1999 Waferscale Integration, Inc. Reliability Summary 1999 C
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Reliability Summary
1999
Waferscale Integration, Inc. Reliability Summary 1999
Copyright 1999 Waferscale Integration, Inc. (All rights reserved.) 47280 Kato Road, Fremont, California 94538 Tel: 510-656-5400 Fax: 510-657-5916 Site: http://www.waferscale.com E-Mail: info@waferscale.com Printed
Table Contents Reliability Summary 1999
INTRODUCTION .1-1 RELIABILITY WAFERSCALE .2-1 PSD/SYSTEM LOGIC RELIABILITY DATA SUMMARY .3-1 PROM/RPROM/EPROM RELIABILITY DATA SUMMARY .4-1 PSD/SYSTEM LOGIC RELIABILITY DATA
DEVICE
PSD813F1 PSD813F3 PSD301
PACKAGE
52-Pin PLCC 64-Pin TQFP 52-Pin PLCC CLDCC PLCC TQFP CLDCC/PLCC MQFP/TQFP TQFP CLDCC/PLCC MQFP/TQFP PQFP CLDCC/PLCC TQFP TQFP CLDCC/PLCC TQFP PLCC (MCM FLASH) CLDCC/PLCC TQFP CLDCC CLDCC/PLCC CLDCC CPGA PDIP (300 Mil) PLCC CPGA
PRODUCT DESCRIPTION
Flash In-System-Programmable Microcontroller Peripherals .5-1 Flash In-System-Programmable Microcontroller Peripherals .5-4 Field-Programmable Microcontroller Peripheral .5-5
PSD302
Field-Programmable Microcontroller Peripheral.5-11
PSD303
Field-Programmable Microcontroller Peripheral .5-20
PSD304R PSD314R PSD402 PSD413F PSD503 PSD603 PSD703 PSD100 PAC1000 SAM448 MAP168 WS59032
Field-Programmable Microcontroller Peripheral .5-25 Field-Programmable Microcontroller Peripheral .5-27 Field-Programmable Microcontroller Peripheral .5-28 Field-Programmable Microcontroller Peripheral .5-31 with Flash Memory Field-Programmable Microcontroller Peripheral .5-32 Field-Programmable Microcontroller Peripheral .5-35 Field-Programmable Microcontroller Peripheral .5-36 Peripheral with Memory.5-38 User-Configurable Microcontroller .5-39 User-Configurable Microsequencer .5-39 Peripheral with Memory.5-40 High Speed 32-Bit CMOS Microprocessor Slice .5-41
Table Contents Reliability Summary 1999
PROM/RPROM/EPROM RELIABILITY DATA
DEVICE
WS27C128L WS27C256L
PACKAGE
CERDIP (600 Mil) PDIP (600 Mil) CERDIP (600 Mil) PLCC PDIP (600 Mil) CERDIP (600 Mil) PLCC CERDIP (600 Mil) PLCC CERDIP (600 Mil) PLCC CERDIP (600 Mil) PLCC CERDIP (600 Mil) PLCC CLDCC PLCC CERDIP (300/600 Mil) CERDIP (300/600 Mil) PLCC PDIP (300 Mil) CERDIP (300/600 Mil) CERDIP (300 Mil) PDIP (300 Mil) PLCC CERDIP (300 Mil) CERDIP (300/600 Mil) PDIP (300 Mil) PLCC CERDIP (300/600 Mil) PLCC CERDIP (300 Mil) CERDIP (300 Mil) PDIP (300 Mil) CERDIP (600 Mil) CERDIP (600 Mil)
PRODUCT DESCRIPTION
CMOS EPROM .6-1
CMOS EPROM .6-2
WS27C512L WS27C512LS WS27C010L WS27C010LS WS27C210L WS27C210LS WS57C43B WS57C43C WS57C45 WS57C49B WS57C49C
CMOS EPROM .6-3
CMOS EPROM .6-4
128K CMOS EPROM .6-6
128K CMOS EPROM .6-9
CMOS EPROM .6-13
CMOS EPROM .6-14
CMOS RPROM .6-16 CMOS RPROM .6-17
CMOS RPROM .6-19 CMOS RPROM .6-20 CMOS RPROM .6-22
WS57C51B WS57C51C
CMOS RPROM .6-26 CMOS RPROM .6-27
WS57C71C WS57C291B WS57C291C WS57C257 WS57C64F
CMOS RPROM .6-30
CMOS RPROM .6-32 CMOS RPROM .6-33
CMOS EPROM .6-35 High Speed CMOS EPROM .6-36
Table Contents Reliability Summary 1999
PROM/RPROM/EPROM RELIABILITY DATA (Cont.)
DEVICE
WS57C128FB WS57C256F
PACKAGE
CERDIP (600 Mil) CERDIP (600 Mil) CLCC PDIP (600 Mil) PLCC CERDIP (600 Mil) PLCC TSOP
PRODUCT DESCRIPTION
High Speed CMOS EPROM .6-37 High Speed CMOS EPROM .6-37
WS57C010F
High Speed 128K CMOS EPROM .6-41
SALES REPRESENTATIVES DISTRIBUTORS.7-1
Introduction
Reliability Waferscale
PSD/System Logic Reliability Data Summary PROM/RPROM/EPROM Reliability Data Summary PSD/System Logic Reliability Data PROM/RPROM/EPROM Reliability Data Sales Representatives Distributors
Waferscale Integration, Inc. Reliability Summary
Introduction
Waferscale Reliability Summary periodically updated publication that provides both summarized product-specific data reliability Waferscale's Memory products. Each addition includes most recent reliability test results available time printing; this data gets appended previous data provide on-going historical record Waferscale's reliability test results (older data sometimes removed from database, usually obsolescence particular process technology product family). Where appropriate, data summarized stress test, further segregated package type. Since Waferscale utilizes multiple foundries, reliability tests performed data presented products representing each silicon foundry locations. data contained herein includes results from Waferscale's Reliability Qualification Program well Waferscale's ongoing Reliability Monitor Program. former used qualify products, processes, packages intended production shipments, while latter program provides means continuously evaluate monitor production programs. This book focuses final reliability assessment finished product. However, many other tests included this handbook also performed routine basis provide even greater level assurance that reliability standards being met. example, wafer level reliability tests (examples being carrier injection, electromigration, Time-Dependant Dielectric Breakdown TDDB) performed wafer foundries. Assembly process reliability data, such bond pull strength, shear, centrifugal force constant acceleration, generated assembly subcontractor(s). Additional package-related tests, particularly those required ship military grade product (mechanical shock; solderability; package mark integrity; etc) routinely performed accordance with MIL-STD-883C. While every attempt made assure most up-to-date relevant information included this handbook, please note that additional information often available obtained contacting factory directly.
Introduction
Reliability Waferscale
PSD/System Logic Reliability Data Summary PROM/RPROM/EPROM Reliability Data Summary PSD/System Logic Reliability Data PROM/RPROM/EPROM Reliability Data Sales Representatives Distributors
Section Index
Reliability Waferscale
Quality Reliability .2-1 Waferscale's Reliability Philisophy.2-1 Quality, Reliability, Product Life Cycle.2-2 Quality Assurance Quality Control .2-3 Basic Reliability Concepts .2-3 Reliability Programs Waferscale .2-7
Reliability Waferscale
Barry Cornell Vice President, Quality Reliability
Quality Reliability
important distinguish between concepts Quality Reliability. While many different definitions exist, purposes applying quality reliability concepts integrated circuits, Waferscale chooses following definitions: Quality relates characteristics that make device either acceptable unacceptable terms meeting device specifications well customer's expectations) exists time received customer. number units that fail meet manufacturer's customer's specifications typically expressed fraction percentage total units; since this usually very small number, commonly expressed Parts Million (PPM) Defects Million (DPM). Reliability measure probability that given device will perform stated function will degrade point failure non-compliance throughout lifetime product when subjected accepted field conditions. Thus, reliability probability survival) given part function both time stress. must therefore expressed units that relate probability given device failing over period time. There several different methods used specify reliability:
Cumulative Average Failure Rate (often referred simply Failure Rate) Instantaneous Failure Rate (also known Hazard Rate) Mean Time Failure (MTTF) Mean Time Between Failures (MTBF)
However, most common measurement used reliability discussions FITs (Failures Time). represents failure billion (109) device hours.
Waferscale's Reliability Philosophy
basic philosophy Waferscale toward product reliability summarized follows:
reliability product must designed manufactured into product.
This process begins with product definition phase, continues throughout design, development, production phases product. important recognize that amount reliability testing fundamentally change inherent reliability device. should understood that reliability testing opposed environmental stress screening) does directly impact reliability parts shipped customers. What reliability tests carried Waferscale accomplish following:
evaluates ability products perform under worst case environmental
conditions; identifies reliability problems that necessary corrective actions undertaken; provides mathematical basis estimate field reliability (failure rates), therefore judge whether reliability objectives being met; provides data necessary drive continuous reliability improvement Waferscale's products.
Reliability Summary 1999
Quality, Reliability, Product Life Cycle
Waferscale, both quality reliability products given highest priority. goal assure that products meet standard measures quality reliability that considered "best class" semiconductor manufacturers. Toward achieving that goal, have developed number programs systems that incorporate these objectives into every phase total product life cycle. What follows brief description some aspects these programs:
Product Planning:
Product reliability considered right front during product planning process. product will used, what sort environmental stresses likely occurred, much design margin required meet customers' needs, other application-related issues taken into consideration during product planning definition phase. addition, customer feedback existing products already production carefully reviewed assure necessary improvements incorporated into latest designs. This information collected reviewed prior start design, then continually monitored throughout product life cycle.
Circuit Design:
Design rules specifically developed with silicon reliability requirements mind, with particular consideration process variances inherent manufacturing lines. addition, design methods employed, strictly adhered that assure testability aspects final product. example, absolute requirement provide ability observe control embedded memories sequential logic functions, with goal being achieve close 100% test coverage possible.
Product Reviews:
product planning design activity frequently reviewed throughout these phases members from various disciplines, including Marketing, Sales, Manufacturing, Quality Reliability, addition Product Planning Design. These frequent meetings provide forum discuss potential issues concerns that impact product performance, including field reliability. This committee also reviews test programs manufacturing strategies used production, once again sure product design will constrain ability test product effectively. Furthermore, this time also make sure that achieving these goals remains consistent with cost objectives required provide competitive solution marketplace.
Characterization:
Extensive characterization programs used determine only whether part conforms specifications, assure adequate manufacturing margins exist. This helps eliminate sensitivities actual usage conditions environmental stresses. also provides means proper screening methods factory (test program parameters, limits).
Yield Enhancement:
This activity integral part reliability improvement, since most yield-limiting mechanisms also impact product reliability. Extensive studies have shown that yield improvement translates into improved field reliability. Waferscale, yield enhancement ongoing program that addressed multi-functional team, including members Quality Reliability organization.
Manufacturing:
Manufacturing utilizes statistical Process Control methods (SPC), operator training, calibration, periodic maintenance programs assure quality standards maintained throughout manufacturing process.
Reliability Summary 1999
Quality Assurance Quality Control
Appropriate procedures implemented managed Quality Reliability department assure Waferscale's specifications procedures adhered throughout manufacturing process. addition, many other programs exist Waferscale that managed department, further assure standards quality reliability met: Change Control Notification system; Customer Corrective Action Request (CCAR) program; Supplier Vendor Audit program; Document Control; Management Review process. these activities part Waferscale's Total Quality Management philosophy. Quality system based ISO9000 quality system model (note: Waferscale actively pursuing ISO9001 Certification). Furthermore, wafer foundries, assembly subcontractors, test subcontractors, other major vendors that used part manufacturing flow ISO9000 registered companies.
Basic Reliability Concepts
Reliability Life Curve (Bathtub Curve):
very large class systems, including integrated circuits, follows reliability model that come known classical Bathtub Curve (based generalized shape curve). While experimental evidence suggests that other models that take into account bimodal other failure distributions may, reality, provide more accurate representation (and thus take somewhat different shaped curve), nevertheless useful, practical, sufficiently accurate describe reliability using Bathtub Curve.
Bathtub Curve
Early Failure Period Failure Rate
Wearout Failure Period
Stable Failure Period (Random Failure Region)
Time
This model breaks down component reliability into three distinct regions operations: Early Failure Period, sometimes referred Infant Mortality Period (characterized decreasing failure rate). Most failures this region relate gross defects variations that exist processing assembly IC's. Stable (random) Failure Period, characterized having approximately constant failure rate. These failures more often related minor process defects variations, traced design limitations. Wear-out Period, characterized having increasing failure rate. parts eventually wear out! Usually, however, onset this region well beyond rated life product.
Reliability Summary 1999
Basic Reliability Concepts
(cont.)
High levels field reliability achieved addressing requirements each these regions following manner: Eliminate many parts with defects that cause infant mortalities before they reach customer (typically done through combination test methods, and, where appropriate, environmental stress screening; most common tool used this purpose burn-in). also very important continually reduce process defect density this translates into lower intrinsic rate infant mortality failures. Maintain sufficiently failure rate so-called stable region. majority failures occurring during this phase operation result from oxide breakdown, either time dependant mechanism, result some electrical mechanical overstress. Proper design (immunity critical) clean processing methods keys maintaining failure rate. Make sure wearout period (which every product has-all products eventually fail, given enough time) occurs point time beyond required useful life product. Reliability testing good predictor whether this true. Achieving this goal entirely dependant good product design careful control manufacturing processes, since electrical testing stress screening effective addressing this issue. Provided wearout mechanism does kick during normal lifetime product, actual wearout mechanisms normally considered factor overall reliability integrated circuits.
