U.S. Patent#6377467 SMD1206 Lead(Pb) Free Series, polymer-based P
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SMD1206 Series Surface Mount Devices
U.S. Patent#6377467
SMD1206 Lead(Pb) Free Series, polymer-based Positive Temperature Coefficient (PTC) device protect electrical circuits against overcurrent conditions with resettable feature, fully compatible with current industrial standards. designed SMD1206 Lead(Pb) Free Series provides surface mount overcurrent protection with superior performance that compliant with RoHS Directive 2002/95/EC. Application: SMD1206 Lead(Pb) Free Series ideal computers peripherals applied almost anywhere there voltage power supply load protected. solder plated termination designed meet exceed solderability specifications provide excellent solder joint inspectability. Agency Approval: UL/CSA File No.E201431 Certificate R9956421
ELECTRICAL CHARACTERISTICS
Maximum Time Trip
hold 0.125 SMD1206P012TF 0.16 SMD1206P016TF 0.20 SMD1206P020TF 0.25 SMD1206P025TF 0.35 SMD1206P035TF SMD1206P035TF/15 0.35 0.50 SMD1206P050TF SMD1206P050TF/15 0.50 0.75 SMD1206P075TF 1.00 SMD1206P100TF 1.10 SMD1206P110TF 1.50 SMD1206P150TF
Resistance
Agency
Part Number
Itrip Vmax (Vdc) 0.29 0.37 0.40 0.50 0.75 0.75 1.00 1.00 1.50 1.80 2.20 3.00
max. Current Time 1max Approval (Sec.) 0.20 1.500 3.600 6.000 1.00 0.30 1.200 2.800 4.500 1.00 0.05 0.600 1.550 2.500 8.00 0.08 0.550 1.400 2.300 8.00 0.10 0.300 0.750 1.200 8.00 0.10 0.300 0.750 1.200 8.00 0.10 0.150 0.400 0.700 8.00 0.10 0.150 0.400 0.750 8.00 0.20 0.090 0.200 0.290 8.00 0.30 0.055 0.110 0.210 8.00 0.30 0.040 0.110 0.180 8.00 1.00 0.040 0.080 0.120 8.00
still air.
Note: hold Hold current: maximum current device will pass without tripping
trip Trip current: minimum current which device will trip still air. Vmax Maximum voltage device withstand without damage rated current max) Maximum fault current device withstand without damage rated voltage (Vmax) Power dissipated from device when tripped state still air. min= Minimum resistance device initial (un-soldered) state. Typical resistance device initial (un-soldered) state. 1max= Maximum resistance device measured hour after tripping reflow soldering sec.
Caution: Operation beyond specified rating result damage possible arcing flame. Recognitions: CSA, recognized.
Specifications subject change without notice.
Hansor Polymer Technology Corp.
147, Chien Road,Chung City, Taipei,Taiwan, R.O.C.TEL:886-2-22220101 (REP.)FAX:886-2-22228080
SMD1206 Series Surface Mount Devices
U.S. Patent#6377467
Select Polymer fuse:
Determine following operating parameters circuits: Normal Operating Current hold) Maximum Circuit Voltage max) Maximum Interrupt Current max) Normal Operating Temperature (min/max) Select device form factor dimension suitable application: Surface Mount Device (SMD Series) Radial Leaded Device (RLD Series) Axial Leaded Strap Device (STD Series) Other Custom-designed Device (Disc/Chip) Compare maximum ratings device with circuit application make sure that circuit's requirement does exceed device ratings. Check that device's trip time (time-to-trip) will protect circuit. Verify that circuit operating temperatures within device's normal operating temperature range. Verify performance suitability chosen device application.
Hansor Polymer Technology Corp.
