2005 Semiconductor Division Seiko Instruments Inc. Ver.1.0 TMPL00

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2005 Semiconductor Division Seiko Instruments Inc. Ver.1.0 TMPL00

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Elimination Lead (Pb) from Lead Plating Semiconductor Packages
2005 Semiconductor Division Seiko Instruments Inc. Ver.1.0
TMPL001
Background Trend Toward Lead-Free Products
large number electronic parts usually used electronic devices. These electronic parts mounted circuit boards using solder that alloy lead (Pb) (Sn). Since lead contained solder alloy harmful substance that risks being ingested humans through following route, initiatives Note restrict lead electrical electronic equipment have arisen, particularly Europe.
Scrapping electronic equipment Landfill disposal Contamination ground water Consumption ground water
Note. directive (RoHS directive) that prohibits chemical substances, including lead, electrical electronic equipment from July 2006 gone into effect.
Activities Achieve Lead-Free Products
addition lowering environmental risks caused chemical substances based environmental activity policies, also been promoting elimination harmful substances. Based RoHS directive other similar measures, established system that enables provision semiconductor products that lead-free.
Lead-free product status
Package SC-82AB SC-88A SOT-89-3 SOT-89-5 SOT-23-3 SOT-23-5 SOP-8EIAJ SOP-8JEDEC SOP-14, SSOP-8 TSSOP-8 MSOP-8 SON-5 SON-8 SNT-4A, 6A(H), Sn-Bi Sn-Ag Sn-Cu
Remark above table shows current classification, which change future.
Composition lead-free solder plating
following three types lead-free solder plating being used: Sn-Bi ±1%) Sn-Ag (2.5 ±1%) Sn-Cu ±1%)
Peak temperature solder reflow
conditions 230°C longer 260°C shorter.
Lead-free solder plating evaluations
Solder plating thickness evaluation Solder plating composition evaluation Board mounting evaluation (mounting appearance) Board mounting evaluation (cross-section observation) Whisker evaluation Mounting evaluation Package reliability evaluation Recommended reflow temperature profile (reference)
Lead-free solder plating evaluation
Solder plating thickness evaluation
Solder plating thickness Sn-Pb Sn-Bi Sn-Ag Sn-Cu Solder composition Max. Average Min.
Measuring device: Fluorescent X-ray film thickness measuring instrument
Sn-Pb solder plating thickness pcs) Avg. 8.20 Max. 8.70 Min. 7.27 Sn-Bi solder plating thickness pcs) Avg. 9.29 Max. 10.27 Min. 8.85 Sn-Ag solder plating thickness pcs) Avg. 8.47 Max. 8.84 Min. 7.79 Sn-Cu solder plating thickness pcs) Avg. 9.02 Max. 9.62 Min. 8.33
Film thickness
These measurements fall within rated values.
Lead-free solder plating evaluation
Solder plating composition evaluation
Sn-Bi, Sn-Cu
Sn-Ag Solder composition concentration
concentration
Measuring device: Fluorescent X-ray film thickness measuring instrument
Max. Average Min.
concentration Sn-Bi solder plating pcs) Avg. 1.89 Max. 2.31 Min. 1.48 concentration Sn-Cu solder plating pcs) Avg. 1.98 Max. 2.39 Min. 1.62
Sn-Ag
Sn-Bi Solder composition Sn-Cu concentration
concentration
Max. Average Min.
Measuring device: Fluorescent X-ray film thickness measuring instrument concentration Sn-Ag solder plating pcs) Avg. 2.48 Max. 2.92 Min. 1.90 These levels fall within control values.
Lead-free solder plating evaluation
Board mounting evaluation (mounting appearance): Using Pb-free solder paste
Sn-Pb Sn-Ag
Sn-Bi
Sn-Cu
(Used solder: M705-221BM5-32-11: Sn-3.0 Ag-0.5
Lead-free solder plating evaluation
Board mounting evaluation (mounting appearance): Using Pb-free solder paste
Sn-Pb Sn-Ag
Sn-Bi
Sn-Cu