Accelerated Testing:
difficulties demonstrating product reliability long lifetime inherent failure rate today's integrated circuits. Performing reliability tests under normal operating conditions longer practical, because very large sample sizes required, even more problematic, length time required meaningful results. Therefore, another approach needed order predict failure rates. primary technique used generate reliability data reasonable period time accelerate failure mechanisms through application stress. When done properly, this approach, commonly referred accelerated testing, used predict failure rate products under normal field conditions. While full discussion reliability concepts test methods well beyond scope this report, accelerated testing such important part reliability testing worth discussing some detail. Many different acceleration models have been developed address need accelerate different types failure modes that caused different types environmental stress. Fortunately integrated circuits, overwhelming majority defect mechanisms that lead field failures accelerated using only small number stress techniques. away most important most commonly used method acceleration thermal acceleration. There wide class failure mechanisms CMOS IC's that highly dependant temperature (essentially chemical reactions). Increasing temperature often dramatically increases reaction rate underlying defect mechanism. mathematical model that describes this phenomenon well known Arrhenius Model, which describes relationship between stress field temperatures respectively), ,activation energy (EA) acceleration factor (AF):
where:
Acceleration Factor Activation Energy (eV) Stress Temperature (°K) Field Temperature (°K) Boltzman's Constant (8.63 eV/°K)
Reliability Summary 1999
Basic Reliability Concepts
(cont.)
addition, there other forms acceleration that useful accelerating certain specific defect mechanisms integrated circuits. instance, time dependent dielectric breakdown (TDDB) strongly accelerated presence electric fields; therefore voltage effectively used accelerate many oxide defects. Electromigration accelerated increasing current density through aluminum traces. Another example humidity pressure, often combined with elevated temperature, accelerate effects moisture absorption penetration plastic encapsulated packages. This leads acceleration corrosive effects moisture reacting with underlying surface. Mathematical models exist these (and other) forms accelerated testing allow calculation acceleration factor; detailed discussion these found most textbooks reliability environmental stress screening.
Activation Energy:
activation energy given failure mode known, becomes simple exercise calculate thermal acceleration factor, thereby extrapolate test results actual conditions. Activation energies determined experimentally running accelerated tests multiple temperatures, then considering only failures corresponding specific mechanism. plotting results, activation energy determined. Alternatively, most defect mechanisms integrated circuits have been characterized quite extensively industry, sufficiently accurate estimations activation energy already exist most common failure mechanisms. Some examples shown table below:
Failure Mechanism
Oxide rupture/short Ionic contamination/drift Electromigration Au-Al intermetallic growth Floating gate charge loss Corrosion Dielectric breakdown (field induced)
Activation Energy (estimate)
1.0-1.4 0.8-1.3 0.3-0.9
Reliability Summary 1999
Basic Reliability Concepts
(cont.)
Failure Rate Estimation:
determination failure rates based test results straightforward might assume. There number reasons this. First all, most reliability tests performed using readout interval method data collection: parts tested predetermined intervals, determined good bad; exact times failure never precisely known. Another factor that ability extrapolate failure rates depends large degree number failures observed occur. Tests that produce little failures introduce greater errors into reliability prediction. further complicate matters, there different statistical distributions that apply various failure mechanisms (Normal, Lognormal, Weibull, Exponential distributions most commonly used), each representing different mathematical behavior. While detailed discussion this topic well beyond scope this paper, suffice certain techniques have been developed greatly simplify reliability prediction process. most common method employed known Squared method (based Chi-Square distribution): Failure Rate Where: square distribution number failures confidence level sample size units) test time acceleration factor
Values Square distribution, function both number failures confidence level, readily available found most books Statistics, Probability, Reliability engineering. sample values given table below (this represents numerator above equation):
Number Failures
Confidence Level
1.83 4.04 6.22 8.36 10.5 12.6 14.7 16.8 23.0 33.4 43.6
4.60 7.78 10.6 13.4 16.0 18.5 21.0 23.6 30.8 42.6 54.0
Reliability Summary 1999
Reliability Programs Waferscale
Reliability Qualification Program:
Prior product being released production, reliability assessment performed determine reliability risk present, what appropriate tests required before product released. products, wafer processes, package types receive comprehensive series reliability tests must demonstrate reliable performance. addition, changes products wafer assembly processes that considered major require that reliability assessment made; usually this involves repeating more reliability screens that were previously qualify original product. changes reviewed they fall into category needing additional reliability testing before product allowed shipped production. Waferscale considers necessary perform reliability assessment (typically consisting reliability qualification tests) under following scenarios:
process, product, package assembly startup, transfer location Major process change, including limited Process scaling (process shrink) Major equipment change Design rule change
Significant layout change
Package modification, including limited materials Design rule changes Dimensional change
Reliability Monitor Program:
addition qualifying major changes products processes, Reliability Monitor Program that periodically samples (for purpose reliability assessment) major products processes, does ongoing concern. data used make sure reliability standards continuously being exceeded, also help continuously drive reliability improvement through failure analysis feedback appropriate functional groups.
Reliability Summary 1999
Reliability Programs Waferscale
(cont.)
Reliability Tests:
table below lists reliability qualification tests utilized regular basis evaluate product reliability. These tests based, most part, standardized test methods that have been developed testing (where appropriate, reference standard indicated). These test methods constantly being reviewed appropriateness, modified particular need situation.
High Temperature Operating Life (HTOL)
Purpose: determine ability withstand prolonged operating stress, both electrical thermal. Test Description/Conditions: Parts operated burn-in environment, under full electrical bias elevated temperature. Usually, input signals dynamically exercised frequency provide additional electrical stress (this attempts exercise major portions internal circuitry, referred Dynamic High Temperature Operating Life). Both temperature voltage acceleration incorporated into this stress test.
Temperature
Plastic 125°C Ceramic 150°C
Volts
Duration
1000 hours
Readouts
168, 500, 1000 hours
Reference Standard
MIL-STD-883 Method 1005
Typical defects/failure modes: Activation silicon defects, which take variety electrical forms: oxide breakdowns; charge loss; shifts (resulting from ionic contamination hot-carrier injection); metal poly shorts; intermetallic growth; corrosion; etc. these cause functional parametric failures, usually catastrophic (non-recoverable) nature.
High Temperature Storage Life (HTSL)
Purpose: determine ability withstand prolonged high temperature storage; also used determine ability non-volatile memory cells maintain sufficient level charge their floating gates programmed data storage). Test Description/Conditions: Parts placed temperature chamber extended period time, elevated temperature. Parts unbiased this test.
Temperature
Plastic 140°C Ceramic 225°C
Duration
1000 hours
Readouts
500, 1000 hours
Reference Standard
MIL-STD-883 Method 1008
Typical defects/failure modes: with HTOL, defect mechanism accelerated temperature become activated during this stress test. Therefore, many same mechanisms possible candidates failing this type stress. However, since bias applied, less likely induce oxide defects, which tend more function voltage acceleration. Charge loss (NVM products) particularly susceptible this test because high activation energy high temperatures involved (resulting very large acceleration factors).
Reliability Summary 1999
Reliability Programs Waferscale
(cont.)
Temperature Cycling (T/C)
Purpose: determine ability withstand temperature extremes changes from temperature extreme another. Test Description/Conditions: This test consists subjecting devices (unbiased) alternating extreme high extreme temperature, transitioning between them within certain specified time. such, this test generates mechanical stresses resulting from mismatches thermal coefficients expansion dissimilar materials.
Note: units preconditioned prior running this stress test.
Temperature
-65°C +150°C
Duration
1000 cycles
Readouts
100, 500, 1000 cycles
Reference Standard
MIL-STD-883 Method 1010
Typical defects/failure modes: Continuity failures (opens, shorts) gross functional fails, resulting from broken lifted wire bonds, cracked die.
Pressure (Autoclave)
Purpose: evaluate moisture resistance non-hermetic (plastic) encapsulated packages. Test Description Conditions: This test performed using autoclave pressure cooker, which subjects parts extreme humidity (fully saturated) under elevated temperature pressure. This represents severe conditions used achieve results short period time.
Temperature
121°C
Pressure Humidity
PSIG 100%
Duration
hrs.
Readouts
Reference Standard
168*, hrs. JEDEC (*critical timepoint Method A102-B release)
Typical defects/failure modes: Corrosion exposed metallization, leading continuity fails (opens) gross functional fails.
Reliability Summary 1999
Reliability Programs Waferscale
(cont.)
Steady State Temperature Humidity Bias Life Test (85/85)
Purpose: determine ability non-hermetic packages withstand prolonged exposure combination temperature, humidity, electrical bias (simulating humid environment). Test Description Conditions: This test utilizes elevated temperature humidity accelerate penetration moisture through encapsulant along interface between package leads encapsulant, order reach surface. presence electrical bias serves accelerate corrosive action residual chemicals present that interact with moisture.
Temperature
85°C
Humidity
Bias
volts Ground alternating pins
Duration
hrs.
Readouts
168, 500, 1000
Reference Standard
JEDEC Method A101-B
Typical defects/failure modes: Continuity failures bond corrosion; functional failures corrosion other active metallization (particularly cracks exist passivation layer). presence moisture ionic contamination also lead shorts.
Highly Accelerated Temperature Humidity Stress (HAST)
Purpose: determine ability non-hermetic packages withstand prolonged exposure combination temperature, humidity, electrical bias (simulating humid environment). Test Description Conditions: This test utilizes severe environmental conditions highly accelerate penetration moisture through encapsulant along interface between package leads encapsulant, order reach surface. This test therefore effective alternative Steady State Temperature Humidity Bias Life Test (85/85), particularly means achieve results very short time period.
Note: units require preconditioning.
Temperature
130°C
Vapor Humidity Pressure
33.3 psia
Duration
hrs.
Readouts
Reference Standard
50*, hrs. JEDEC (*critical timepoint Method A110-A release)
Typical defects/failure modes: failure mechanisms activated during this test essentially same those affected Steady State Temperature Humidity Bias Life Test (85/85).
2-10
Reliability Summary 1999
Reliability Programs Waferscale
(cont.)
Endurance Cycling (Erase/Write Cycling)
Purpose: determine endurance Flash EEPROM memory cells repeatedly erased rewritten Test Description Conditions: This test performed normal user mode, utilizing built-in algorithms write erase each on-chip memory cells. addition, data retention bake performed each readout accelerate charge loss issues.
Temperature
25°C Bake 140°C
Duration
Flash: 100,000 cycles EEPROM: 10,000 cycles PLD: 1,000 cycles
Readouts (cycles)
Flash: 10K, 50K, 100K EEPROM: PLD:
Reference Standard
Internal specification
Typical defects/failure modes: Functional parametric (pushout timing) fails (i.e. cannot properly write erase cell) more cells memory array; primarily caused oxide degradation (charge trapping, dislocation faults).
Electrostatic Discharge (ESD)
Purpose: determine resistance electrostatic discharge events. Test Description Conditions: standard method used Human Body model, which discharges capacitor through resistor, does using both positive negative polarities pulses each). part must able withstand minimum 2000 volts pins.
Temperature
25°C
Forcing Function (electrical equivalent)
Voltage
Typically, volt increments, minimum 2500 volts
Reference Standard
MIL-STD-883 Method 3015
Typical defects/failure modes: leakage caused damage gate oxides connected being stressed.
2-11
Reliability Summary 1999
Reliability Programs Waferscale
(cont.)
Latch-up
Purpose: evaluate part's resistance latch-up. Test Description Conditions:
Temperature
25°C
Test Method
Test method according JEDEC guidelines
Criteria
Limits according JEDEC guidelines
Reference Standard
JEDEC JESD78
Typical defects/failure modes: Gross functional fails caused fused bond wires vaporized metallization (resulting from excessive current flow that occurs when internal structure goes into latchup mode).
2-12
Introduction
Reliability Waferscale
PSD/System Logic Reliability Data Summary PROM/RPROM/EPROM Reliability Data Summary PSD/System Logic Reliability Data PROM/RPROM/EPROM Reliability Data Sales Representatives Distributors
Section Index
PSD/System Logic Reliability Data Summary
Introduction .3-1 Dynamic High Temperature Life .3-1 High Temperature Storage Life .3-1 Temperature Cycle (Air Air).3-2 Thermal Shock (Oil Oil) .3-2 Pressure .3-2 Highly Accelerated Stress Test .3-2 Temperature Humidity Bias.3-2 Endurance Cycling (PLD) .3-3 Endurance Cycling (FLASH).3-3 Endurance Cycling (E2) .3-3
PSD/System Logic Reliability Data Summary
Introduction
summary data below consists PSD/System Logic family data added together each stress condition. Therefore, total failure rate represents family product. individual device data, please turn Reliability Data section where each device family listed individually.
DYNAMIC HIGH TEMPERATURE LIFE
STRESS CONDITIONS 125°C/6.0 150°C/6.0 150°C/6.5 HOURS 0/5117 0/2445 0/507 HOURS 1/5117** 0/2445 0/507 HOURS 0/5116 0/2444 0/507 1000 HOURS 0/5115 0/2366 0/105 TOTAL DEVICE HOURS 5,230,668 1,795,268 306,000 VOLT. ACC. FACTOR* 1.749 1.749 3.014
*Derated 5.5V single charge loss mechanism. **NOTE:
failures single charge loss.
ACTIVATION ENERGY (Ea) 1.00
TEMP. ACC. FACTOR* 504.1 125°C 2824.5 150°C
ACCELERATED DEVICE HOURS 4.612E+09 1.147E+10
FAILURES
FAILURE RATE (60% UCL) 0.13
*Derated 55°C single charge loss mechanism. Total Failure Rate: 0.13 5.5V; Upper Confidence Level)
HIGH TEMPERATURE STORAGE LIFE
STRESS CONDITIONS 140°C 225°C 250°C HOURS 0/4468 0/2185 0/105 HOURS 0/4468 1/2185* 0/105 HOURS 0/4468 0/2184 0/105 HOURS 1/4466* 1/2184* 0/105 1000 HOURS 1/4133* 0/1803 0/105 TOTAL DEVICE HOURS 4,300,500 1,968,008 105,000
*NOTE:
failures single charge loss.
ACTIVATION ENERGY (Ea)
STRESS TEMP. 140°C
TEMP. ACC. FACTOR* 1.454E+03 1.759E+05 5.359E+05
ACCELERATED DEVICE HOURS 6.251E+09 3.462E+11 5.627E+10
FAILURES
FAILURE RATE (60% UCL)
1.00
225°C 250°C
0.0128
*Derated 55°C single charge loss mechanism. Total Failure Rate: 0.0128 Upper Confidence Level)
Reliability Summary 1999
PSD/System Logic Reliability Data Summary (Cont.)
TEMPERATURE CYCLE (AIR AIR)
STRESS CONDITIONS -65°C/+150°C -65°C/+150°C 0°C/+100°C DEVICE PACKAGE CERDIP PLASTIC PLASTIC CYCLES 0/2066 0/4533 0/78 CYCLES 0/1950 0/4417 0/78 CYCLES 0/1950 0/4301 0/78 1000 CYCLES 0/1912 0/4029
THERMAL SHOCK (OIL OIL)
STRESS CONDITIONS -65°C/+150°C DEVICE PACKAGE PLASTIC CYCLES 0/905 CYCLES 0/208
PRESSURE
STRESS CONDITIONS 121°C/15 PSIG HOURS 0/2902 HOURS 0/2698 HOURS 0/2140
HIGHLY ACCELERATED STRESS TEST
STRESS CONDITIONS 130°C R.H. 5.25V HOURS 0/506 HOURS 0/182
TEMPERATURE HUMIDITY BIAS
STRESS CONDITIONS 85°C R.H. /5.25V HOURS 0/694 HOURS 0/694 HOURS 0/694 1000 HOURS 0/694
Reliability Summary 1999
PSD/System Logic Reliability Data Summary (Cont.)