147, Chien Road,Chung City, Taipei,Taiwan, R.O.C.TEL:886-2-22220101 (REP.)FAX:886-2-22228080
SMD1206 Series Surface Mount Devices
THERMAL DERATING CURVE SMD1206 SERIES
200.00
U.S. Patent#6377467
Percentage Rated Current
150.00
100.00
50.00
0.00 -40.00 0.00 40.00 80.00 120.00
Device Ambient Temperature
THERMAL DERATING CHART SMD1206 SERIES Ihold(Amps) (RECOMMENDED DATA)
Model
SMD1206P012TF SMD1206P016TF SMD1206P020TF SMD1206P025TF SMD1206P035TF SMD1206P035TF/15 SMD1206P050TF SMD1206P050TF/15 SMD1206P075TF SMD1206P100TF SMD1206P110TF SMD1206P150TF
0.18 0.22 0.28 0.37 0.50 0.50 0.71 0.71 1.14 1.45 1.52 2.18 0.16 0.20 0.25 0.33 0.45 0.45 0.64 0.64 1.01 1.31 1.37 1.94
Ambient Operation Temperature
0.14 0.18 0.23 0.29 0.40 0.40 0.57 0.57 0.88 1.15 1.25 1.72 0.125 0.16 0.20 0.25 0.35 0.35 0.50 0.50 0.75 1.00 1.50 0.10 0.14 0.17 0.22 0.30 0.30 0.42 0.42 0.65 0.84 0.92 1.28 0.09 0.12 0.15 0.20 0.27 0.27 0.39 0.39 0.59 0.77 0.82 1.17 0.08 0.10 0.14 0.17 0.24 0.24 0.35 0.35 0.54 0.69 0.75 1.06
0.07 0.09 0.12 0.15 0.21 0.21 0.31 0.31 0.49 0.61 0.64 0.96
0.05 0.08 0.09 0.12 0.15 0.15 0.25 0.25 0.41 0.48 0.52 0.77
Hansor Polymer Technology Corp.
147, Chien Road,Chung City, Taipei,Taiwan, R.O.C.TEL:886-2-22220101 (REP.)FAX:886-2-22228080
SMD1206 Series Surface Mount Devices
U.S. Patent#6377467
AVERAGE TIME-CURRENT CURVE SMD1206 SERIES
100.00
10.00
Time Trip (Sec.)
1.00
A:SMD1206P012TF B:SMD1206P016TF C:SMD1206P020TF
0.10
D:SMD1206P025TF
0.01 0.10 1.00 10.00
Fault Current (Amp.)
AVERAGE TIME-CURRENT CURVE SMD1206 SERIES
100.00
10.00
A:SMD1206P035TF
Time Trip (Sec.)
B:SMD1206P035TF/15 C:SMD1206P050TF
1.00
D:SMD1206P050TF/15 E:SMD1206P075TF F:SMD1206P100TF
0.10
G:SMD1206P110TF H:SMD1206P150TF
0.01 0.10 1.00 10.00
Fault Current (Amp.)
Hansor Polymer Technology Corp.
147, Chien Road,Chung City, Taipei,Taiwan, R.O.C.TEL:886-2-22220101 (REP.)FAX:886-2-22228080
SMD1206 Series Surface Mount Devices
SOLDER REFLOW
U.S. Patent#6377467
RECOMMENDED CONDITIONS
Condition Peak Temp/Time Preheat 160~ Storage Condition Reflow 0~35, 70%RH
Recommended reflow methods: vapor phase oven, oven, environment lead-free Devices designed wave soldered bottom side board. Recommended maximum paste thickness 0.25mm (0.010 inch) Devices cleaned using standard industry methods solvents. Note: reflow temperatures exceed recommended profile, devices meet performance requirements.
Hansor Polymer Technology Corp.
147, Chien Road,Chung City, Taipei,Taiwan, R.O.C.TEL:886-2-22220101 (REP.)FAX:886-2-22228080
SMD1206 Series Surface Mount Devices
FIGURE
U.S. Patent#6377467
SOLDER LAYOUTS
(Dimension
PHYSICAL DIMENSIONS (mm)
Part Number SMD1206P012TF SMD1206P016TF SMD1206P020TF SMD1206P025TF SMD1206P035TF SMD1206P035TF/15 SMD1206P050TF SMD1206P050TF/15 SMD1206P075TF SMD1206P100TF SMD1206P110TF SMD1206P150TF Min. 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 Max. 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 Min. 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 Max. 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 Min. 0.65 0.65 0.50 0.50 0.45 0.45 0.45 0.45 0.45 0.75 0.75 0.80 Max. 1.45 1.45 1.00 1.00 0.75 0.75 0.75 0.75 1.25 1.25 1.25 1.80 Min. 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 Min. 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Max. 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45
ENVIRONMENTAL SPECIFICATIONS
Operating/Storage Temperature Maximum Device Surface Temperature Tripped State Passive Aging Humidity Aging Thermal Shock Solvent Resistance Vibration +85, 1000 hours +85, 85%R.H. 1000 hours MIL-STD-202 Method 107G +85/-40 times MIL-STD-202, Method MIL-STD-883C, Method 2007.1, Condition typical resistance change typical resistance change -30% typical resistance change change change
PHYSICAL SPECIFICATIONS
Terminal Material Lead Solderability Packaging Gold-Plated Copper Solder-Plated Copper (Solder Material: Tin(Sn) other) Meets Specification RS186-9E, ANSI/J-STD-002 Category tape inch reel EIA-481-1 (equivalent IEC286, part 2000 devices reel P150TF 3000 devices reel others 4000 devices reel
Specifications subject change without notice.
