From Boon-Teong CHAN, QA/CS Manager Subject Recall Notification S

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

From Boon-Teong CHAN, QA/CS Manager Subject Recall Notification S

Datasheet Thumbnail

Top Searches for this datasheet

December 2000 Agilent customers using SOT-323 (SC70 3-Lead) Diodes
From Boon-Teong CHAN, QA/CS Manager
Subject Recall Notification SOT-323 (SC-70 3-Lead) Surface Mount Diode Unused Inventory-Potential Instability Background Analysis customer return November identified potential instability subject diodes manufactured Agilent's factory Penang during workweeks 31-39(August September 2000). marking datecodes "Z". Reported component failure rate range 2-5% affected lots. failing devices exhibited high and/or unstable when tested after solder assembly. diode exhibited intermittent when slight pressure applied package body. Failure analysis performed failing devices Scanning Electron Microscope (SEM) inspection crosssectioned defective units showed delamination between leadframe silicon diode chip through conductive epoxy adhesive. package leads appeared over-formed most units. Root Cause Investigation assembly process revealed cause trim/form/singulate (TFS) machine. Maintenance logs equipment showed abnormal frequency downtime during period when lots with rejects were manufactured. Experimental data showed that delamination result pulling force leads caused excessively worn anvil which forms leads. Corrective Actions Appropriate anvil preventative maintenance corrective actions have been taken eliminate root cause prevent future recurrence. Please refer Appendix details. Products Affected manufacturing facilities Malaysia produce subject parts. Only products manufactured Penang with marking date code potentially affected. Products from Ipoh facility affected. Customers advised return unused Penang manufactured parts within above datecodes Agilent Technologies Malaysia replacement. table below details distinguish affected parts. Penang manufactured parts Recall Schottky Diodes: HBAT-540#, HSMS-270#, HSMS-280#, HSMS-281#, QSMS-295C, HSMS-282#, HSMS-285#, HSMS-286#. Diodes HSMP-381#, HSMP-482#, HSMP-386#, HSMP-389#, HSMP-489#. "Y", "Z". White reels Starts with "B031xxxxx" "B039xxxxx". Parts manufactured Ipoh AFFECTED Same
Devices
Product marking date code Reels package color:
Blue reels Starts with "U-xxxxx". (NOT affected)
Replacement Product Availability: replacement parts will expedited. expected that that most customers' immediate replacement needs would available three five weeks after return recalled parts. Please contact your local Agilent representative further details. Risk Assessment defective parts date have been detected customer's test process after assembly. returned parts date have been from field failures. unavailability adequate sample quantities, only limited reliability assessment data been performed. With return product within affected datecodes, additional reliability assessments will performed. apologize inconvenience caused your operation would appreciate purging unused parts built Agilent Penang factory done soon possible. Thank you.
APPENDIX Corrective Actions After analysis defective customer returns early November, manufacturing process review identified worn anvil probable cause. Maintenance logs identified that addition abnormally high down during August September, punch (includes anvil) replaced September Experiments were performed November which verified worn anvil root cause. Reliability evaluation performed samples parts produced after replacement punch (see Assessment below) verified parts good. following preventative maintenance corrective actions have been place prevent future recurrence worn anvil which caused delamination defects: Revise production maintenance procedure include following: Increase die-set check service frequency from weekly basis every 200k strokes, with software control. This ensures early detection wear. weekly frequency inadequate during high production periods. Real time visual inspection check units/lot under 200X high magnification after TFS, addition existing units/lot under power scope over-forming package delamination. mirror check stuck units/mold debris into inaccessible parts each time operator perform die-set cleaning shift basis. Revise machine downtime record engineering disposition flow lots being triggered. monthly monitoring check using unit cross-section inspection. Weekly monitoring tests implemented detect defectives with same failure mechanism 85'C/85%RH 3xIR 5xTMCL E-Test (with press units).
Assessment newer date codes "delta" Existing inventories with marking date code ("delta"), ("=") were sampled stressed with following flow 4hrs UBPP 3xIR extended Temp (10,20,50,200,500x) E-Test. Following results showed that materials from were affected this problem Cell Device Wafer QSMS-295C 2568.24 HSMS-282C* 2720.13 HSMS-282C 2721.13 HSMS-282C 2318.08 This device chosen represent major runner SC70 3-LD devices.)

From Boon-Teong CHAN, QA/CS Manager Subject Recall Notification S

Top Searches for this datasheet

Other recent searches