Z-POWER Series Technical Datasheet N42180 Z-Power series des

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Z-POWER Series Technical Datasheet N42180 Z-Power series des

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SEOUL SEMICONDUCTOR
Z-POWER Series
Technical Datasheet N42180
Z-Power series designed high current operation high flux output applications. Z-Power LED's thermal management perform exceeds other power solutions. incorporates state design Thermal emission material. Power ideal light sources general illumination applications, custom designed solutions, automotive large backlights
Application Mobile phone flash Automotive interior exterior lighting Automotive signal lighting Automotive forward lighting General Torch Architectural lighting Monitor Backlight Projector light source Traffic signals Task lighting Decorative Pathway lighting Remote Solar powered lighting Household appliances Features Super high Flux output high Luminance Designed high current operation thermal resistance solderbility Lead Free product RoHS compliant
possible changed characteristics LEDs.
2007 www.zled.com
Full Code Z-Power Series
Full code form Part Number Color Z-Power series number LENS type Chip quantity Power Dissipation) Package outline size Type Internal Number Code Labeling Luminous flux Radiant flux royal blue) Dominant wavelength coordinates rank code) Forward voltage Sticker Diagram Reel Aluminum Vinyl
PART QUANTITY NUMBER ########## CODE
more information about binning labeling, refer Application Note
2007 www.zled.com
Outline Dimensions Dome Type
SLUG
Cathode Mark
Lens
Body Lead
Notes dimensions millimeters. (tolerance ±0.2 Scale none Slug package connected anode. *The appearance specifications product changed improvement without notice.
2007 www.zled.com
Characteristics Dome type Z-Power Warm White (N42180)
Electro-Optical characteristics IF=350mA, Parameter Luminous Flux
Symbol
Value 3000
Unit deg.
Correlated Color Temperature Forward Voltage View Angle Thermal resistance Thermal resistance
RJ-B RJ-C
Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature Sensitivity
Symbol Topr Tstg
Value +100 ±20,000V
Unit
*Notes maintains tolerance ±10% flux power measurements. total luminous flux output measured with integrated sphere. Correlated Color Temperature derived from 1931 Chromaticity diagram. tester tolerance tolerance ±0.06V forward voltage measurements [5], RJ-B measured with metal core pcb.(25 RJ-C measured with only emitter. .(25 Break voltage Metal 6.5kVAC included zener chip protect product from ESD.
-Caution-1. Please drive rated current more than sec. without proper heat sink chromaticity coordinate LEDs shift temperature junction.
2007 www.zled.com
Color spectrum, Warm White
Relative Spectral Power
Distribution
2007 www.zled.com
Light Output Characteristics Relative Light Output Junction Temperature IF=350mA, TA=25
N42180
Relative Light Output
Junction Temperature
2007 www.zled.com
Forward Current Characteristics Forward Voltage Forward Current, TA=25
Warm White
1000
Average Forward Current [mA]
Forward Voltage
Forward Current Normalized Relative Luminous Flux, TA=25
Warm White
Relative Lumious Flux(a.U)
1000
Forward Current [mA]
2007 www.zled.com
Ambient Temperature Allowable Forward Current 1-1. Warm White (TJMAX @350mA)
Current [mA]
RjaT RjaT RjaT RjaT
Ambient Temperature
1-2. Warm White (TJMAX @700mA)
Current [mA]
RjaT RjaT RjaT RjaT
Ambient Temperature
2007 www.zled.com
Typical Dome Type Radiation pattern Warm White
Relative Luminous Flux
Angle(degree.)
2007 www.zled.com
Recommended Soldering Solder
Solder paste pattern
Paste thickness 0.2mm
Note dimensions millimeters (tolerance ±0.2 Scale none *The appearance specifications product changed improvement without notice.
2007 www.zled.com
Soldering profile, Reflow Soldering Conditions Profile
Reflow machine setting temp (max sec.) Surface temp (max) Surface temp (recommend) Surface temp (min)
Pre-heating
Rising °C/sec
Cooling °C/sec
Time [Hr]
Hand Soldering conditions
Lead more than seconds @MAX280 Slug thermal-adhesives
Caution Reflow soldering should done more than time. Repairing should done after LEDs have been soldered. When repairing unavoidable, suitable tools have used. slug soldered. When soldering, stress LEDs during heating. After soldering, warp circuit board. Recommend convection type reflow machine with zones.
2007 www.zled.com
Emitter Reel Packaging
Note number loaded products reel 250ea dimensions millimeters Scale none *The appearance specifications product changed improvement without notice.
2007 www.zled.com
Packaging Structure
Aluminum Vinyl
PART ######-## QUANTITY NUMBER #######-####### CODE #######
Outer
TYPE SIZE(mm)
ZLED
ZLED
PART ******-** CODE Q'YT ###### YMDD-##### DATE ######
SEOUL SEMICONDUCTOR CO.,LTD
Note 6~10 reels loaded Scale none more information about binning labeling, refer Application Note
2007 www.zled.com
Precaution
Storage avoid moisture penetration, recommend storing Power LEDs desiccator) with desiccant recommended storage conditions Temperature degrees Centigrade. Humidity maximum. Precaution after opening packaging However correspond SMD, when soldered dip, interfacial separation affect light transmission efficiency, causing light intensity drop. Attention followed. Soldering should done right after opening package(within 24Hrs). Keeping fraction Sealing Temperature Humidity less than package been opened more than 1week color desiccant changes, components should dried 10-12hr 60±5 mechanical force excess vibration shall accepted apply during cooling process normal temp. after soldering. Please avoid rapid cooling after soldering. Components should mounted warped direction PCB. Anti radioactive design considered products listed here Gallium arsenide used some products listed this publication. These products dangerous they burned shredded process disposal. also dangerous drink liquid inhale generated such products when chemically disposed. This device should used type fluid such water, oil, organic solvent etc. When washing required, IPA(Isopropyl Alcohol) should used. When LEDs illuminating, operating current should decided after considering package maximum temperature. LEDs must stored maintain clean atmosphere. LEDs stored months more after being shipped from SSC, sealed container with nitrogen atmosphere should used storage. appearance specifications product modified improvement without notice. Long time exposure sunlight occasional exposure will cause lens discoloration. slug connected anode. Therefore, recommend isolate heat sink.
2007 www.zled.com
Handling Silicone resin LEDs
Z-Power encapsulated silicone resin highest flux efficiency. Notes handling Silicone resin Z-Power LEDs Avoid touching silicone resin parts especially sharp tools such Pincette(Tweezers) Avoid leaving fingerprints silicone resin parts. Dust sensitivity silicone resin need containers having cover storage. When populating boards production, there basically restrictions regarding form pick place nozzle, except that mechanical pressure surface resin must prevent. Please force over 2000 impact pressure diagonally silicon lens. will cause fatal damage this product Please recommend cover silicone resin LEDs with other resin (epoxy, urethane, etc)
2007 www.zled.com

Z-POWER Series Technical Datasheet N42180 Z-Power series des

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