ENDURANCE CYCLING (PLD) (125°C/5.5
STRESS CONDITIONS PROG/ERASE DEVICE PACKAGE PLASTIC 1,000 CYCLES 0/128 5,000 CYCLES 0/128 10,000 CYCLES 0/128
ENDURANCE CYCLING (FLASH) (125°C/5.5
STRESS CONDITIONS PROG/ERASE DEVICE PACKAGE PLASTIC 10,000 CYCLES 0/128 50,000 CYCLES 0/128 100,000 CYCLES 0/128
ENDURANCE CYCLING (E2) (125°C/5.5
STRESS CONDITIONS PROG/ERASE DEVICE PACKAGE PLASTIC 1,000 CYCLES 0/128 5,000 CYCLES 0/128 10,000 CYCLES 0/128
Introduction
Reliability Waferscale
PSD/System Logic Reliability Data Summary PROM/RPROM/EPROM Reliability Data Summary PSD/System Logic Reliability Data PROM/RPROM/EPROM Reliability Data Sales Representatives Distributors
Section Index
PROM/ RPROM/EPROM/ Reliability Data Summary
Introduction .4-1 Dynamic High Temperature Life .4-1 High Temperature Storage Life .4-2 Temperature Cycle (Air Air).4-2 Thermal Shock (Oil Oil) .4-3 Pressure .4-3 Temperature Humidity Bias.4-3
PROM/RPROM/EPROM Reliability Data Summary
Introduction
summary data below consists PROM/RPROM/EPROM family data added together each stress condition. Therefore, total failure rate represents family product. individual device data, please turn Reliability Data section where each device family listed individually.
DYNAMIC HIGH TEMPERATURE LIFE
STRESS CONDITIONS 125°C/5.5 125°C/6.0 125°C/6.5 150°C/6.0 150°C/6.5 HOURS 0/388 0/2840 0/105 0/3279 0/1447 HOURS 0/388 1/2840(E) 0/105 0/3279 0/1447 HOURS 0/388 0/2839 0/105 0/3279 3/1447(C) 1000 HOURS 0/388 0/2729 2/105(A) 2/3212(B) 3/1444(D) TOTAL DEVICE HOURS 388,000 2,745,668 105,000 3,245,500 1,445,500 VOLT. ACC. FACTOR* 1.749 3.014 1.749 3.014
*Derated 5.5V single charge loss mechanism.
2-Single Charge Loss,1.32 2-Single Charge Loss, 1.32 1-ICC STB, 1-Oxide Defect, 2-Single Charge Loss, 1.32 2-Single Charge Loss, 1.32 1-Bit Line Short,
ACTIVATION ENERGY (Ea) 1.00
TEMP. ACC. FACTOR* 125°C 2824 150°C 77.94 125°C 260.41 150°C
ACCELERATED DEVICE HOURS 2.775E+09 2.833E+10 4.292E+08 2.613E+09 3.415E+10
FAILURES
FAILURE RATE (60% UCL) 0.30 1.37 1.68
*Derated 55°C single charge loss mechanism. Total Failure Rate: 1.68 5.5V; Upper Confidence Level)
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data Summary (Cont.)
HIGH TEMPERATURE STORAGE LIFE
STRESS CONDITIONS 140°C 150°C 225°C 250°C HOURS 0/2648 0/157 0/3495 0/231 HOURS 0/2648 0/157 2/3495* 0/231 HOURS 0/2648 0/157 2/3416* 0/231 HOURS 0/2648 0/52 8/3232* 1000 HOURS 1/2467* 0/52 9/2809* TOTAL DEVICE HOURS 2,557,500 69,640 3,057,100 38,808
*NOTE:
failures single charge loss.
ACTIVATION ENERGY (Ea)
STRESS TEMP. 140°C
TEMP. ACC. FACTOR* 1.454E+03 2.825E+03 1.759E+05 5.359E+05
ACCELERATED DEVICE HOURS 3.718E+09 1.967E+08 5.378E+11 2.080E+10 5.63E+11
FAILURES
FAILURE RATE (60% UCL)
1.00
150°C 225°C 250°C
0.043
0.043
*Derated 55°C single charge loss mechanism. Total Failure Rate: 0.043 Upper Confidence Level)
TEMPERATURE CYCLE (AIR AIR)
STRESS CONDITIONS -65°C/+150°C -65°C/+150°C DEVICE PACKAGE CERDIP PLASTIC CYCLES 0/3556 2/3282* CYCLES 0/3556 1/3280* 1000 CYCLES 2/3556* 1/3279* 0/156 2000 CYCLES
*NOTE:
failures single charge loss.
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data Summary (Cont.)
THERMAL SHOCK (OIL OIL)
STRESS CONDITIONS -65°C/+150°C DEVICE PACKAGE PLASTIC CYCLES 0/234 CYCLES 0/234
PRESSURE
STRESS CONDITIONS 121°C/15 PSIG HOURS 1/2075 HOURS 0/1788 HOURS 4/1736*
*NOTE:
failures single charge loss.
TEMPERATURE HUMIDITY BIAS
STRESS CONDITIONS 85°C R.H. /5.25V HOURS 0/208 HOURS 0/208 HOURS 0/208 1000 HOURS 0/208
Introduction
Reliability Waferscale
PSD/System Logic Reliability Data Summary PROM/RPROM/EPROM Reliability Data Summary PSD/System Logic Reliability Data PROM/RPROM/EPROM Reliability Data Sales Representatives Distributors
Section Index
PSD/System Logic Reliability Data
PSD813F1 PLCC TQFP PSD813F3 PLCC PSD301 CLDCC/PLCC TQFP PSD302 CLDCC/PLCC MQFP/TQFP PQFP PSD303 CLDCC/PLCC MQFP/TQFP PQFP PSD304R CLDCC/PLCC TQFP PSD314R TQFP PSD402 CLDCC/PLCC TQFP PSD413F PLCC (MCM FLASH) PSD503 CLDCC/PLCC TQFP PSD603 CLDCC PSD703 CLDCC/PLCC PSD100 CLDCC/CPGA PAC1000 CPGA SAM448 Plastic (300 Mil) MAP168 PLCC WS59032 CPGA
Flash In-System-Programmable .5-1 Microcontroller Peripheral Flash In-System-Programmable .5-4 Microcontroller Peripheral Field-Programmable Microcontroller Peripheral.5-5
Field-Programmable Microcontroller Peripheral.5-11
Field-Programmable Microcontroller Peripheral.5-20
Field-Programmable Microcontroller Peripheral.5-25
Field-Programmable Microcontroller Peripheral.5-27 Field-Programmable Microcontroller Peripheral.5-28
Field-Programmable Microcontroller Peripheral.5-31 with Flash Memory Field-Programmable Microcontroller Peripheral.5-32
Field-Programmable Microcontroller Peripheral.5-35 Field-Programmable Microcontroller Peripheral.5-36 Peripheral with Memory .5-38 User-Configurable Microcontroller .5-39 User-Configurable Microsequencer .5-39
Peripheral with Memory .5-40 High Speed 32-Bit CMOS Microprocessor Slice.5-41
PSD/System Logic Reliability Data
PSD813F1 (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 98-215-1A 98-216-1A NUMBER G830001005P G833010004P PROCESS FA225S FA225S PACKAGE TYPE 52-Pin PLCC DATE CODE 9836 9839 HOURS 0/77 0/77 0/154 TOTAL DEVICE HOURS 154,000 HOURS 0/77 0/77 0/154 1000 HOURS 0/77 0/77 0/154
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER 98-215-1B 98-216-1B NUMBER G830001005P G833010004P PROCESS FA225S FA225S PACKAGE TYPE 52-Pin PLCC DATE CODE 9836 9839 HOURS 0/77 0/77 0/154 TOTAL DEVICE HOURS 154,000 HOURS 0/77 0/77 0/154 HOURS 1000 HOURS 0/77 0/77 0/154 0/77 0/77 0/154
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 98-215-1C** NUMBER G830001005P PROCESS FA225S PACKAGE TYPE 52-Pin PLCC DATE CODE 9836 CYCLES 0/52 CYCLES 0/52 1000 CYCLES 0/52
**Preconditioning: cyc. @-40°C/125°C; Bake hrs. 125°C; Moisture soak hrs. 30°C/60% R.H.; cyc. Reflow.
HIGHLY ACCELERATED STRESS TEST (131°C/85% R.H./5.25V)
PROJECT NUMBER 98-215-1E** NUMBER G830001005P PROCESS FA225S PACKAGE TYPE 52-Pin PLCC DATE CODE 9836 HOURS 0/52
**Preconditioning: cyc. @-40°C/125°C; Bake hrs. 125°C; Moisture soak hrs. 30°C/60% R.H.; cyc. Reflow.
TOTAL DEVICE HOURS 2,600
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD813F1 (PLCC) (Cont.) ENDURANCE CYCLING (PLD) (125°C/5.5
PROJECT NUMBER 98-215-1G 98-216-1G NUMBER G830001005P G833010025P PROCESS FA225S FA225S PACKAGE TYPE 52-Pin PLCC DATE CODE 9836 9839 1,000 CYCLES 0/64 0/64 0/128 TOTAL DEVICE HOURS 2,560,000 5,000 CYCLES 0/64 0/64 0/128 10,000 CYCLES 0/64 0/64 0/128
ENDURANCE CYCLING (E2) (125°C/5.5
PROJECT NUMBER 98-215-1G 98-216-1G NUMBER G830001005P G833010025P PROCESS FA225S FA225S PACKAGE TYPE 52-Pin PLCC DATE CODE 9836 9839 1,000 CYCLES 0/64 0/64 0/128 TOTAL DEVICE HOURS 2,560,000 1,000 CYCLES 0/64 0/64 0/128 10,000 CYCLES 0/64 0/64 0/128
ENDURANCE CYCLING (FLASH) (125°C/5.5
PROJECT NUMBER 98-215-1G 98-216-1G NUMBER G830001005P G833010025P PROCESS FA225S FA225S PACKAGE TYPE 52-Pin PLCC DATE CODE 9836 9839 1,000 CYCLES 0/64 0/64 0/128 TOTAL DEVICE HOURS 12,800,000 1,000 CYCLES 0/64 0/64 0/128 10,000 CYCLES 0/64 0/64 0/128
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD813F1 (TQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 98-215-2A NUMBER G830001008P PROCESS FA225S PACKAGE TYPE 64-Pin TQFP DATE CODE 9837 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER NUMBER PROCESS FA225S PACKAGE TYPE 64-Pin TQFP DATE CODE 9837 HOURS HOURS HOURS 1000 HOURS
98-215-2B G830001008P
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 98-215-2C NUMBER G830001008P PROCESS FA225S PACKAGE TYPE 64-Pin TQFP DATE CODE 9837 CYCLES 0/52 CYCLES 0/52 1000 CYCLES 0/52
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD813F3 (PLCC)
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 98-217-1C** NUMBER G830002007P PROCESS FA225S PACKAGE TYPE 52-Pin PLCC DATE CODE 9841GAP CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
**Preconditioning: cyc. @-40°C/125°C; Bake hrs. 125°C; Moisture soak hrs. 30°C/60% R.H.; cyc. Reflow.
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 98-217-1D NUMBER G830002007P PROCESS FA225S PACKAGE TYPE 52-Pin PLCC DATE CODE 9841GAP HOURS HOURS HOURS
0/52
0/52
0/52
TOTAL DEVICE HOURS 12,480
HIGHLY ACCELERATED STRESS TEST (131°C/85% R.H./5.25V)
