Innovative Solutions chip board custom design optoelectronics

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Innovative Solutions chip board custom design optoelectronics

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PerkinElmer Elcos
Innovative Solutions
chip board custom design optoelectronics
ELCOS founded 1976 specialist optoelectronic components. customer rely more than years experience chip board (COB) technology, chip design special diodes packaging. forte competent technical consulting, flexibility short development time. Besides extensive range standard products priority company focused custom designed solutions quantities.
Starting from mechanical optical design optimising process solutions offer complete project support. Force know-how micrometer high precision placement more than ten-thousand dice substrate also high accurate encapsulation with integrated optical elements. find applications with ELCOS components sensors, displays illuminations e.g. medical sector, military avionics, industrial sector, sector other branches.
1976 1979 1982 1989
Foundation ELCOS GmbH (Electronic Consulting Services) consulting trading company. Development patented CERLED, world's first SMD-LED. Search manufacturer. In-house line production launch CERLED additional optoelectronic components, mainly SMT, Pfaffenhofen, Germany. Successful development line-production launch displays AIRBUS cockpits. Production launch custom designed products. Change company name into ELCOS Electronic Components Support GmbH. Obtained quality audits from Motorola (Florida) Philips (England). Expansion development production capacity custom designed products. Production launch Bangkok using ELCOS machinery production plant large semiconductor Chip-On-Board product manufacturer (around 8.000 employees). Development PANLIGHT. Enlargement production site Pfaffenhofen Production high-density displays with pitch direction (12.000 LEDs board). Break into markets sensory applications remission measurements. Development corresponding products such Pointlight. Completion chip spectrum ranges. Enlargement office space marketing sales department. Development presentation world's first 7-segment displays design using transfer-mould technology. June: Acquisition business areas: development production high precision production machinery control systems. Expansion production site September: ELCOS GmbH becomes ELCOS Electronic Components Support joint stock company, ELCOS Move production site with total 1.600 floor space. Since February part PerkinElmer family, name changed PerkinElmer Elcos GmbH.
1993 1995
1996 1997
1998
1999 1999 2000 2005
Contents
Standard Optoelectronic SMT- Devices Packages
PerkinElmer Elcos Production Line
Optoelectronic Basics
Range Applications Custom Design 10-11
PerkinElmer Elcos Technologies Checklist 12-13
Notes Page Additions 14-15
Standard Optoelectronic (SMT) Devices
NEW: Color Ultrabright
red, green, blue, multi chip board high power with excellent color mixing compact size Package ACULED
SMT-LEDs
UV-visible-infrared high brightness, high speed InGaN, GaAs, GaP, GaAsP, GaAlAs, AlInGaP
Package (M2, EUROLED)
Point Light LEDs
visible infrared 50µm 220µm diameter AlInGaP, GaAlAs, GaAsP
Package
SMT-7-Segment Displays
visible (red green) only total height special colors available
Package
Photo PIN-Diodes
visible infrared small size silicon
Package
Photo Transistors
visible infrared small size, photo darlington silicon
Package
Reflex Sensors
infrared ceramic package, small size GaAs infrared silicon photo transistor
Package
Packages
2.00
2.00
0.50
0.50
1.20
3.20
3.20
Package ACULED
1.27
Package
1.27
Package
0.50
1.20
3.00
3.20
1.60
Package
1.27
0.60
2.00
0.25
1.20
Package
Package
4.00±0.25
1.30
10.80±0.10
7.50-0.10
0.50
10.00
0.80
3.81
4.57
4.00
Package
Package
Package
ceramic
MCPCB
4.00
0.90
Production Line
ceramic design Tooling design production custom design
Production Control
Die- Bonding silver epoxy glue soldering contact technologies high precision
Wire- Bonding gold aluminium wire-bonding
Cast- Moulding
Assembly soldering components mounting connectors mounting optical mechanical components
Cutting Dicing sawing with diamond wafer saws
Testing 100% test custom specific test burn Taping
Optoelectronic Basics
Relative sensitivity
intensity
Luminous flux corresponding radiant power perception human eye. sensitivity most sensitive
wavelength [nm]
FWHM (full width half maximum) Spectral bandwidth half intensity (calculated from wavelengths either side 0.5). Center wavelength 0.5m Corresponds wavelength halfway between half-wavelengths Centroid wavelength wavelength that divides integral spectrum into equal parts. Dominant wavelength determined from color coordinates measured spectrum. measure color sensation produced human LED. Peak wavelength
Generation white light with SMT-LED
intensity
blue
converted light