Hansor Polymer Technology Corp.
147, Chien Road,Chung City, Taipei,Taiwan, R.O.C.TEL:886-2-22220101 (REP.)FAX:886-2-22228080
SMD1206 Series Surface Mount Devices
TAPE SPECIFICATIONS: EIA-481-1
P020TF,P025TF P012TF,P016TF P150TF P035TF,P035TF/15, P075TF,P100TF, P050TF,P050TF/15 P110TF Leader min. Trailer min. 8.15+0.15-0.30 3.50+/-0.05 1.75+/-0.10 1.55+/-0.05 1.00(MIN) 4.00+/-0.10 4.00+/-0.10 2.00+/-0.05 1.95+/-0.10 3.65+/-0.10 0.25+/-0.10 0.87+/-0.10 8.00+/-0.30 3.50+/-0.05 1.75+/-0.10 1.55+/-0.05 1.00 (MIN) 4.00+/-0.10 4.00+/-0.10 2.00+/-0.05 1.95+/-0.10 3.65+/-0.10 0.25+/-0.10 1.30+/-0.10 8.15+0.15-0.30 3.50+/-0.05 1.75+/-0.10 1.55+/-0.05 1.00 (MIN) 4.00+/-0.10 4.00+/-0.10 2.00+/-0.05 1.95+/-0.10 3.65+/-0.10 0.25+/-0.10 1.70+/-0.10
U.S. Patent#6377467
REEL DIMENSIONS: EIA-481-1
16.0+/-0.2 13.2+/-1.5 13.0+/-0.5 178+/-1.0 11+/-0.5 2.5+0.5 3.0+0.5 4.0+0.5 5.0+0.5
(mm)
(mm)
Hansor Polymer Technology Corp.
147, Chien Road,Chung City, Taipei,Taiwan, R.O.C.TEL:886-2-22220101 (REP.)FAX:886-2-22228080
SMD1206 Series Surface Mount Devices
PART NUMBERING SYSTEM 1206
U.S. Patent#6377467
Lead-free Multilayer Thickness Version Current Rating Symbol Device Dimensions: Length/Width(Unit: 1/100 inch) Surface Mount Device CROSS REFERENCE Cross Reference Bourns/ Multifuse® Raychem/ PolySwitch®
SMD1206P012TF SMD1206P016TF SMD1206P020TF(16Vdc) SMD1206P025TF SMD1206P035TF SMD1206P035TF/15 SMD1206P050TF SMD1206P050TF/15 SMD1206P075TF SMD1206P100TF SMD1206P110TF SMD1206P150TF nanoSMDM012F nanoSMDM016F nanoSMDM020F(24Vdc) nanoSMDM050F nanoSMDM050F/13.2 nanoSMDM075F nanoSMDM100F nanoSMDM110F nanoSMDC150F MF-NSMF012 MF-NSMF020(24Vdc) MF-NSMF035 MF-NSMF050(13.2Vdc) MF-NSMF075 MF-NSMF110 MF-NSMF150
"Multifuse" registered trademark Bourns Inc. "PolySwitch" registered trademark Raychem Corporation. Specifications subject change without notice.
Hansor Polymer Technology Corp.
147, Chien Road,Chung City, Taipei,Taiwan, R.O.C.TEL:886-2-22220101 (REP.)FAX:886-2-22228080
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