PROJECT NUMBER NUMBER PROCESS PACKAGE TYPE 52-Pin PLCC DATE CODE 9841GAP HOURS 0/52 HOURS 0/52
98-217-1E**
G830002007P
FA225S
**Preconditioning: cyc. @-40°C/125°C; Bake hrs. 125°C; Moisture soak hrs. 30°C/60% R.H.; cyc. Reflow.
TOTAL DEVICE HOURS 5,200
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD301 (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 90-203-1A 90-209-1A 92-226-2A 92-226-3A 92-300-1A 94-207-1A 95-205-2A NUMBER PSD301 90-0916 NA23502303 NA23600302 NA148010-03 N429022005 N450023011 PROCESS MA123 MA123 CE120DLM CE120DLM 120B CE080DLM CE080DLM 44-Pin CLDCC PACKAGE TYPE DATE CODE 9015 9021 9239 9239 9152 9442 9514 HOURS 0/98 0/158 0/77 0/76 0/77 0/77 0/116 0/679 TOTAL DEVICE HOURS 677,668 HOURS 0/98 0/158 0/76 0/76 0/77 0/77 0/116 0/678 1000 HOURS 0/98 0/158 0/75 0/76 0/77 0/77 0/116 0/677
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 90-203-1B 92-226-2B 92-226-3B 94-207-1B NUMBER PSD301 PROCESS MA123 44-Pin CLDCC PACKAGE DATE TYPE CODE 9015 9239 9239 9152 9442 HOURS 0/105 0/77 0/77 0/77 1/77(B) 1/413 TOTAL DEVICE HOURS 359,572 HOURS 0/105 0/77 0/77 0/77 0/76 0/412 HOURS 1/105(A) 0/77 0/77 0/77 0/76 1/412 0/77 0/77 0/77 0/76 0/307 1000 HOURS
NA23502303 CE120DLM NA23600302 CE120DLM CE120B N429022005 CE080DLM
92-300-1B NA148010-03
NUMBER
PROJECT NUMBER 90-203-1B 94-207-1B
READOUT Hours Hours
QUANTITY
MODE SBCL SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 90-209-1C 92-226-2C 92-226-3C 95-204-1C 95-205-2C NUMBER 90-0916 NA23502303 NA23600302 N451001006 N450023011 PROCESS MA123 CE120DLM CE120DLM CE120DLM CE080DLM 44-Pin CLDCC PACKAGE TYPE DATE CODE 9021 9239 9239 9509 9514 CYCLES 0/52 0/78 0/78 0/78 0/116 0/402 CYCLES 0/52 0/78 0/78 0/78 0/116 0/402 0/286 0/286 CYCLES 0/52 0/78 0/78 0/78 1000 CYCLES 0/52 0/78 0/78 0/78
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD301 (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 90-208-1A 91-202-1A 91-223-1A 92-200-1A 92-210-1A 92-211-1A 92-213-1A 92-225-3A 92-301-1A 93-210-2A 93-215-1A 93-219-1A 93-220-1A 93-302-1A 93-302-2A 94-302-1A 95-205-1A 95-210-1A 96-204-1A 96-208-1A 96-208-2A 96-208-3A 98-211-1A NUMBER 90-0916-AB 91-0301-AA 91-3802-AA NA148010-01 NA21001402 NA21001202 NA21501201 NA23600303 NA21501302 N315021001-P N315013002 N310022001 N334004004 NA30501403 N306010001 N421005002 N450023010 N520024002 N6110160044 N618008001 N618008004 N618008006 T822010003 PROCESS MA123 MA123 120B 120B 120B 120B 120B 120DLM 120B 120B 120DLM 120B 120DLM 120B 120B 120DLM 080DLM 080DLM 080DLM 080DLM 080DLM 080DLM MA225T 44-Pin PLCC PACKAGE TYPE DATE CODE 9021 9106 9140 9152 9212 9212 9217 9239 9217 9325 9325 9324 9337 9319 9320 9430 9515 9537 9625 9636 9636 9636 9834 HOURS 1/77(A) 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/69 0/116 0/62 0/77 0/75 0/77 0/77 0/116 0/77 0/77 0/77 0/77 0/77 0/77 1/1824 TOTAL DEVICE HOURS 1,823,168 HOURS 0/76 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/69 0/116 0/62 0/77 0/75 0/77 0/77 0/116 0/77 0/77 0/77 0/77 0/77 0/77 0/1823 1000 HOURS 0/76 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/69 0/116 0/62 0/77 0/75 0/77 0/77 0/116 0/77 0/77 0/77 0/77 0/77 0/77 0/1823
NUMBER
PROJECT NUMBER 90-208-1A
READOUT Hours
QUANTITY
MODE SBCL*
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD301 (PLCC) (Cont.) HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 90-208-1B 90-214-1B 91-202-1B 91-223-1B 92-200-1B 92-225-2B 93-210-2B 93-219-1B 93-220-1B 94-302-1B 95-303-1B 95-210-1B 96-204-1B 98-211-1B NUMBER 90-0916-AB 90-2244-AB 91-0301-AA 91-3802-AA NA148010-01 NA23402305 N315021001-P N310022001 N334004004 N421005002 N523017002 N520024002 N6110160044 T822010003 PROCESS MA123 MA123 MA123 120B 120B 120DLM 120B 120B 120DLM 120DLM 080DLM 080DLM 080DLM MA225T PACKAGE TYPE DATE CODE 9021 9027 9106 9140 9152 9241 9325 9324 9337 9430 9540 9537 9625 9834 HOURS HOURS 0/77 0/104 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1336 TOTAL DEVICE HOURS 1,207,000 NUMBER PROJECT NUMBER 90-208-1B 0/77 0/104 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1336 HOURS 1/77(A) 0/104 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 1/1334 1000 HOURS
44-Pin PLCC
0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1078
READOUT Hours
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 91-202-1C 91-223-1C 92-200-1C 92-213-1C 92-225-2C 92-301-1C 93-210-2C 93-215-1C 93-219-1C 94-302-1C 95-303-1C 95-205-1C 95-210-1C 96-204-1C 98-211-1C NUMBER 91-0301-AA 91-3802-AA NA148010-01 NA21501201 NA23402305 NA21501302 N315021001-P N315013002 N310022001 N421005002 N523017002 N450023010 N520024002 N6110160044 T822010003P PROCESS MA123 120B 120B 120B 120DLM 120B 120B 120DLM 120B 120DLM 080DLM 080DLM 080DLM 080DLM MA225T PACKAGE TYPE DATE CODE 9106 9140 9152 9217 9241 9217 9325 9325 9324 9430 9540 9515 9537 9625 9834 CYCLES 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/116 0/78 0/78 0/78 0/116 0/78 0/78 0/78 0/1298 CYCLES 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/116 0/78 0/78 0/78 0/1182 CYCLES 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/1066 1000 CYCLES 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/1066
44-Pin PLCC
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD301 (PLCC) (Cont.) THERMAL SHOCK (OIL OIL) (-65 +150
PROJECT NUMBER 93-302-1C* 93-302-2C* 93-302-4C* 93-302-5C* NUMBER NA30501403 N306010001 N306010001 N307051002 PROCESS 120B 120B 120B 120B 44-Pin PLCC PACKAGE TYPE DATE CODE 9319 9320 9320 9320 CYCLES 0/52 0/78 0/78 0/78 0/286 0/130 CYCLES 0/52 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 91-202-1D 91-223-1D 92-200-1D 92-213-1D 92-225-2D 92-301-1D 93-210-2D 93-215-1D 93-219-1D 94-302-1D 94-205-1D 95-210-1D 96-204-1D 98-211-1D NUMBER 91-0301-AA 91-3802-AA NA148010-01 NA21501201 NA23402305 NA21501302 N315021001-P N315013002 N310022001 N421005002 N450023010 N520024002 N6110160044 T822010003 PROCESS MA123 120B 120B 120B 120DLM 120B 120B 120DLM 120B 120DLM 080DLM 080DLM 080DLM MA225T 44-Pin PLCC PACKAGE TYPE DATE CODE 9106 9140 9152 9217 9241 9217 9325 9325 9324 9430 9515 9537 9625 9834 HOURS 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/76 0/52 0/52 0/76 0/52 0/52 0/52 0/776 TOTAL DEVICE HOURS 222,816 0/52 0/52 0/52 0/624 0/52 0/52 0/52 0/572 0/52 0/52 0/52 HOURS 0/52 0/52 0/52 0/52 0/52 0/52 0/52 HOURS 0/52 0/52 0/52 0/52 0/52 0/52 0/52
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD301 (PLCC) (Cont.) HIGHLY ACCELERATED STRESS TEST (131 °C/85% R.H./5.25V)
PROJECT NUMBER
91-202-1E
NUMBER
91-0301-AA
PROCESS
MA123 080DLM
PACKAGE TYPE
44-Pin PLCC
DATE
CODE
9106 9518
HOURS
0/52 0/52
HOURS
95-302-1E 98-211-1E**
N508001006 T822010003
MA225T
9834
0/52 0/156
0/52 0/52
**Preconditioning: cyc. @-40°C/125°C; Bake hrs. 125°C; Moisture soak hrs. 30°C/60% R.H.; cyc. Reflow.
TOTAL DEVICE HOURS 10,400
TEMPERATURE HUMIDITY BIAS °C/85% R.H./5.25V)
PROJECT NUMBER 91-202-1F 93-302-1F 93-302-2F 93-302-4F NUMBER 91-0301-AA NA30501403 N306010001 N306010001 PROCESS MA123 120B 120B 120B 44-Pin PLCC PACKAGE TYPE DATE CODE 9106 9319 9320 9320 HOURS HOURS 0/52 0/52 0/52 0/77 0/233 0/52 0/52 0/52 0/77 0/233 HOURS 0/52 0/52 0/52 0/77 0/233 1000 HOURS 0/52 0/52 0/52 0/77 0/233
TOTAL DEVICE HOURS 233,000
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD301 (TQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 93-208-1A NUMBER PROCESS PACKAGE TYPE 44-Pin TQFP DATE CODE 9310 HOURS HOURS 1000 HOURS
NA30201603H 120DLM
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 93-208-1B NUMBER PROCESS PACKAGE TYPE 44-Pin TQFP DATE CODE 9310 HOURS HOURS HOURS 1000 HOURS
NA30201603H 120DLM
0/52
0/52
0/52
0/52
TOTAL DEVICE HOURS 52,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 93-208-1C NUMBER PROCESS PACKAGE TYPE 44-Pin TQFP DATE CODE 9310 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
NA30201603H 120DLM
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER
93-208-1D
NUMBER
NA30201603H
PROCESS
120DLM
PACKAGE TYPE 44-Pin TQFP
DATE
CODE
9310
HOURS
0/52
TOTAL DEVICE HOURS 4,992
5-10
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD302 (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 92-208-1A 93-201-1A 94-303-2A 95-207-2A 96-202-2A 97-206-3A 97-206-7A 97-208-1A 97-300-2A NUMBER NA21101905 NA30301701 N429014003 N508003009 N508003009 G739003003P G744002002P G746001005P F706021008P PROCESS 120B 120DLM 120DLM 080DLM 080DLM MA225S MA225S MA225S CE080DLM 44-Pin CLDCC PACKAGE TYPE DATE CODE 9213 9304 9437 9519 9627 9740 9745 9749 9718 HOURS 0/77 0/77 0/72 0/77 0/77 0/77 0/77 0/77 0/77 0/688 TOTAL DEVICE HOURS 688,000 HOURS 0/77 0/77 0/72 0/77 0/77 0/77 0/77 0/77 0/77 0/688 1000 HOURS 0/77 0/77 0/72 0/77 0/77 0/77 0/77 0/77 0/77 0/688
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 93-201-1B 92-208-1B 95-207-2B 96-202-2B NUMBER PACKAGE DATE PROCESS TYPE CODE 9304 9213 9519 44-Pin CLDCC 9627 9740 9745 9749 9718 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/616 TOTAL DEVICE HOURS 577,500 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/616 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/616 0/539 1000 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77
NA30301701 CE120DLM NA21101905 CE120B
N508003009 080DLM N508003009 080DLM MA225S MA225S MA225S
97-206-3B G739003003P 97-206-7B G744002002P 97-208-1B G746001005P
97-300-2B F706021008P CE080DLM
5-11
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD302 (CLDCC) (Cont.) HIGH TEMPERATURE STORAGE LIFE (250°C)
PROJECT NUMBER 94-303-2B NUMBER PROCESS PACKAGE DATE TYPE CODE 44-Pin CLDCC 9437 HOURS HOURS HOURS 1000 HOURS
N429014003 CE120DLM
0/105
0/105
0/105
0/105
TOTAL DEVICE HOURS 105,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 92-208-1C 94-303-2C 95-207-2C 96-202-2C 97-206-3C 97-206-7C 97-208-1C 97-300-2C NUMBER NA21101905 N429014003 N508003009 N508003009 G739003003P G744002002P G746001005P F706021008P PROCESS CE120B CE120DLM 080DLM 080DLM MA225S MA225S MA225S CE080DLM 44-Pin CLDCC PACKAGE TYPE DATE CODE 9213 9437 9519 9627 9740 9745 9749 9718 CYCLES 0/78 0/105 0/78 0/78 0/78 0/78 0/78 0/78 0/644 CYCLES 0/78 0/105 0/78 0/78 0/78 0/78 0/78 0/78 0/644 1000 CYCLES 0/78 0/105 0/78 0/78 0/78 0/78 0/78 0/78 0/644
5-12
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD302 (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 92-202-1A 93-203-1A 93-211-1A 93-302-3A 94-208-1A 94-303-1A 95-207-1A2 96-202-1A 97-206-2A 97-208-2A 97-208-3A 98-207-1A 98-208-1A 98-209-1A 98-209-2A NUMBER NA15004003 NA30600704 NA30900102 NA25201101 N43400804 N429014002 N516003002 N6100220 G739003002P G746001036P G746001037P G748009007PG G74800900K G809042003P G809042004P PROCESS CE120B CE120DLM CE120DLM CE120B CE120DLM CE120DLM CE080DLM CE080DLM MA225S MA225S MA225S MA225S MA225S MA225S MA225S 44-Pin PLCC PACKAGE TYPE DATE CODE 9205 9308 9314 9304 9445 9437 9526 9618 9740 9751 9751 9814GAF 9813 9824 9823 HOURS 0/77 0/77 0/77 0/75 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1153 HOURS 0/77 0/77 0/77 0/75 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1153 1000 HOURS 0/77 0/77 0/77 0/75 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1153
TOTAL DEVICE HOURS 1,153,000
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER 93-203-1B 94-208-1B 94-300-1B 94-303-1B 95-207-1B 96-202-1B 97-206-2B 97-206-6B 97-208-2B 97-208-3B 98-204-1B NUMBER NA30600704 N43400804 N326009001 N429014002 N508003006 N6100220 G739003002P G744002005P G746001036P G746001037P G748005012P PROCESS CE120DLM CE120DLM CE120DLM CE120DLM CE080DLM CE080DLM MA225S MA225S MA225S MA225S MA225S MA225S MA225S 44-Pin PLCC PACKAGE TYPE DATE CODE 9308 9445 9403 9437 9519 9618 9740 9745 9751 9751 9811 9814GAF 9813 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1001 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1001 HOURS 1000 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1001 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/1001
98-207-1B G748009007PG 98-208-1B G74800900K
TOTAL DEVICE HOURS 1,001,000
5-13
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD302 (PLCC) (Cont.) TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 93-203-1C 93-211-1C 94-208-1C 94-303-1C 96-300-1C 95-207-1C 96-202-1C 97-206-2C 97-206-6C 97-207-1C 97-207-2C 97-208-3C 98-208-1C 98-208-2C** 98-209-1C 98-209-2C 98-218-1C NUMBER NA30600704 NA30900102 N43400804 N429014002 N551004003 N508003006 N6100220 G739003002P G744002005P G744003002P G744003003P G746001037P G74800900K G748009004K G809042003P G809042004P G820019005K PROCESS 120DLM 120DLM 120DLM 120DLM CE080DLM CE080DLM CE080DLM MA225S MA225S MA225S MA225S MA225S MA225S MA225S MA225S MA225S MA225S 44-Pin PLCC PACKAGE TYPE DATE CODE 9308 9314 9445 9437 9609 9519 9618 9740 9745 9745 9745 9751 9813 9813 9824 9823 9840GAG CYCLES 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/116 0/1364 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/116 0/1286 0/1170 0/1170 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 CYCLES 0/78 0/78 0/78 0/78 CYCLES 0/78 0/78 0/78 0/78 1000 CYCLES 0/78 0/78 0/78 0/78