Mechanical principle
Epoxy yellow emitting converter
wavelength [nm]
Method measurement CIE-condition
170° viewing angle viewing angle
detector
detector
radiant/luminous intensity equal dice depends package (viewing angle) measurement CIE-condition.
recommendations intensity measurements: Distance Angle 1.000 0.001 0.010
Units measurement: Radiometry Radiant power Radiant intensity
[W/sr]
Radiant luminous intensity defined power (flux) Steradiant detector area: 11,28 32.7°
Brightness visible
luminous flux [lm] 20mA)
Photometry (visible light human eye) Luminous flux [lm] Luminous intensity [lm/sr=cd]
Luminous flux InGaN AlInGaP-LED
luminous flux [lm] 20mA)
Fluorescent Compact fluorescent Unfiltered incandescent Thomas Edisons first bulb
GaP:N GaAsP:N SH-GaAlAs DH-GaAlAs InGaN InGaN InGaAlP
InGaN InGaAlP InGaN
InGaN
AlInGaP
0.01
GaAsP
0.05
GaAlAs GaAsP
0.02
0.001 1970 1975 1980 1985 1990 1995 2000 2005
years
wavelength [nm]
Range Applications
Custom designed optoelectronic
medical technology aviation data communications vision systems transportation
smoke particle sensors point light targeting security systems printer money detector
environmental analysis toys scanner photo systems video systems
industrial control military touch control optical interface dental technology
mponents -technology your applications
PerkinElmer Elcos Technologies
Moulding Technology
Epoxy resin mould with frame applicable small large quantities
Substrate material: Ceramic, flex, Mould Material: Epoxy resin, also available with daylight filter
negligible initial cost simple moulding tools excellent duplication
min. material shrinking de-moulding angle 5°-7° imperative! different expansion coefficient causes mechanical stress!
Frame Technology
Frame bonded glued suitable small quantities
Substrate material: Flex, Mould material: Silicon, fluor polymer, epoxy resin, also with daylight filter, glass, filter, lenses, parylene
negligible initial cost small tooling cost encapsulation without mechanical stress
higher PCB-cost limited miniaturisation
Frame Technology
Frame glued chip carrier after chip bonding ideal large production quantities
Substrate material: Ceramic, flex, Mould material: Silicon, fluor polymer, epoxy resin, also with daylight filter, glass, filter, lenses, parylene
stress-free encapsulation compact construction combination different materials possible frame also incorporate optical properties (i.e.: reflector)
frame suitable reference point
Clip-on Cover
Pre-manufactured cover (PMMA) assembly suitable small medium size quantities
Substrate material: Ceramic, flex, Filler between cover chip: Fluor polymer, silicon, parylene
piece price high accuracy easy duplication various optical possibilities (lenses)
Checklist
Company Name Address City Product name Application Qty. Year Target price Date required Parameter Wavelength size Brightness Forward current Rise time Spectral range Active area Sensitivity Dark current Rise time
Date: No.:
Telephone Telefax e-mail Website Branch
pcs.
E/D1) Conditions
Customer request
Confirmation mcd/mW
Chips
Reverse voltage Capacitance Special features
(oper./max.)
standard chip type
Specification: Emitter; Detector
Chip placement Substrate size Packaging Substrate Encapsulation Terminals Filter Special features
Chips Y-Pitch Length Height Ceramic Epoxy mould Silicon
Frame
X-Pitch Tolerance Width Reference Flex Others Premoulded caps Window/Filter Flex Others
Driving Test
Temperature range Expected processing Driving requirements Parameter testing
Operating Reflow
Soldering
Storage Glueing
hand
Notes
Notes
Additions
PerkinElmer Elcos GmbH
European Customer Support Solutions Luitpoldstrasse 85276 Pfaffenhofen, Germany Telephone: (+49) 8441-8917-0 Fax: (+49) 8441-71910 elcos.sales@perkinelmer.com
Pfaffenhofen Germany
North America Customer Support 22001 Dumberry Road Vaudreuil-Dorion Canada Telephone: (+1) 450-424-3300 (+1) 866-574-6786 (toll-free) Fax: (+1) 450-424-3345 opto@perkinelmer.com Asia Headquarters Ayer Rajah Crescent #06-12 Singapore 139947 Telephone: (+65) 6775-2022 (+65) 67704-366 Fax: (+65) 6775-1008 opto.asia@perkinelmer.com
Copyright® 2006 PerkinElmer Optoelectronics. right reserved. PerkinElmer logo design registered trademaks PerkinElmer, Inc. ACULEDand CERLED® trademarks PerkinElmer, Inc. subsidiaries, United States other countries. other trademarks owned PerkinElmer, Inc. subsidiaries that depicted herein property their respective owners. Information furnished PerkinElmer Optoelectronics believed accurate reliable. However, responsibility assumed PerkinElmer Optoelectronics use; infringements patents other rights third parties which result from use. license granted implication otherwise under patent patent right PerkinElmer, Inc.
600133_01 CAT0406P

Innovative Solutions chip board custom design optoelectronics

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