(Used solder: M705-221BM5-32-11: Sn-3.0 Ag-0.5
Board mounting evaluation result: dissimilarities caused plating differences.
Lead-free solder plating evaluation
Board mounting evaluation (cross-section observation): Using Pb-free solder paste Cross-section observation after board mounting
Sn-Pb plating/Sn-3Ag-0.5Cu solder paste
Sn-Bi plating/Sn-3Ag-0.5Cu solder paste
Sn-Ag plating/Sn-3Ag-0.5Cu solder paste
Sn-Cu plating/Sn-3Ag-0.5Cu solder paste
Lead-free solder plating evaluation
Whisker evaluation
Condition 60°C, 1000 hours Sn-Bi ±1%) Sn-Ag (2.5 ±1%) Sn-Cu ±1%)
Condition -40°C +85°C, 1000 cycles Sn-Bi ±1%) Sn-Ag (2.5 ±1%) Sn-Cu ±1%)
Lead-free solder plating evaluation
Whisker evaluation
Condition Room temperature storage months Sn-Bi ±1%) Sn-Ag (2.5 ±1%) Sn-Cu ±1%)
Criterion: Pass/fail judgment:
Whisker size under above criterion must high-temperature highhumidity storage test, temperature cycle test, roomtemperature storage test.
Lead-free solder plating evaluation
Mounting evaluation
Evaluation Item Solderability Result Pass (r/n 0/5) Preprocessing conditions: 105°C, 100%RH 1.22 hours Pass SnBi: 43.2 SnCu: 43.6 SnAg: 44.6 Pass Main Conditions MeniscographWetting Balance) Solder: Sn-3.0Ag-0.5Cu Solder temperature: 245°C Criteria: Pass seconds less Test methods based EIAJ ET7403. Criteria: peeling, etc., when pressure applied seconds Reference data: Pressed with from side package test break resistance. Data: average when Bend amount: Repetitions: 1500 Bend span: Criteria: Resistance value fluctuation must exceed twice initial value. Must without visual defects. Maximum bend amount: Bend span: Criteria: Resistance value fluctuation must exceed twice initial value. Must without visual defects. mounted boards fixed jig. Drop times from height (six times bottom side, times each other sides) Drop surface: Concrete steel sheet Criteria: Resistance value fluctuation must exceed twice initial value. Must without visual defects. Temperature cycles: 85°C 1000 cycles High-temperature/high-humidity storage: 60°C 1000 hours Criteria: Max. length must less.
Terminal robustness test (SOT23-5 example)
bending test (constant stress method)
bending test (step stress method)
Pass (r/n
Drop test
Pass (r/n
Whisker evaluation
whisker formation each test)
Lead-free solder plating evaluation
Package reliability evaluation
Reliability Evaluation Item High-temperature bias test High-temperature, high-humidity bias test High-temperature storage test Low-temperature storage test Pressure cooker bias test Temperature cycle test Conditions 125°C, VABS max. 0.9, 1000 hours 85°C, 85%, VABS max. 0.9, 1000 hours 150°C, 1000 hours -65°C, 1000 hours 125°C, 85%, 2atm, VABS max. 0.9, hours 65°C 150°C cycles Criteria (r/n) 0/22 0/22 Judgment Pass Pass
0/22 0/22 0/22 0/22
Pass Pass Pass Pass
Lead-free solder plating evaluation
Recommended reflow temperature profile (reference)
Temperature (°C) TMAX Pre-heating °C/s Pre-heating Actual test heating 200°C, 220°C 260°C °C/s thermal resistance guaranteed 260°C (peak temperature, seconds max.).
Time
distinguish lead- free products
Barcode label lead products
TYPE:S-******************
Barcode
Barcode label lead-free products
TYPE:S-******************
Barcode
QTY:2000
Barcode
QTY:2000
Barcode
NoPb
Barcode
LOT:********************
Barcode
LOT:******************** CODE:********************
Barcode
CODE:********************
Barcode
Lead-free product mark
Products distinguished barcode labels inner boxes tape reels. general rule, appended product name.

2005 Semiconductor Division Seiko Instruments Inc. Ver.1.0 TMPL00

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