Surface mounted, package Package outline IDENTIFICATION CHAMFER 0

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Surface mounted, package Package outline IDENTIFICATION CHAMFER 0

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Package information DFN1443
Surface mounted, package Package outline
IDENTIFICATION CHAMFER 0.300
MARKING
Inches 0.0315 0.0354 0.00 0.002 0.008 REF. 0.0079 0.0118 0.1555 0.1594
Millimeters 0.80 0.90 0.00 0.05 0.203 REF. 0.20 0.30 3.95 4.05
Inches 0.1240 0.1279 0.0197 0.1161 0.1201 0.0650 0.0689 0.0138 0.0177
Millimeters 3.15 3.25 0.50 2.95 3.05 1.65 1.75 0.35 0.45
Note: Controlling dimensions millimeters. Approximate dimensions provided inches
Soldering footprint
Solder footprint
3.30 0.130 1.80 0.071 0.55 0.022 0.55 0.022
0.30 0.012
3.30 0.130
0.50 0.020
0.20 0.008
0.20 0.008
inches
Nominal weight
Nominal weight device 30mg.
Issue March 2008
Zetex Semiconductors 2008
www.zetex.com
Package information DFN1443
Tape reel information
Orientation Tape width (mm) Reel size (inches) components 3,000 10,000 Tape option indicator
Embossed carrier tape configuration
cover tape
pitches culmulative tolerance tape ±0.2mm (±0.008")
Note
Note
Note
Embossment Center lines cavity
User direction feed
Dimensions (inches) (max.) (max.)
Tape size (mm) note
note
note
note* 20.10 (0.791) 1.50 0.10 0.00 1.50 (0.059) 1.75 0.10 11.50 0.10 (0.453 0.004) 4.00 0.10 (0.157 0.004) 20.00 0.10 (0.787 0.004) 4.00 (0.157) increments 4.00 0.10 2.00 0.05 0.40 24.30 (0.957)
4.55 (0.179) 1.50 0.10 0.00 1.00 (0.039) 1.75 0.10 3.50 0.10 (0.138 0.004) 4.00 ±0.10 (0.157 0.004)
8.20 (0.323) 1.50 0.10 0.00 1.50 (0.059) 1.75 0.10 5.50 0.05 (0.217 0.002) 4.00 ±0.10 (0.157 0.004) 8.00 ±0.10 (0.315 0.004)
12.10 (0.476) 1.50 0.10 0.00 1.50 (0.059) 1.75 0.10 7.50 0.10 (0.295 0.004) 4.00 0.10 (0.157 0.004) 8.00 ±0.10 (0.315 0.004) 12.00 0.10 (0.472 0.004) 4.00 0.10 2.00 0.05 0.40 16.30 (0.642)
(max.)
4.00 0.10 2.00 0.05 0.40 8.00 (0.315)
4.00 0.10 2.00 0.05 0.40 12.00 0.30 (0.472 0.012)
NOTES: dimensions determined with respect EIA/JEDEC rotational lateral movement requirements (see fig.
Issue March 2008
Zetex Semiconductors 2008
www.zetex.com
Package information DFN1443
0.5mm maximum maximum Component cavity center line
0.5mm maximum maximum
Component center line
Sketch (top view) Component lateral movement
Sketch (side front sectional view) Component rotation side view
Sketch (top view) Component rotation view
Figure rotational lateral movement
Reel configuration
Tape slot core tape start. 2.5mm min. width, 10mm min. depth
Full radius
Tape option
max. (7.047) (12.992)
min. (0.06)
13.00 13.02 (0.512 0.52)
min. 25.0 (0.984) 20.2 (0.795) max.
min. (1.969)
Tape size 12mm 16mm 24mm
-9.9 (0.33 0.39) 12.4 -16.4 (0.49 0.569) 16.4 -18.4 (0.65 0.729 24.4 26.4 (0.96 1.039)
14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 30.4 (1.197)
This publication issued provide outline information only which (unless agreed company writing) used, applied reproduced purpose form part order contact regarded representation relating products services concerned. company reserves right alter without notice specification, design, price conditions supply product service.
Issue March 2008
Zetex Semiconductors 2008
www.zetex.com

Surface mounted, package Package outline IDENTIFICATION CHAMFER 0

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