**Preconditioning: cyc. @-40°C/125°C; Bake hrs. 125°C; Moisture soak hrs. 30°C/60% R.H.; cyc. Reflow.
5-14
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD302 (PLCC) (Cont.) PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 93-203-1D 93-211-1D 94-208-1D 94-300-1D 94-303-1D 95-207-1D 96-202-1D 97-206-2D 97-206-6D 97-207-1D 97-207-2C 97-208-2D 97-208-3D 98-204-1D 98-207-1D 98-208-1D 98-209-1D 98-209-2D 98-218-1D NUMBER NA30600704 NA30900102 N43400804 N326009001 N429014002 N508003006 N6100220 G739003002P G744002005P G744003002P G744003003P G746001036P G746001037P G748005012P G748009007PG G74800900K G809042003P G809042004P G820019005K PROCESS CE120DLM CE120DLM CE120DLM CE120DLM CE120DLM CE080DLM CE080DLM MA225S MA225S MA225S MA225S MA225S MA225S MA225S MA225S MA225S MA225S MA225S MA225S 44-Pin PLCC PACKAGE TYPE DATE CODE 9308 9314 9445 9403 9437 9519 9618 9740 9745 9745 9745 9751 9751 9811 9814GAF 9813 9824 9823 9840GAG HOURS 0/52 0/52 0/52 0/38 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/974 HOURS 0/52 0/52 0/52 0/38 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/974 0/52 0/818 0/52 0/52 0/52 0/52 0/52 0/52 HOURS 0/52 0/52 0/52 0/38 0/52 0/52 0/52 0/52 0/52
TOTAL DEVICE HOURS 222,528
HIGHLY ACCELERATED STRESS TEST (131°C/85% R.H./5.25V)
PROJECT NUMBER NUMBER PROCESS PACKAGE TYPE DATE CODE 9609 44-Pin PLCC 9813 9840GAG HOURS HOURS
96-300-1E 98-208-1E 98-218-1E**
N551004003 G74800900K G820019005K
CE080DLM MA225S MA225S
0/78 0/52 0/78 0/208 0/78 0/78
**Preconditioning: cyc. @-40°C/125°C; Bake hrs. 125°C; Moisture soak hrs. 30°C/60% R.H.; cyc. Reflow.
TOTAL DEVICE HOURS 14,300
5-15
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD302 (PLCC) (Cont.) TEMPERATURE HUMIDITY BIAS R.H. /5.25V)
PROJECT NUMBER 93-302-3F 94-300-1F1 94-300-1F2 94-301-1F2 94-301-2F2 94-301-3F2 NUMBER NA25201101 N326009001 N326009001 N410010004 N421021 N433013001 PROCESS 120B CE120DLM CE120DLM CE120DLM CE120DLM CE120DLM 44-Pin PLCC PACKAGE TYPE DATE CODE 9304 9403 9403 9417 9428 9442 HOURS 0/77 0/77 0/76 0/77 0/77 0/77 0/461 TOTAL DEVICE HOURS 461,000 HOURS 0/77 0/77 0/76 0/77 0/77 0/77 0/461 HOURS 0/77 0/77 0/76 0/77 0/77 0/77 0/461 1000 HOURS 0/77 0/77 0/76 0/77 0/77 0/77 0/461
Cond w/85°C/85% R.H., Reflow Simulations; Cond w/48 25°C R.H., Reflow Simulations.
THERMAL SHOCK (OIL OIL) (-65 +150
PROJECT NUMBER 93-302-3C* 94-301-1C* 94-301-2C* 94-301-3K 95-301-1K 95-301-2K 96-300-1K NUMBER NA25201101 N410010004 N421021 N433013001 N448003015 N508003011 N551004003 PROCESS CE120B CE120DLM CE120DLM CE120DLM CE120DLM CE080DLM CE080DLM 44-Pin PLCC PACKAGE TYPE DATE CODE 9304 9417 9428 9442 9509 9521 9442 CYCLES 0/78 0/77 0/77 0/77 0/77 0/77 0/78 0/541
5-16
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD302 (TQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 98-200-1A NUMBER G744003004HK PROCESS MA225S PACKAGE TYPE 44-Pin TQFP DATE CODE 9746 HOURS 0/77 HOURS 0/77 1000 HOURS 0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER 98-200-1B NUMBER G744003004HK PROCESS MA225S PACKAGE TYPE 44-Pin TQFP DATE CODE 9746
0/77
0/77
0/77
TOTAL DEVICE HOURS 38,500
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 98-200-1C NUMBER G744003004HK PROCESS MA225S PACKAGE TYPE 44-Pin TQFP DATE CODE 9746 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
5-17
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD302 (MQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 96-210-1A NUMBER N629027003P PROCESS CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9648 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 96-210-1B NUMBER N629027003P PROCESS CE080DLM PACKAGE TYPE 44-Pin MQFP DATE CODE 9648 HOURS HOURS HOURS 1000 HOURS
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 96-210-1B NUMBER N629027003P PROCESS CE080DLM PACKAGE TYPE 44-Pin MQFP DATE CODE 9648 CYCLES CYCLES
0/78
0/78
5-18
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD302 (PQFP)
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 98-201-1B NUMBER G744003009P PROCESS MA225S PACKAGE TYPE 52-Pin PQFP DATE CODE 9746 HOURS HOURS HOURS 1000 HOURS
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 98-201-1C NUMBER G744003009P PROCESS MA225S PACKAGE TYPE 52-Pin PQFP DATE CODE 9746 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 98-201-1D NUMBER G744003009P PROCESS MA225S PACKAGE TYPE 52-Pin PQFP DATE CODE 9746 HOURS HOURS HOURS
0/52
0/52
0/52
TOTAL DEVICE HOURS 12,480
5-19
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD303 (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150°C/6.0V)
PROJECT NUMBER 96-203-1A 97-206-1A 97-206-4A NUMBER N613032003 T738002002P T739000003P PROCESS CE080DLM MA225T MA225T 44-Pin CLDCC PACKAGE TYPE DATE CODE 9625 9738 9740 HOURS 0/77 0/77 0/77 0/231 TOTAL DEVICE HOURS 231,000 HOURS 0/77 0/77 0/77 0/231 1000 HOURS 0/77 0/77 0/77 0/231
HIGH TEMPERATURE STORAGE LIFE (225°C)
PROJECT NUMBER 96-203-1B 97-206-1B 97-206-4B NUMBER N613032003 T738002002P T739000003P PROCESS CE080DLM MA225T MA225T 44-Pin CLDCC PACKAGE TYPE DATE CODE 9625 9738 9740 HOURS 0/77 0/77 0/77 0/231 TOTAL DEVICE HOURS 166,936 HOURS 0/77 0/77 0/77 0/231 0/154 0/154 HOURS 0/77 0/77 1000 HOURS 0/77 0/77
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 96-203-1C 97-206-4C NUMBER N613032003 T739000003P PROCESS CE080DLM MA225T PACKAGE TYPE 44-Pin CLDCC DATE CODE 9625 9740 CYCLES 0/78 0/78 0/156 CYCLES 0/78 0/78 0/156 CYCLES 0/78 0/78 0/156 1000 CYCLES 0/78 0/78 0/156
5-20
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD303 (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 92-214-1A 92-303-1A 95-209-2A 96-203-2A 97-206-5A 98-202-1A 98-202-2A NUMBER NA21501402 NA22500702 N511016002 N613032002 T740004002P T750001005P T750001006P PROCESS 120B 120B 080DLM 080DLM MA225T MA225T MA225T 44-Pin PLCC PACKAGE TYPE DATE CODE 9217 9229 9330 9626 9741 9802 9802 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/539 TOTAL DEVICE HOURS 576,500 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/539 1000 HOURS 0/77 0/77 0/77 0/77 0/76 0/77 0/77 0/538
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 92-217-1B 92-303-1B 95-209-2B 96-203-2B 97-206-5B 98-202-1B 98-202-2B NUMBER NA21501420 NA22500702 N511016002 N613032002 T740004002P T750001005P T750001006P PROCESS 120B 120B 080DLM 080DLM MA225T MA225T MA225T 44-Pin PLCC PACKAGE TYPE DATE CODE 9222 9229 9330 9626 9741 9802 9802 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/539 TOTAL DEVICE HOURS 539,000 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/539 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/539 1000 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/539
5-21
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD303 (PLCC) (Cont.) TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 92-303-1C 95-209-2C 96-203-2C 97-206-5C 98-202-1C 98-202-2C NUMBER NA22500702 N511016002 N613032002 T740004002P T750001005P T750001006P PROCESS 120B 080DLM 080DLM MA225T MA225T MA225T 44-Pin PLCC PACKAGE TYPE DATE CODE 9229 9330 9626 9741 9802 9802 CYCLES 0/78 0/78 0/78 0/78 0/78 0/78 0/468 CYCLES 0/78 0/78 0/78 0/78 0/78 0/78 0/468 1000 CYCLES 0/78 0/78 0/78 0/78 0/78 0/78 0/468
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 92-303-1D 95-209-2D 96-203-2D 97-206-5D 98-202-1D 98-202-2D 98-202-3D 98-202-4D NUMBER NA22500702 N511016002 N613032002 T740004002P T750001005P T750001006P T750002003P T750002004P PROCESS 120B 080DLM 080DLM MA225T MA225T MA225T MA225T MA225T PACKAGE TYPE 44-Pin PLCC DATE CODE 9229 9330 9626 9741 9802 9802 9808 9808 HOURS 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/416 TOTAL DEVICE HOURS 70,248 HOURS 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/52 0/416 0/260 0/52 HOURS 0/52 0/52 0/52 0/52
5-22
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD303 (PQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 93-209-1A NUMBER PROCESS PACKAGE TYPE 52-Pin PQFP DATE CODE 9321 HOURS HOURS 1000 HOURS
NA319002002K 120DLM
0/65
0/65
0/65
TOTAL DEVICE HOURS 65,000
PSD303 (TQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 94-205-1A 96-206-1A NUMBER N407003005H N519011015H PROCESS CE120DLM CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9422 9539 HOURS 0/73 0/77 0/150 TOTAL DEVICE HOURS 150,000 HOURS 0/73 0/77 0/150 1000 HOURS 0/73 0/77 0/150
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER 94-205-1B 96-206-1B NUMBER PROCESS PACKAGE TYPE 44-Pin TQFP DATE CODE 9422 9539 HOURS 0/77 0/77 0/154 TOTAL DEVICE HOURS 154,000 HOURS 0/77 0/77 0/154 HOURS 0/77 0/77 0/154 1000 HOURS 0/77 0/77 0/154
N407003005H 120DLM N519011015H CE080DLM
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 94-205-1C NUMBER N407003005H PROCESS 120DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9422 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 94-205-1D 96-206-1D NUMBER N407003005H N519011015H PROCESS CE120DLM CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9422 9539 HOURS 0/52 0/52 0/104 HOURS 0/52 0/52 0/104 HOURS 0/52 0/52 0/104
TOTAL DEVICE HOURS 24,960
5-23
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD303 (MQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 97-200-1A NUMBER N635001007P PROCESS CE080DLM PACKAGE TYPE 44-Pin MQFP DATE CODE 9652 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 97-200-1B NUMBER N635001007P PROCESS CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9652 HOURS HOURS HOURS 1000 HOURS
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 97-200-1C NUMBER N635001007P PROCESS CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9652 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 97-200-1D NUMBER N635001007P PROCESS CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9652 HOURS HOURS
0/52
0/52
TOTAL DEVICE HOURS 8,736
5-24
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD304R (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150°C/6.0V)
PROJECT NUMBER 96-200-1A 97-203-2A NUMBER N551001003 N702013003P PROCESS CE080DLM CE080DLM PACKAGE TYPE 44-Pin CLDCC DATE CODE 9613 9710 HOURS 0/77 0/77 0/154 HOURS 0/77 0/77 0/154 1000 HOURS 0/77 0/77 0/154
TOTAL DEVICE HOURS 154,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 96-200-1B NUMBER PROCESS PACKAGE TYPE 44-Pin CLDCC DATE CODE 9613 HOURS HOURS HOURS 1000 HOURS
N551001003 CE080DLM
0/77 0/77
0/77 0/77
0/77 0/77
0/77 0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 96-200-1C 97-203-2C NUMBER N551001003 N702013003P PROCESS CE080DLM CE080DLM PACKAGE TYPE 44-Pin CLDCC DATE CODE 9613 9710 CYCLES 0/78 0/76 0/154 CYCLES 0/78 0/76 0/154 CYCLES 0/78 0/76 0/154 1000 CYCLES 0/78 0/76 0/154
5-25
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD304R (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 96-200-2A NUMBER N551001004 PROCESS 080DLM PACKAGE TYPE 44-Pin PLCC DATE CODE 9616 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 96-200-2B NUMBER N551001004 PROCESS 080DLM PACKAGE TYPE 44-Pin PLCC DATE CODE 9616 HOURS HOURS HOURS 1000 HOURS
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 96-200-2C NUMBER N551001004 PROCESS 080DLM PACKAGE TYPE 44-Pin PLCC DATE CODE 9616 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 96-200-2D NUMBER N551001004 PROCESS 080DLM PACKAGE TYPE 44-Pin PLCC DATE CODE 9616 HOURS HOURS HOURS
0/52
0/52
0/52
TOTAL DEVICE HOURS 12,480
5-26
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD304R (TQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 97-203-1A NUMBER PROCESS PACKAGE TYPE 44-Pin TQFP DATE CODE 9710 HOURS HOURS 1000 HOURS
N702013002HK CE080DLM
