Spansion®, STM®, SST®, MXIC, Atmel® Winbond® Victor Introduc

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Spansion®, STM®, SST®, MXIC, Atmel® Winbond® Victor Introduc

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4M-8M Cross Reference
Spansion®, STM®, SST®, MXIC, Atmel® Winbond®
Victor
Introduction
Spansion provides wide range (Serial Peripheral Interface) Flash from Mbits Mbits. 4-Mbit 8-Mbit Flash most popular densities used produced number Flash manufactures including: Spansion, SST, MXIC, Atmel Winbond. Spansion devices most part compatible with Flash from each these manufactures used replace following devices: M25P40/80, SST25VF040B/080B, MXIC MX25L400/800, ATMEL AT25F4096 Winbond W25p40/80.
Comparison
Table shows detailed cross ordering product number each device. Table Cross Ordering Product Number
Mbit SPANSION MXIC ATMEL WINBOND S25FL040A M25P40 SST25VF040B MX25L4005A AT25F4096 W25P40 Mbit S25FL008A M25P80 SST25VF080B MX25L8005 W25P80
Feature Comparison
Atmel AT25F4096 Range Sector Size (kBytes) Read Speed (MHz) MLP8 PDIP SAP-8 Package Options SO-16 SO-8 SON-8 USON WSON 2.7V 3.6V 1000 4500 MXIC MX25L400/ 2.7V 3.6V 1000 1000 3500 7000 Spansion S25FL040A/ 2.7V 3.6V 4,12,16 3000 6000 SST25VF040 B/080B 2.7V 3.6V M25P40/80 2.7V 3.6V 3000 6000 Winbond W25p40/80 2.7V 3.6V 5000 7000
Program Speed (kbps)
Sector Erase (ms)
Chip Erase (ms)
Publication Number 4M-8M_SPI_Cross-reference_AN
Revision
Issue Date December 2007
pplication
Note
Memory Protection
Spansion Flash Hardware Write Protection: protected area size defined three non-volatile bits (BP0, BP2). Block Protect (BP2, BP1, BP0) bits define section memory array that read programmed erased. sizes address ranges protected areas that defined Status Register bits BP2:BP0. detailed settings found according data sheet. Winbond, SST, Atmel MXIC have same sector protection scheme. Some protection areas slightly different. Make sure read data sheet before attempting memory protection.
Hardware migration
Spansion 4-Mb 8-Mb Flash provide same package type Winbond, SST, Atmel MXIC. They fully pin-to-pin compatible. signal CS#, SCLK, Spansion parts perform same function Winbond, SST, Atmel MXIC's pins. Spansion provides SO-8 WSON 8-pin packages 8-MB S25FL080A optional SO-8 mils package 4-MB S25GL040A. item should noted, some manufactures SO-8 package; this package compatible with SO-8, only requiring small change board lineout accommodate both packages.
Pinout
Figure 8-pin Plastic Small Outline Package (SO)
HOLD#
Figure USON mm2) Package
HOLD#
Pins Descriptions
(Signal Data Output) Output Transfers data serially device falling edge SCK. (Serial Data Input) Input Transfers data serially into device. Device latches commands, addresses, program data rising edge SCK. (Serial Clock) Input Provides serial interface timing. Latches commands, addresses, data rising edge SCK. Triggers output after falling edge SCK. (Chip Select) Input Places device active power mode when driven low. Deselects device places high impedance when high. After power-up, device requires falling edge before command written. Device standby mode when program, erase, Write Status Register operation progress. (Write Protect) Input Protects memory area specified Status Register bits BP2:BP0. When driven low, prevents program erase command from altering data protected memory area.
4M-8M_SPI_Cross-reference_AN_01 December 2007
atio
Software Migration
From software perspective there main differences: different sector architecture. number sector architectures used Flash. Many devices uniform sector sizes Kbytes while other devices provide range available sector sizes. Depending application this require change system software. Systems that Flash Load/Store configuration more likely will require software changes sector size. These systems will load entire contents Flash into when updating Flash entire contents Flash rewritten. Systems that Flash dynamic storage most likely will need make changes changes sector size. These systems store data Flash using file system, other system that makes small updates data stored erases data as-needed bases. Please consult appropriate data sheets detailed information sector architectures. Command Sets Winbond, Atmel MXIC have compatible command sets Spansion parts. compatible command sets, further they some their additional command Table Command Definitions
Operation Command READ Read FAST_READ RDID WREN Write Control WRDI Erase Program Status Register WRSR Power Saving Write from Status Register Deep Power-down Release from Deep Power-down Release from Deep Power-down Read Electronic Signature (0000 0001) (1011 1001) (1010 1011) (1010 1011) RDSR Bulk (Chip) Erase Page Program Read from Status Register (1100 0111) (0000 0010) (0000 0101) Write Disable Sector Erase (0000 0100) (1101 1000) Description Read Data Bytes Read Data Bytes Higher Speed Read Identification Write Enable One-Byte Command Code (0000 0011) (0000 1011) (1001 1111) (0000 0110) Address Byte Dummy Byte Data Byte
Summary
general, it's work replace 4-Mb 8-Mb Flash with Spansion devices. hardware pin-to-pin compatible plus software issues sector architecture command sets insurmountable. have covered devices available from Spansion other manufactures listed (this also complete list Flash memory manufactures). This application note should used guide when migrating Spansion Flash. Both Spansion other manufactures provide larger high performance devices than ones list here, many which include number additional features. Please carefully review data sheets application notes your Flash manufacturer before starting migration.
December 2007 4M-8M_SPI_Cross-reference_AN_01
pplication
Note
Revision History
Section Revision (December 2007) Initial Release Description
4M-8M_SPI_Cross-reference_AN_01 December 2007
atio
Colophon products described this document designed, developed manufactured contemplated general use, including without limitation, ordinary industrial use, general office use, personal use, household use, designed, developed manufactured contemplated that includes fatal risks dangers that, unless extremely high safety secured, could have serious effect public, could lead directly death, personal injury, severe physical damage other loss (i.e., nuclear reaction control nuclear facility, aircraft flight control, traffic control, mass transport control, medical life support system, missile launch control weapon system), where chance failure intolerable (i.e., submersible repeater artificial satellite). Please note that Spansion will liable and/or third party claims damages arising connection with above-mentioned uses products. semiconductor devices have inherent chance failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. products described this document represent goods technologies subject certain restrictions export under Foreign Exchange Foreign Trade Japan, Export Administration Regulations applicable laws other country, prior authorization respective government entity will required export those products. Trademarks Notice contents this document subject change without notice. This document contain information Spansion product under development Spansion. Spansion reserves right change discontinue work product without notice. information this document provided without warranty guarantee kind accuracy, completeness, operability, fitness particular purpose, merchantability, non-infringement third-party rights, other warranty, express, implied, statutory. Spansion assumes liability damages kind arising information this document. Copyright 2007 Spansion Inc. rights reserved. Spansion®, Spansion Logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM, HD-SIMand combinations thereof, trademarks Spansion other countries. Other names used informational purposes only trademarks their respective owners.
December 2007 4M-8M_SPI_Cross-reference_AN_01

Spansion®, STM®, SST®, MXIC, Atmel® Winbond® Victor Introduc

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