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September 1998 Subject: Critical Process Change Notification


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WSI-1022
September 1998
Subject:
Critical Process Change Notification High Speed Memory (35ns slower only)
WS57C128, WS57C191, WS57C291, WS57C43, WS57C49, WS57C51 This change effects speeds 35ns slower only (-35, -45, -55, -90)
Device Types:
versions effected this change
Overview
order take advantage more modern manufacturing equipment thus increase production capabilities, process converting High Speed Memory devices listed above from wafer wafer fabrication. Since both wafer lines located same fabrication facility identical wafer masks used, change considered very minor.
Details
identical physical mask sets have been used produce wafers. Therefore, design, layout, placement size also identical existing versions these parts. Assembly process packaging materials unchanged. wafer sort final test flows unchanged. basic fabrication process same, with minor exception:
thickness material used dielectric between poly metal, BPSG, changed from 9000 angstroms 7500 angstroms flow. equipment even more importantly, chemical makeup BPSG itself remains same; only deposition thickness changed.
line been qualified WSI, reliability issues were uncovered.
Part Number Change
considers these changes such benign nature that there will part number revision these products. However, complete traceability insured bottom side marking WSI.
Production Plans
plans begin production shipments wafer material customers over next several months:
Device WS57C128 WS57C191, WS57C291, WS57C51 WS57C43, WS57C49 Package Engineering Samples October, 1998 November, 1998 October, 1998 Production Shipments January, 1999 January, 1999 November, 1998
Additional Information Comments
require additional information, qualification samples have concerns issues, have question, please contact your local sales representative send e-mail info@wsipsd.com.
Thank your continued support.

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