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER 97-203-1B NUMBER N702013002HK PROCESS CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9710 HOURS 0/77 HOURS 0/77 HOURS 0/77 1000 HOURS 0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 97-203-1C NUMBER N702013002HK PROCESS CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9710 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 97-203-1D NUMBER N702013002HK PROCESS CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9710 HOURS 0/52 HOURS 0/52 HOURS 0/52
TOTAL DEVICE HOURS 12,480
PSD314R (TQFP)
THERMAL SHOCK (OIL OIL) (-65 +150
PROJECT NUMBER 97-202-1K NUMBER N697008019HK PROCESS CE080DLM PACKAGE TYPE 44-Pin TQFP DATE CODE 9706 CYCLES 0/78 CYCLES 0/78
5-27
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD402 (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150°C/6.0V)
PROJECT NUMBER 98-206-2A NUMBER G748001016P PROCESS MA225S PACKAGE TYPE 68-Pin CLDCC DATE CODE 9811 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER NUMBER PACKAGE DATE PROCESS TYPE CODE MA225S 68-Pin CLDCC 9811 HOURS HOURS HOURS 1000 HOURS
98-206-2B G748001016P
0/45
0/45
0/45
0/45
TOTAL DEVICE HOURS 45,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 98-206-2C NUMBER G748001016P PROCESS MA225S PACKAGE TYPE 68-Pin CLDCC DATE CODE 9811 CYCLES 0/38 CYCLES 0/38 CYCLES 0/38 1000 CYCLES 0/38
5-28
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD402 (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 95-211-1A 98-206-1A NUMBER N511015003 G748001004P PROCESS 080DLM MA225S PACKAGE TYPE 68-Pin PLCC DATE CODE 9527 9807 HOURS 0/77 0/77 0/154 TOTAL DEVICE HOURS 154,000 HOURS 0/77 0/77 0/154 1000 HOURS 0/77 0/77 0/154
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 95-211-1B 98-206-1B NUMBER N511015003 G748001004P PROCESS 080DLM MA225S PACKAGE TYPE 68-Pin PLCC DATE CODE 9527 9807 HOURS HOURS 0/77 0/77 0/154 TOTAL DEVICE HOURS 154,000 0/77 0/77 0/154 HOURS 0/77 0/77 0/154 1000 HOURS 0/77 0/77 0/154
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 95-211-1C 98-206-1C NUMBER N511015003 G748001004P PROCESS 080DLM MA225S PACKAGE TYPE 68-Pin PLCC DATE CODE 9527 9807 CYCLES 0/78 0/52 0/130 CYCLES 0/78 0/52 0/130 1000 CYCLES 0/78 0/52 0/130
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 95-211-1D 98-206-1D NUMBER N511015003 G748001004P PROCESS 080DLM MA225S PACKAGE TYPE 68-Pin PLCC DATE CODE 9527 9807 HOURS 0/52 0/38 0/90 TOTAL DEVICE HOURS 18,864 HOURS 0/52 0/38 0/90 0/52 HOURS 0/52
5-29
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD402 (TQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 96-201-1A NUMBER N543007003 PROCESS 080DLM PACKAGE TYPE 80-Pin TQFP DATE CODE 9607 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER NUMBER PROCESS 080DLM PACKAGE DATE TYPE CODE 80-Pin TQFP 9607 HOURS HOURS HOURS 1000 HOURS
96-201-1B N543007003
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 96-201-1C NUMBER N543007003 PROCESS 080DLM PACKAGE TYPE 80-Pin TQFP DATE CODE 9607 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
5-30
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD413F (PLCC FLASH)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 96-209-1A NUMBER N613034K PROCESS CE080DLM PACKAGE TYPE 68-Pin PLCC DATE CODE 9642 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 96-209-1B NUMBER N613034K PROCESS 080DLM PACKAGE TYPE 68-Pin PLCC DATE CODE 9642 HOURS HOURS HOURS 1000 HOURS
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-0°C +100
PROJECT NUMBER 96-209-1C NUMBER N613034K PROCESS CE080DLM PACKAGE TYPE 68-Pin PLCC DATE CODE 9642 CYCLES 0/78 CYCLES 0/78
HIGHLY ACCELERATED STRESS TEST (131°C/85% R.H./5.25V)
PROJECT NUMBER 96-209-1E NUMBER N613034 PROCESS 080DLM PACKAGE TYPE 68-Pin PLCC DATE CODE 9642 HOURS 0/38
TOTAL DEVICE HOURS 1,900
5-31
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD503 (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150°C/6.0V)
PROJECT NUMBER 94-202-1A 98-213-2A NUMBER N339070003 G821005003P PROCESS CE120DLM MA225S PACKAGE TYPE 68-Pin CLDCC DATE CODE 9403 9737 HOURS 0/77 0/77 0/154 TOTAL DEVICE HOURS 154,000 HOURS 0/77 0/77 0/154 1000 HOURS 0/77 0/77 0/154
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 93-205-1B 93-205-2B 94-202-1B 95-200-1B NUMBER PROCESS PACKAGE TYPE DATE CODE 9310 9315 68-Pin CLDCC 9403 9430 9737 HOURS 0/52 0/77 0/77 0/77 0/77 0/360 TOTAL DEVICE HOURS 360,000 HOURS 0/52 0/77 0/77 0/77 0/77 0/360 HOURS 0/52 0/77 0/77 0/77 0/77 0/360 1000 HOURS 0/52 0/77 0/77 0/77 0/77 0/360
NA30800101 CE120DLM N312007005 CE120DLM N339070003 CE120DLM N417038006 CE080DLM MA225S
98-213-2B G821005003P
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 93-205-2C 94-202-1C 98-213-2C NUMBER N312007005 N339070003 G821005003P PROCESS CE120DLM CE120DLM MA225S 68-Pin CLDCC PACKAGE TYPE DATE CODE 9315 9403 9737 CYCLES 0/78 0/76 0/76 0/230 CYCLES 0/78 0/76 0/76 0/230 1000 CYCLES 0/78 0/76 0/76 0/230
5-32
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD503 (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 95-202-1A 98-213-1A NUMBER N417038007 G821005006P PROCESS CE080DLM MA225S PACKAGE TYPE 68-Pin PLCC DATE CODE 9430 9834 HOURS 0/77 0/77 0/154 TOTAL DEVICE HOURS 154,000 HOURS 0/77 0/77 0/154 1000 HOURS 0/77 0/77 0/154
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER 98-213-2B NUMBER G821005006P PROCESS MA225S PACKAGE TYPE 68-Pin PLCC DATE CODE 9834 HOURS HOURS HOURS 1000 HOURS
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 95-202-1C NUMBER N417038007 PROCESS CE080DLM PACKAGE TYPE 68-Pin PLCC DATE CODE 9430 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 95-202-1D NUMBER N417038007 PROCESS CE080DLM PACKAGE TYPE 68-Pin PLCC DATE CODE 9430 HOURS HOURS HOURS
0/22
0/22
0/22
TOTAL DEVICE HOURS 5,280
5-33
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD503 (TQFP)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 94-206-1A NUMBER N421031003 PROCESS CE120DLM PACKAGE TYPE 80-Pin TQFP DATE CODE 9435 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER NUMBER PROCESS CE120DLM PACKAGE DATE TYPE CODE 80-Pin TQFP 9435 HOURS HOURS HOURS 1000 HOURS
94-206-1B N421031003
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 94-206-1C NUMBER N421031003 PROCESS CE120DLM PACKAGE TYPE 80-Pin TQFP DATE CODE 9435 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 94-206-1D NUMBER N421031003 PROCESS 120DLM PACKAGE TYPE 80-Pin TQFP DATE CODE 9435 HOURS HOURS HOURS
0/52
0/52
0/52
TOTAL DEVICE HOURS 12,480
5-34
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD603 (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150°C/6.0V)
PROJECT NUMBER 98-203-1A NUMBER F737001003P PROCESS MA224N PACKAGE TYPE 52-Pin CLDCC DATE CODE 9751 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER NUMBER PROCESS MA224N PACKAGE TYPE 52-Pin CLDCC DATE CODE 9751 HOURS HOURS HOURS 1000 HOURS
98-203-1B F737001003P
0/45
0/45
0/45
0/45
TOTAL DEVICE HOURS 45,000
5-35
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD703 (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150°C/6.0V)
PROJECT NUMBER 97-201-1A NUMBER N630009003P PROCESS MA224N PACKAGE TYPE 52-Pin CLDCC DATE CODE 9702 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER NUMBER PROCESS MA224N PACKAGE TYPE 52-Pin CLDCC DATE CODE 9702 HOURS HOURS HOURS 1000 HOURS
97-201-1B N630009003P
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 97-201-1C NUMBER N630009003P PROCESS MA224N PACKAGE TYPE 52-Pin CLDCC DATE CODE 9702 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
5-36
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD703 (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 97-201-2A NUMBER N630009002P PROCESS MA224N PACKAGE TYPE 52-Pin PLCC DATE CODE 9702 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 154,000
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER 97-201-2B NUMBER N630009002P PROCESS MA224N PACKAGE TYPE 52-Pin PLCC DATE CODE 9702 HOURS HOURS HOURS 1000 HOURS
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 97-201-2C NUMBER N630009002P PROCESS MA224N PACKAGE TYPE 52-Pin PLCC DATE CODE 9702 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 97-201-2C NUMBER N630009002P PROCESS MA224N PACKAGE TYPE 52-Pin PLCC DATE CODE 9702 HOURS HOURS HOURS
0/52
0/52
0/52
TOTAL DEVICE HOURS 12,480
5-37
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PSD100 (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 93-216-1A NUMBER N314038001 PROCESS 120DLM PACKAGE TYPE 44-Pin CLDCC DATE CODE 9321 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 93-216-1B NUMBER PROCESS PACKAGE TYPE 44-Pin CLDCC DATE CODE 9321 HOURS HOURS HOURS 1000 HOURS
N314038001 120DLM
0/45
0/45
0/45
0/45
TOTAL DEVICE HOURS 45,000
PSD100 (CPGA)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 94-200-1A NUMBER N339009005 PROCESS CE120DLM PACKAGE TYPE 44-Pin CPGA DATE CODE 9342 HOURS HOURS
0/77
0/77
TOTAL DEVICE HOURS 38,500
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 94-200-1B NUMBER PROCESS PACKAGE TYPE 44-Pin CPGA DATE CODE 9342 HOURS HOURS HOURS 1000 HOURS
N339009005 CE120DLM
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 94-200-1C NUMBER N339009005 PROCESS CE120DLM PACKAGE TYPE 44-Pin CPGA DATE CODE 9342 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
5-38
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
PAC1000 (CPGA)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.5V)
PROJECT NUMBER 90-206-1A 90-217-1A 91-201-1A 91-212-1A 91-212-2A NUMBER 90-1109-AA 90-2401-AA 90-3842-AA 91-0639-AQ 91-1803-AA MA223 88-Pin CPGA PROCESS PACKAGE TYPE DATE CODE 9015 9027 9047 9118 9124 HOURS 0/105 0/105 0/77 0/45 0/77 0/402 HOURS 0/105 0/105 0/77 0/45 0/77 0/402 HOURS 0/105 0/105 0/77 0/45 0/77 0/402
TOTAL DEVICE HOURS 201,000
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 98-210-1A NUMBER S736001001 PROCESS MA223 PACKAGE TYPE 88-Pin CPGA DATE CODE 9827 HOURS 0/77 HOURS 0/77 1000 HOURS 0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 90-201-1B 91-212-1B NUMBER 90-3842-AA 91-0639-AQ PROCESS MA223 PACKAGE TYPE 88-Pin CPGA DATE CODE 9047 9118 HOURS 0/77 0/45 0/122 HOURS 0/77 0/45 0/122 HOURS 0/77 0/45 0/122
TOTAL DEVICE HOURS 61,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 90-201-1C 90-217-1C 91-212-1C 98-210-1C NUMBER 90-3842-AA 90-2401-AA 91-0639-AQ S736001001 MA223 88-Pin CPGA PROCESS PACKAGE TYPE DATE CODE 9047 9027 9118 9827 CYCLES 0/78 0/78 0/52 0/78 0/286 CYCLES 0/78 0/78 0/52 0/78 0/286 1000 CYCLES 0/78 0/78 0/52 0/78 0/286
SAM448 (PDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.5V)
PROJECT NUMBER 89-217-1A NUMBER 89-0611-AC PROCESS MB122 PACKAGE TYPE 28-Pin PDIP DATE CODE 8927 HOURS HOURS 1000 HOURS
0/105
0/105
0/105
TOTAL DEVICE HOURS 105,000
5-39
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
MAP168 (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 91-222-1A 91-227-1A NUMBER 91-3126-AA 91-3127-AA PROCESS MB122 PACKAGE TYPE 44-Pin PLCC DATE CODE 9134 9139 HOURS 0/77 0/77 0/154 TOTAL DEVICE HOURS 154,000 HOURS 0/77 0/77 0/154 1000 HOURS 0/77 0/77 0/154
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 91-222-1B 91-227-1B NUMBER 91-3126-AA 91-3127-AA PROCESS MB122 PACKAGE TYPE 44-Pin PLCC DATE CODE 9134 9139 HOURS 0/77 0/77 0/154 HOURS HOURS 0/77 0/77 0/154 0/77 0/77 0/154 1000 HOURS 0/77 1/77(A) 1/154
TOTAL DEVICE HOURS 154,000
NUMBER
PROJECT NUMBER 91-227-1B
READOUT
QUANTITY
MODE
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
1000 Hours
SBCL
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 91-222-1C 91-227-1C NUMBER 91-3126-AA 91-3127-AA PROCESS MB122 PACKAGE TYPE 44-Pin PLCC DATE CODE 9134 9139 CYCLES 0/78 0/78 0/156 CYCLES 0/78 0/78 0/156 1000 CYCLES 0/78 0/78 0/156
PRESSURE (121 °C/15 PSIG)
PROJECT NUMBER 91-222-1D 91-227-1D NUMBER 91-3126-AA 91-3127-AA PROCESS MB122 PACKAGE TYPE 44-Pin PLCC DATE CODE 9134 9139 HOURS 0/52 0/52 0/104 HOURS 0/52 0/52 0/104
TOTAL DEVICE HOURS 17,472
5-40
Reliability Summary 1999
PSD/System Logic Reliability Data (Cont.)
