 4.55 (0.179) 1.50 0.10 0.00 1.00 (0.039) 1.75 0.10 3.50 0.10 (0.138 0.004) 4.00 ±0.10 (0.157 0.004) note* 8.20 (0.323) 1.50 0.10 0.00 1.50 (0.059) 1.75 0.10 5.50 0.05 (0.217 0.002) 4.00 ±0.10 (0.157 0.004) 8.00 ±0.10 (0.315 0.004) note* 12.10 (0.476) 1.50 0.10 0.00 1.50 (0.059) 1.75 0.10 7.50 0.10 (0.295 0.004) 4.00 0.10 (0.157 0.004) 8.00 ±0.10 (0.315 0.004) 12.00 0.10 (0.472 0.004) 4.00 0.10 2.00 0.05 0.40 16.30 (0.642) note* note* 20.10 (0.791) 1.50 0.10 0.00 1.50 (0.059) 1.75 0.10 11.50 0.10 (0.453 0.004) 4.00 0.10 (0.157 0.004) 20.00 0.10 (0.787 0.004) 4.00 (0.157) increments 4.00 0.10 2.00 0.05 0.40 24.30 (0.957)
(max.)
4.00 0.10 2.00 0.05 0.40 8.00 (0.315)
4.00 0.10 2.00 0.05 0.40 12.00 0.30 (0.472 0.012)
NOTES: dimensions determined with respect EIA/JEDEC rotational lateral movement requirements (see fig.
Issue March 2007
Zetex Semiconductors 2007
www.zetex.com
Package information DPAK
0.5mm maximum maximum Component cavity center line
0.5mm maximum maximum
Component center line
Sketch (top view) Component lateral movement
Sketch (side front sectional view) Component rotation side view
Sketch (top view) Component rotation view
Figure rotational lateral movement
Reel configuration
Tape slot core tape start. 2.5mm min. width, 10mm min. depth
Full radius
Tape Option
max. (7.047) (12.992)
min. (0.06)
13.00 13.02 (0.512 0.52)
min. 25.0 (0.984) 20.2 (0.795) max.
min. (1.969)
Tape size 12mm 16mm 24mm
-9.9 (0.33 0.39) 12.4 -16.4 (0.49 0.569) 16.4 -18.4 (0.65 0.729 24.4 26.4 (0.96 1.039)
14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 30.4 (1.197)
This publication issued provide outline information only which (unless agreed company writing) used, applied reproduced purpose form part order contact regarded representation relating products services concerned. company reserves right alter without notice specification, design, price conditions supply product service.
Issue March 2007
Zetex Semiconductors 2007
www.zetex.com
Other recent searches
TSML3700 - TSML3700 TSML3700 Datasheet
MIC2950 - MIC2950 MIC2950 Datasheet
2951 - 2951 2951 Datasheet
MAX19542 - MAX19542 MAX19542 Datasheet
HN1J02FU - HN1J02FU HN1J02FU Datasheet
CD4013B - CD4013B CD4013B Datasheet
1000Y1016 - 1000Y1016 1000Y1016 Datasheet
35Y1000 - 35Y1000 35Y1000 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
