Surface mounted, package Package outline (3X) (3X) View
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Package information DFN322
Surface mounted, package Package outline
(3X)
(3X)
View
Bottom View
Side View
Millimeters Min. 0.80 0.153 0.180 1.900 Max. 1.00 0.05 0.253 0.300 2.100
Inches Min. 0.0315 0.0060 0.0071 0.0748 Max. 0.0393 0.002 0.0099 0.0118 0.0826
Millimeters Min. 1.22 1.900 0.780 0.480 0.300 Max. 1.42 2.100 0.990 0.680 0.500
Inches Min. 0.0480 0.0748 0.0307 0.0189 0.0118 Max. 0.0559 0.0826 0.0389 0.0267 0.0196
0.65 BSC.
0.02559
Note: Controlling dimensions millimeters. Approximate dimensions provided inches
Soldering footprint
1.60 0.063 0.35 0.014 0.50 0.020 0.65 0.026 1.00 0.039 2.10 0.083
1.35 0.053
0.35 0.014
0.50 0.020 0.65 0.026
inches
Issue April 2008
Zetex Semiconductors 2008
www.zetex.com
Package information DFN322
Nominal weight
Nominal weight device 9.1mg.
Tape reel information
Orientation Tape width (mm) Reel size (inches) components 3,000 10,000 Tape option indicator
Embossed carrier tape configuration
cover tape
pitches culmulative tolerance tape ±0.2mm (±0.008")
Note
Note
Note
Embossment Center lines cavity
User direction feed
Dimensions (inches) (max.) (max.)
Tape size (mm) note 4.55 (0.179) 1.50 0.10 0.00 1.00 (0.039) 1.75 0.10 3.50 0.10 (0.138 0.004) 4.00 ±0.10 (0.157 0.004)
note 8.20 (0.323) 1.50 0.10 0.00 1.50 (0.059) 1.75 0.10 5.50 0.05 (0.217 0.002) 4.00 ±0.10 (0.157 0.004) 8.00 ±0.10 (0.315 0.004)
note 12.10 (0.476) 1.50 0.10 0.00 1.50 (0.059) 1.75 0.10 7.50 0.10 (0.295 0.004) 4.00 0.10 (0.157 0.004) 8.00 ±0.10 (0.315 0.004) 12.00 0.10 (0.472 0.004) 4.00 0.10 2.00 0.05 0.40 16.30 (0.642)
note* 20.10 (0.791) 1.50 0.10 0.00 1.50 (0.059) 1.75 0.10 11.50 0.10 (0.453 0.004) 4.00 0.10 (0.157 0.004) 20.00 0.10 (0.787 0.004) 4.00 (0.157) increments 4.00 0.10 2.00 0.05 0.40 24.30 (0.957)
(max.)
4.00 0.10 2.00 0.05 0.40 8.00 (0.315)
4.00 0.10 2.00 0.05 0.40 12.00 0.30 (0.472 0.012)
NOTES: dimensions determined with respect EIA/JEDEC rotational lateral movement requirements (see fig.
Issue April 2008
Zetex Semiconductors 2008
www.zetex.com
Package information DFN322
0.5mm maximum maximum Component cavity center line
0.5mm maximum maximum
Component center line
Sketch (top view) Component lateral movement
Sketch (side front sectional view) Component rotation side view
Sketch (top view) Component rotation view
Figure rotational lateral movement
Reel configuration
Tape slot core tape start. 2.5mm min. width, 10mm min. depth
Full radius
Tape Option
max. (7.047) (12.992)
min. (0.06)
13.00 13.02 (0.512 0.52)
min. 25.0 (0.984) 20.2 (0.795)
min. (1.969)
Tape size 12mm 16mm 24mm
-9.9 (0.33 0.39) 12.4 -16.4 (0.49 0.569) 16.4 -18.4 (0.65 0.729 24.4 26.4 (0.96 1.039)
max. 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 30.4 (1.197)
This publication issued provide outline information only which (unless agreed company writing) used, applied reproduced purpose form part order contact regarded representation relating products services concerned. company reserves right alter without notice specification, design, price conditions supply product service.
Issue April 2008
Zetex Semiconductors 2008
www.zetex.com
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