WS59032 (CPGA)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 92-201-1A NUMBER 91-1624-AC PROCESS CA112 PACKAGE TYPE 101-Pin CPGA DATE CODE 9151 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 92-201-1B NUMBER 91-1624-AC PROCESS CA112 PACKAGE TYPE 101-Pin CPGA DATE CODE 9151 HOURS HOURS HOURS 1000 HOURS
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
5-41
Introduction
Reliability Waferscale
PSD/System Logic Reliability Data Summary PROM/RPROM/EPROM Reliability Data Summary PSD/System Logic Reliability Data PROM/RPROM/EPROM Reliability Data Sales Representatives Distributors
Section Index
PROM/ RPROM/EPROM Reliability Data
WS27C128L CERDIP/Plastic (600 Mil) WS27C256L CERDIP/Plastic (600 Mil) PLCC WS27C512L CERDIP (600 Mil) PLCC WS27C512LS CERDIP (600 Mil) PLCC WS27C010L CERDIP (600 Mil) PLCC WS27C010LS CERDIP (600 Mil) PLCC WS27C210L CERDIP (600 Mil) PLCC WS27C210LS CLDCC PLCC WS57C43B CERDIP (300/600 Mil) WS57C43C CERDIP (300 Mil) PLCC WS57C45 PDIP (300 WS57C49B CERDIP (300/600 Mil) WS57C49C CERDIP/Plastic (300 Mil) PLCC WS57C51B CERDIP (300 Mil) WS57C51C CERDIP (300/600 Mil) Plastic (300 Mil) PLCC WS57C71C CERDIP (300/600 Mil) PLCC WS57C291B CERDIP (300 Mil) WS57C291C CERDIP/Plastic (300 Mil) WS57C257 CERDIP (600 Mil) WS57C64F CERDIP (600 Mil) WS57C128FB CERDIP (600 Mil) WS57C256F CERDIP (600 Mil) Plastic (600 Mil) 32-Pin CLCC/PLCC WS57C010F CERDIP (600 Mil) 32-Pin PLCC/TSOP
CMOS EPROM.6-1 CMOS EPROM.6-2
CMOS EPROM.6-3
CMOS EPROM.6-4
128K CMOS EPROM.6-6
128K CMOS EPROM.6-9
CMOS EPROM.6-13
CMOS EPROM.6-14
CMOS RPROM .6-16 CMOS RPROM .6-17
CMOS RPROM .6-19 CMOS RPROM .6-20 CMOS RPROM .6-22
CMOS RPROM .6-26 CMOS RPROM .6-27
CMOS RPROM .6-30
CMOS RPROM .6-32 CMOS RPROM .6-33 CMOS EPROM.6-35 High Speed CMOS EPROM .6-36 High Speed CMOS EPROM .6-37 High Speed CMOS EPROM .6-37
High Speed CMOS EPROM .6-41
PROM/RPROM/EPROM Reliability Data
WS27C128L (CERDIP)
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 89-308-1B NUMBER 89-2207-AB PROCESS MA123 PACKAGE TYPE 28-Pin CDIP DATE CODE 8931 HOURS 0/105 HOURS 0/105 HOURS 1/105(A)
TOTAL DEVICE HOURS 52,500 NUMBER PROJECT NUMBER 89-303-1B
READOUT
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
WS27C128L (PDIP)
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 89-211-1C NUMBER 89-1614-BA PROCESS MA123 PACKAGE TYPE 28-Pin PDIP DATE CODE 8921 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15PSI)
PROJECT NUMBER 89-211-1D NUMBER 89-1614-BA PROCESS MA123 PACKAGE TYPE 28-Pin PDIP DATE CODE 8921 HOURS 0/105 HOURS 0/105 HOURS 0/105
TOTAL DEVICE HOURS 25,200
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C256L (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150°C/6.5V)
PROJECT NUMBER 89-303-2A NUMBER 89-0602-AB PROCESS MA123 PACKAGE TYPE 28-Pin CDIP DATE CODE 8909 HOURS 0/104 HOURS 0/104 1000 HOURS 0/104
TOTAL DEVICE HOURS 104,000
DYNAMIC HIGH TEMPERATURE LIFE (150°C/6.0V)
PROJECT NUMBER 90-220-1A NUMBER 90-3112-AC PROCESS MA123 PACKAGE TYPE 28-Pin CDIP DATE CODE 9033 HOURS 0/102 HOURS 0/102 1000 HOURS 0/102
TOTAL DEVICE HOURS 102,000
WS27C256L (PLCC)
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 89-208-3A NUMBER 88-4623 PROCESS MA123 PACKAGE TYPE 32-Pin PLCC DATE CODE 8908 CYCLES 0/65 CYCLES 0/65 1000 CYCLES 0/65
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C256L (PDIP)
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 89-211-2D NUMBER 89-1810-AC PROCESS MA123 PACKAGE TYPE 28-Pin PDIP DATE CODE 8921 CYCLES 1/78(A) CYCLES 0/77 1000 CYCLES 0/77
NUMBER
PROJECT NUMBER 89-211-2D
READOUT CYCLES
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
PRESSURE (121 °C/15PSI)
PROJECT NUMBER 89-211-2C NUMBER 89-1810-AC PROCESS MA123 PACKAGE TYPE 28-Pin PDIP DATE CODE 8921 HOURS 1/105(A) HOURS 0/104 HOURS 1/104(B)
TOTAL DEVICE HOURS 25,056 NUMBER PROJECT NUMBER 89-211-2C 89-211-2C
READOUT
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
WS27C512L (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.5V)
PROJECT NUMBER 89-305-2A 89-306-2A NUMBER 89-1615-AA 89-1416-AB PROCESS MA123 PACKAGE TYPE 28-Pin CDIP DATE CODE 8918 8921 (686 YRS) 0/93 0/100 0/193 (2,042 YRS) 0/93 0/100 0/193 1000 (4,084 YRS) 0/93 0/100 0/193
TOTAL DEVICE HOURS 193,000
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C512L (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 90-231-1A NUMBER 90-3263-AA PROCESS MA123 PACKAGE TYPE 32-Pin PLCC DATE CODE 9038 HOURS 0/110 HOURS 0/110
TOTAL DEVICE HOURS 55,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 90-231-1B NUMBER 90-3263-AA PROCESS MA123 PACKAGE TYPE 32-Pin PLCC DATE CODE 9038 HOURS HOURS HOURS
0/104
0/104
0/104
TOTAL DEVICE HOURS 52,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 89-216-1D 90-231-1C NUMBER 89-4113-AA 90-3263-AA PROCESS MA123 PACKAGE TYPE 32-Pin PLCC DATE CODE 8943 9038 CYCLES 0/50 0/78 0/128 CYCLES 0/50 0/78 0/128 1000 CYCLES 0/50 0/78 0/128
WS27C512LS (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 91-205-1A NUMBER 91-0819-AA PROCESS CE120B PACKAGE TYPE 28-Pin CDIP DATE CODE 9110 HOURS 0/67 HOURS 0/67
TOTAL DEVICE HOURS 33,500
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 91-205-1B NUMBER 91-0819-AA PROCESS CE120B PACKAGE TYPE 28-Pin CDIP DATE CODE 9110 HOURS 0/77 HOURS 0/77 HOURS 0/77 1000 HOURS 0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 91-205-1C NUMBER 91-0819-AA PROCESS CE120B PACKAGE TYPE 28-Pin CDIP DATE CODE 9110 CYCLES 0/77 CYCLES 0/77 1000 CYCLES 0/77
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C512LS (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 91-211-1A NUMBER 91-1314-AB PROCESS CE120B PACKAGE TYPE 32-Pin PLCC DATE CODE 9120 HOURS 0/69 HOURS 0/69 1000 HOURS 0/69
TOTAL DEVICE HOURS 69,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 91-211-1B NUMBER 91-1314-AB PROCESS CE120B PACKAGE TYPE 32-Pin PLCC DATE CODE 9120 HOURS 0/77 HOURS 0/77 HOURS 1000 HOURS 0/77 0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 91-211-1C NUMBER 91-1314-AB PROCESS CE120B PACKAGE TYPE 32-Pin PLCC DATE CODE 9120 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121 °C/15PSI)
PROJECT NUMBER 91-211-1D NUMBER 91-1314-AB PROCESS CE120B PACKAGE TYPE 32-Pin PLCC DATE CODE 9120 HOURS 0/52 HOURS 0/52 HOURS 1/52
TOTAL DEVICE HOURS 12,480
NUMBER
PROJECT NUMBER 91-211-1D
READOUT Hours
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C010L (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/5.5V)
PROJECT NUMBER 89-209-1A 89-311-1A NUMBER 89-0812-AA MA123 89-4130-AA PROCESS PACKAGE TYPE 32-Pin CDIP DATE CODE 8916 8944 HOURS 0/52 0/105 0/157 HOURS 0/52 0/105 0/157 HOURS 1000 HOURS 0/52 0/105 0/157 0/52 0/105 0/157
TOTAL DEVICE HOURS 157,000
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.5V)
PROJECT NUMBER 89-209-1C 89-210-1A 89-214-1A 90-300-1A NUMBER 89-0812-AA 89-1214-AB 89-2501-AA 89-5117-AA MA123 32-Pin CDIP PROCESS PACKAGE TYPE DATE CODE 8916 8916 8927 9003 HOURS 0/52 0/104 0/105 0/105 0/366 HOURS 0/52 0/104 0/105 0/105 0/366 HOURS 1000 HOURS 0/52 0/104 1/105(A) 1/105(C) 2/366 0/52 0/104 1/104(B) 0/104 1/364
TOTAL DEVICE HOURS 365,000
NUMBER
PROJECT NUMBER 89-214-1A 89-214-1A 90-300-1A
READOUT Hours 1000 Hours Hours
QUANTITY
MODE SBCL SBCL ICC_STB
MECHANISM Trap Assistant Overcurrent
CAUSE Intrinsic Charge Loss Oxide Defect
HIGH TEMPERATURE STORAGE LIFE (150
PROJECT NUMBER 89-209-1B NUMBER 89-0812-AA PROCESS MA123 PACKAGE TYPE 32-Pin CDIP DATE CODE 8916 HOURS 0/52 HOURS 0/52 HOURS 1000 HOURS 0/52 0/52
TOTAL DEVICE HOURS 52,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 90-300-1B NUMBER 89-5117-AA PROCESS MA123 PACKAGE TYPE 32-Pin CDIP DATE CODE 9003 HOURS 0/105 HOURS 0/105
TOTAL DEVICE HOURS 17,640
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C010L (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.5V)
PROJECT NUMBER 90-210-1A NUMBER 89-5202-AA PROCESS MA123 PACKAGE TYPE 32-Pin PLCC DATE CODE 9002 HOURS 0/105 HOURS 0/105 1000 HOURS 2/105(A)
TOTAL DEVICE HOURS 105,000 NUMBER PROJECT NUMBER 90-210-1A
READOUT 1000 Hours
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 90-210-1B NUMBER 89-5202-AA PROCESS MA123 PACKAGE TYPE 32-Pin PLCC DATE CODE 9002 HOURS 0/105 HOURS 0/105 HOURS 1000 HOURS 0/105 1/105(A)
TOTAL DEVICE HOURS 105,000 NUMBER PROJECT NUMBER 90-210-1B
READOUT 1000 Hours
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C010L (PLCC) (cont.) TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 89-208-1A 89-208-2A 90-210-1C NUMBER 89-1209-AA 89-1210-AB 89-5202-AA MA123 32-Pin PLCC PROCESS PACKAGE TYPE DATE CODE 8916 8916 9002 CYCLES 0/65 1/65(A) 0/78 1/208 CYCLES 0/65 0/64 1/78(B) 1/207 1000 CYCLES 0/65 0/64 0/77 0/206
NUMBER
PROJECT NUMBER 89-208-2A 89-210-1C
READOUT Cycles Cycles
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
PRESSURE (121 °C/15PSI)
PROJECT NUMBER 89-208-1B 89-208-2B 90-210-1D NUMBER 89-1209-AA 89-1210-AB 89-5202-AA MA123 32-Pin PLCC PROCESS PACKAGE TYPE DATE CODE 8916 8916 9002 HOURS 0/65 0/65 0/52 0/182
TOTAL DEVICE HOURS 17,472
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C010LS (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.5V)
PROJECT NUMBER 90-200-1A NUMBER 89-5121-AA PROCESS CE120B PACKAGE TYPE 32-Pin CDIP DATE CODE 9005 HOURS HOURS 1000 HOURS
0/63
0/63
0/63
TOTAL DEVICE HOURS 63,000
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 92-228-2A NUMBER NA24900404 PROCESS CE120DLM PACKAGE TYPE 32-Pin CDIP DATE CODE 9250 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/5.5V)
PROJECT NUMBER NUMBER 4999 5200 10200 CE120B 32-Pin CDIP PROCESS PACKAGE TYPE DATE CODE 9031 9031 9031 HOURS 0/77 0/77 0/77 0/231 HOURS 0/77 0/77 0/77 0/231 1000 HOURS 0/77 0/77 0/77 0/231
TOTAL DEVICE HOURS 231,000
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C010LS (CERDIP) (cont.) HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER NUMBER PROCESS 120B PACKAGE TYPE 32-Pin CDIP DATE CODE 9005 9250 HOURS HOURS HOURS 1000 HOURS
90-200-1B 89-5121-AA
0/105 0/77 0/182
0/105 0/77 0/182
1/105(A) 0/77 1/182 0/77 0/77
92-228-2B NA24900404 120DLM TOTAL DEVICE HOURS 129,500
NUMBER
PROJECT NUMBER 90-200-1B
READOUT Hours
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Losst
HIGH TEMPERATURE STORAGE LIFE (250
PROJECT NUMBER NUMBER 4999 5200 10200 CE120B PROCESS PACKAGE TYPE 32-Pin CDIP DATE CODE 9031 9031 9031 HOURS 0/77 0/77 0/77 0/231 HOURS 0/77 0/77 0/77 0/231
TOTAL DEVICE HOURS 38,808
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 90-200-1C 92-228-2C NUMBER 89-5121-AA NA24900404 4999 5200 10200 PROCESS CE120B CE120DLM CE120B CE120B CE120B 32-Pin CDIP PACKAGE TYPE DATE CODE 9005 9250 9031 9031 9031 CYCLES 0/78 0/78 0/77 0/77 0/77 0/387 CYCLES 0/78 0/78 0/77 0/77 0/77 0/387 1000 CYCLES 0/78 0/78 0/77 0/77 0/77 0/387
6-10
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C010LS (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 91-203-1A 91-203-2A 91-203-3A 91-203-4A 92-228-1A NUMBER 90-4701-AA-3 90-4701-AA-3 90-4701-AA-2 90-4701-AA NA24900403 PROCESS 120B 120B 120B 120B 120DLM 32-Pin PLCC PACKAGE TYPE DATE CODE 9102 9102 9102 9102 9250 HOURS 0/76 0/76 0/76 0/77 0/77 0/382 HOURS 0/76 0/76 0/76 0/77 0/77 0/382 1000 HOURS 0/76 0/76 0/76 0/77 0/77 0/382
TOTAL DEVICE HOURS 382,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 91-203-1B 91-203-2B 91-203-3B 91-203-4B 92-228-1B NUMBER 90-4701-AA-3 90-4701-AA-3 90-4701-AA-2 90-4701-AA PROCESS 120B 120B 120B 120B 32-Pin PLCC PACKAGE TYPE DATE CODE 9102 9102 9102 9102 9250 HOURS 0/77 0/77 0/77 0/77 0/77 0/385 TOTAL DEVICE HOURS 385,000 HOURS 0/77 0/77 0/77 0/77 0/77 0/385 HOURS 1000 HOURS 0/77 0/77 0/77 0/77 0/77 0/385 0/77 0/77 0/77 0/77 0/77 0/385
NA24900403 120DLM
6-11
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C010LS (PLCC) (Cont.) TEMPERATURE CYCLE (AIR AIR) (-65
PROJECT NUMBER 91-203-1C 91-203-2C 91-203-3C 91-203-4C 92-228-1C NUMBER 90-4701-AA-3 90-4701-AA-3 90-4701-AA-2 90-4701-AA NA24900403 PROCESS 120B 120B 120B 120B 120DLM 32-Pin PLCC PACKAGE TYPE DATE CODE 9102 9102 9102 9102 9250 CYCLES 0/52 0/78 0/78 0/52 0/78 0/338 CYCLES 0/52 0/78 0/78 0/52 0/78 0/338 1000 CYCLES 0/52 0/78 0/78 0/52 0/78 0/338
PRESSURE (121 °C/15 PSI)
PROJECT NUMBER 91-203-1D 91-203-2D 91-203-3D 91-203-4D 92-228-1D NUMBER 90-4701-AA-3 90-4701-AA-3 90-4701-AA-2 90-4701-AA NA24900403 PROCESS 120B 120B 120B 120B 120DLM 32-Pin PLCC PACKAGE TYPE DATE CODE 9102 9102 9102 9102 9250 HOURS 0/52 0/52 0/52 0/21 0/52 0/229 HOURS 0/52 0/52 0/52 0/21 0/52 0/229 HOURS 0/52 0/52 0/52 0/21 0/52 0/229
TOTAL DEVICE HOURS 54,960
6-12
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C210L (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.5V)
PROJECT NUMBER 90-301-1A NUMBER 89-4913-AB PROCESS MA123 PACKAGE TYPE 40-Pin CDIP DATE CODE 9016 HOURS HOURS 0/104 0/104 HOURS 0/104 1000 HOURS 2/104(A)(B)
TOTAL DEVICE HOURS 104,000 NUMBER PROJECT NUMBER 90-301-1A 90-301-1A
READOUT 1000 Hours 1000 Hours
QUANTITY
MODE SBCL Line Short
MECHANISM
CAUSE
Trap Assistant Intrinsic Charge Loss Short Defect
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 90-301-1B NUMBER 89-4913-AB PROCESS MA123 PACKAGE TYPE 40-Pin CDIP DATE CODE 9016 HOURS 0/105 HOURS 0/105 HOURS 3/105(A) 1000 HOURS 1/102(B)
TOTAL DEVICE HOURS 103,500 NUMBER PROJECT NUMBER 90-301-1B 90-301-1B READOUT Hours 1000 Hours QUANTITY MODE MECHANISM CAUSE
SBCL
Trap Assistant
Intrinsic Charge Loss
WS27C210L (PLCC)
HIGH TEMPERATURE STORAGE LIFE (150
PROJECT NUMBER 90-204-1E NUMBER 90-1302-AA PROCESS MA123 PACKAGE TYPE 44-Pin PLCC DATE CODE 9016 HOURS 0/105 HOURS 0/105
TOTAL DEVICE HOURS 17,640
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 89-215-1C 90-202-1D NUMBER 89-3410-AB 89-4976-AA PROCESS MA123 PACKAGE TYPE 44-Pin PLCC DATE CODE 8935 9005 CYCLES 0/50 0/78 0/128 CYCLES 0/50 0/78 0/128 1000 CYCLES 0/50 0/78 0/128
6-13
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C210LS (CLDCC)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 92-218-1A NUMBER NA21206201 PROCESS CE120B PACKAGE TYPE 44-Pin CLDCC DATE CODE 9224 HOURS HOURS 1000 HOURS
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER NUMBER PROCESS CE120B PACKAGE TYPE 44-Pin CLDCC DATE CODE 9224 HOURS 0/77 HOURS 0/77 HOURS 0/77 1000 HOURS 0/77
92-218-1B NA21206201
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 92-218-1C NUMBER NA21206201 PROCESS CE120B PACKAGE TYPE 44-Pin CLDCC DATE CODE 9224 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
6-14
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS27C210LS (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 91-215-1A NUMBER 91-2601-AA PROCESS 120B PACKAGE TYPE 44-Pin PLCC DATE CODE 9128 HOURS 0/52 HOURS 0/52 1000 HOURS 0/52
TOTAL DEVICE HOURS 52,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 91-215-1B NUMBER 91-2601-AA PROCESS 120B PACKAGE TYPE 44-Pin PLCC DATE CODE 9128 HOURS 0/52 HOURS HOURS 0/52 0/52 1000 HOURS 0/52
TOTAL DEVICE HOURS 52,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 91-215-1C NUMBER 91-2601-AA PROCESS 120B PACKAGE TYPE 44-Pin PLCC DATE CODE 9128 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121 °C/15 PSI)
PROJECT
NUMBER 91-215-1D NUMBER 91-2601-AA PROCESS 120B PACKAGE TYPE 44-Pin PLCC DATE CODE 9128
HOURS
0/52
TOTAL DEVICE HOURS 4,992
6-15
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS57C43B (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.5V)
PROJECT NUMBER 89-308-2A NUMBER 89-2205-AA PROCESS MB122 PACKAGE TYPE 24-Pin CDIP 24-Pin CDIP 24-Pin CDIP DATE CODE 8929 HOURS 0/104 HOURS HOURS 0/104 0/104 1000 HOURS 0/104
89-312-2A
89-4033-AB
MB122
8946
0/105
0/105
0/105
0/105
90-301-2A
89-4988-AB
MB122
9007
0/103 0/312
0/103 0/312
0/103 0/312
0/103 0/312
TOTAL DEVICE HOURS 312,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 90-301-2B NUMBER 89-4988-AB PROCESS MB122 PACKAGE TYPE 24-Pin CDIP DATE CODE 9007 HOURS HOURS HOURS 1000 HOURS
0/105
0/105
1/105(A)
1/104(B)
TOTAL DEVICE HOURS 104,500
NUMBER
PROJECT NUMBER 90-301-2B 90-301-2B
READOUT Hours 1000 Hours
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
6-16
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS57C43C (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 92-304-1A NUMBER NA22600618 PROCESS 120B PACKAGE TYPE 24-Pin CDIP 24-Pin CDIP DATE CODE 9229 HOURS 0/76 HOURS 0/76 1000 HOURS 0/76
96-301-1A
N546013006
120B
9604
0/77 0/153
0/77 0/153
0/77 0/153
TOTAL DEVICE HOURS 153,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER NUMBER PROCESS 120B PACKAGE TYPE 24-Pin CDIP 24-Pin CDIP DATE CODE 9136 HOURS HOURS HOURS 1000 HOURS
92-304-1B NA22600618
0/77
0/77
0/77
0/77
96-301-1B N546013006
120B
9604
0/77 0/154
0/77 0/154
0/77 0/154
0/77 0/154
TOTAL DEVICE HOURS 154,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 92-304-1C 96-301-1C NUMBER NA22600618 N546013006 PROCESS 120B 120B PACKAGE TYPE 24-Pin CDIP 24-Pin CDIP DATE CODE 9136 9604 CYCLES 0/78 0/78 0/156 CYCLES 0/78 0/78 0/156 1000 CYCLES 0/78 0/78 0/156
6-17
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS57C43C (PLCC)
DYNAMIC HIGH TEMPERATURE LIFE (125°C/6.0V)
PROJECT NUMBER 92-307-1A NUMBER NA22800822 PROCESS 120B PACKAGE TYPE 28-Pin PLCC DATE CODE 9238 HOURS 1/75(A) HOURS 0/74 1000 HOURS 0/74
TOTAL DEVICE HOURS 74,168
NUMBER
PROJECT NUMBER 92-307-1A
READOUT
QUANTITY
MODE
MECHANISM Oxide Breakdown
CAUSE
Hours
Short
Oxide Defect
HIGH TEMPERATURE STORAGE LIFE (140°C)
PROJECT NUMBER NUMBER PROCESS 120B PACKAGE TYPE 28-Pin PLCC DATE CODE 9238 HOURS HOURS HOURS 1000 HOURS
92-307-1B NA22800822
0/77
0/77
0/77
0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 92-307-1C NUMBER NA22800822 PROCESS 120B PACKAGE TYPE 28-Pin PLCC DATE CODE 9238 CYCLES 0/78 CYCLES 0/78 1000 CYCLES 0/78
PRESSURE (121°C/15 PSIG)
PROJECT NUMBER 92-307-1D NUMBER NA22800822 PROCESS 120B PACKAGE TYPE 28-Pin PLCC DATE CODE 9238 HOURS 0/52 HOURS 0/52 HOURS 0/52
TOTAL DEVICE HOURS 12,480
TEMPERATURE HUMIDITY BIAS (85°C R.H. /5.25V)
PROJECT NUMBER NUMBER PROCESS 120B PACKAGE TYPE 28-Pin PLCC DATE CODE 9238 HOURS HOURS HOURS 1000 HOURS
92-307-1F NA22800822
0/52
0/52
0/52
0/52
TOTAL DEVICE HOURS 52,000
6-18
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS57C45 (PDIP)
DYNAMIC HIGH TEMPERATURE LIFE (125 °C/6.0V)
PROJECT NUMBER 91-214-1A 91-214-2A NUMBER 91-1717-BA 91-1722-AA PROCESS MB122 PACKAGE TYPE 24-Pin PDIP DATE CODE 9124 9122 HOURS 0/77 0/77 0/154 HOURS 0/77 0/77 0/154 1000 HOURS 0/77 0/77 0/154
TOTAL DEVICE HOURS 154,000
HIGH TEMPERATURE STORAGE LIFE (140
PROJECT NUMBER 91-214-1B NUMBER 91-1717-BA PROCESS MB122 PACKAGE TYPE 24-Pin PDIP DATE CODE 9124 HOURS 0/77 HOURS HOURS 0/77 0/77 1000 HOURS 0/77
TOTAL DEVICE HOURS 77,000
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 91-214-1C 91-214-2C NUMBER 91-1717-BA 91-1717-BA PROCESS MB122 PACKAGE TYPE 24-Pin PDIP DATE CODE 9124 9122 CYCLES 0/78 0/78 0/156 CYCLES 0/78 0/78 0/156 1000 CYCLES 0/78 0/78 0/156
PRESSURE (121 °C/15 PSI)
PROJECT NUMBER 91-214-1D 91-214-2D NUMBER 91-1717-BA 91-1717-BA PROCESS MB122 PACKAGE TYPE 24-Pin PDIP DATE CODE 9124 9122 HOURS 0/52 0/52 0/104 HOURS 0/52 0/52 0/104 HOURS 0/52 0/52 0/104
TOTAL DEVICE HOURS 24,960
6-19
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS57C49B (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.5V)
PROJECT NUMBER 89-301-2A NUMBER 88-3223-AA PROCESS MB122 PACKAGE TYPE 24-Pin CDIP 24-Pin CDIP DATE CODE 8842 HOURS 0/105 HOURS HOURS 0/105 0/105 1000 HOURS 0/105
89-311-2A
89-4414-AA
MB122
8951
0/102 0/207
0/102 0/207
1/102(A) 1/207
0/101 0/206
TOTAL DEVICE HOURS 206,500 NUMBER PROJECT NUMBER 89-311-2A
READOUT Hours
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 90-239-1A 90-242-1A 90-243-1A NUMBER 90-2911-E2 90-2911-E5 90-2911-E6 MB122 24-Pin CDIP 9043 PROCESS PACKAGE TYPE DATE CODE HOURS 0/52 0/53 0/53 0/158 HOURS 0/52 0/53 0/53 0/158 1000 HOURS 0/52 0/53 0/53 0/158
TOTAL DEVICE HOURS 158,000
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 90-238-1B 90-240-1B 90-241-1B 90-242-1B 90-243-1B NUMBER 90-2911-E1 90-2911-E3 90-2911-E4 90-2911-E5 90-2911-E6 MB122 24-Pin CDIP 9043 PROCESS PACKAGE TYPE DATE CODE HOURS 0/52 0/52 0/53 0/53 0/53 0/263 HOURS 0/52 0/52 0/53 0/53 0/53 0/263 HOURS 0/52 0/52 0/53 0/53 0/53 0/263 1000 HOURS 0/52 1/52(A) 1/53(B) 0/53 0/53 2/263
TOTAL DEVICE HOURS 263,000 NUMBER PROJECT NUMBER 90-240-1B 90-241-1B
READOUT 1000 Hours 1000 Hours
QUANTITY
MODE SBCL
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
6-20
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS57C49B (CERDIP) (Cont.)
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 90-238-1C 90-239-1C 90-241-1C 90-242-1C 90-243-1C NUMBER 90-2911-E1 90-2911-E2 90-2911-E4 90-2911-E5 90-2911-E6 MB122 24-Pin CDIP 9043 PROCESS PACKAGE TYPE DATE CODE CYCLES 0/52 0/52 0/52 0/52 0/52 0/260 CYCLES 0/52 0/52 0/52 0/52 0/52 0/260 1000 CYCLES 0/52 0/52 1/52(A) 0/52 0/52 1/260
NUMBER
PROJECT NUMBER 90-241-1C
READOUT
QUANTITY
MODE
MECHANISM Trap Assistant
CAUSE Intrinsic Charge Loss
1000 Cycles
SBCL
6-21
Reliability Summary 1999
PROM/RPROM/EPROM Reliability Data (Cont.)
WS57C49C (CERDIP)
DYNAMIC HIGH TEMPERATURE LIFE (150 °C/6.0V)
PROJECT NUMBER 91-224-1A 92-216-1A 96-207-1A 97-205-1A 98-205-1A 98-205-2A NUMBER 91-3306-AA NA21802502 S611017008 S732001003 S743101001 S743100004 PROCESS 120B 120B MA123 MA123 MA123 MA123 24-Pin CDIP PACKAGE TYPE DATE CODE 9136 9220 9630 9734 9806 9806 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/462 TOTAL DEVICE HOURS 462,000 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/462 1000 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/462
HIGH TEMPERATURE STORAGE LIFE (225
PROJECT NUMBER 91-224-1B 92-216-1B 96-207-1B NUMBER 91-3306-AA NA21802502 S611017008 PACKAGE PROCESS TYPE 120B 120B MA123 MA123 MA123 MA123 24-Pin CDIP DATE CODE 9136 9220 9630 9734 9806 9806 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/462 TOTAL DEVICE HOURS 397,936 HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/462 0/77 0/77 0/385 0/77 0/77 0/385 HOURS 0/77 0/77 0/77 1000 HOURS 0/77 0/77 0/77
97-205-1B S732001003 98-205-1B S743101001 98-205-2B S743100004
TEMPERATURE CYCLE (AIR AIR) (-65 +150
PROJECT NUMBER 91-224-1C 92-216-1C 96-207-1C 97-205-1C 98-205-1C 98-205-2C NUMBER 91-3306-AA NA21802502 S611017008 S732001003 S743101001 S743100004 PROCESS 120B 120B MA123 MA123 MA123 MA123 24-Pin CDIP PACKAGE TYPE DATE CODE 9136 9220 9630 9734 9806 9806 CYCLES 0/78 0/78 0/78 0/78 0/78 0/78 0/468 CYCLES 0/78 0/78 0/78 0/78 0/78 0/78
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