Multilayer High-Speed Surface Mount Voltage Suppressor Multilayer

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Multilayer High-Speed Surface Mount Voltage Suppressor Multilayer

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Multilayer High-Speed Series
Multilayer High-Speed Surface Mount Voltage Suppressor
Multilayer High-Speed Series very-low capacitance extension Littelfuse family Transient Voltage Surge Suppression devices available 0402-size surface mount chip. series provides protection from highspeed data-line other high frequency applications. insertion capacitance high speed Series permits usage high-speed analog digital circuits where will attenuate distort desired signal data. Their small size ideal high-density printed circuit boards, being typically applied protect integrated circuits other sensitive components. They particularly suited suppressing events including those specified 61000-4-2 other standards used ElectroMagnetic Compliance (EMC) testing. series manufactured from semiconducting ceramics, inherently bi-directional stable over wide temperature range supplied leadless, surface mount form compatible with modern reflow wave soldering processes. Littelfuse Inc. manufactures other Multilayer Varistor Series products, MLE, AUML series data sheets.
Features
12pF Capacitance Versions Suitable High Speed Data-Rate Lines Rated 61000-4-2 (Level EFT/B Rated 61000-4-4 (Level Leakage Currents Operating Temperature Range Inherently Bi-directional
Applications
Data, Diagnostic Ports Universal Serial (USB) Video Audio Ports Portable/Hand-Held Products Mobile Communications/Cellular Phones Computer/DSP Products Industrial Instruments Including Medical
Absolute Maximum Ratings
Series UNITS Continuous: Steady State Applied Voltage: Voltage Range (VM(DC)): V0402MHS03 V0402MHS12. Operating Ambient Temperature range (TA). +125 Storage Temperature (TSTG). +150 Rating (per 61000-4-2). 15kV Contact
Device Ratings Specifications
RATINGS MAXIMUM REPETITIVE SURGE ENERGY (10/1000µs) W(J) PERFORMANCE SPECIFICATIONS MAXIMUM CLAMP VOLTAGE (NOTE (NOTE CONTACT Clamp (NOTE 15kV Clamp MAXIMUM LEAKAGE CURRENT SPECIFIED VOLTAGE 3.5V (µA) 5.5V (µA) (µA) (µA) INDUCTANCE CAPACITANCE (from Impedance 1MHz p-p) Analysis) (NOTE (pF, Typ) (nH, Typ)
PART NUMBER
V0402MHS03 V0402MHS12
0.010 0.025
0.15 0.15
0.25
<1.0 <1.0
NOTES: 1.Tested IEC61000-4-2 Human Body Model (HBM) discharge test circuit. Direct discharge device terminals (IEC preferred test method).
Corona discharge through (represents actual event) Capacitance customized, contact your Littelfuse Sales Representative.
Multilayer Hi-Speed Series
Temperature De-rating
applications exceeding ambient temperature, peak surge current energy ratings must reduced shown Figure
NOMINAL VOLTAGE 1mADC
PERCENT RATED VALUE
V0402MHS03
AMBIENT TEMPERATURE
V0402MHS12
1000 10000 NUMBER CONTACT DISCHARGES
FIGURE PEAK CURRENT ENERGY DERATING CURVE
FIGURE NOMINAL VOLTAGE STABILITY MULTIPLE IMPULSES (8KV CONTACT DISCHARGES 61000-4-2)
VARISTOR VOLTAGE
Insertion Loss (dB)
V0402MHS12
V0402MHS03
0.0001
0.001
0.01
1000 10000 Frequency (MHz)
CURRENT (mA)
FIGURE STANDBY CURRENT NORMALIZED VARISTOR VOLTAGE TEMPERATURE
FIGURE INSERTION LOSS (S21) CHARACTERISTICS
Multilayer Hi-Speed Series
Soldering Recommendations
principal techniques used soldering components surface mount technology infrared (IR) re-flow, vapour phase re-flow wave soldering. Typical profiles shown figures When wave soldering, suppressor attached circuit board means adhesive. assembly then placed conv eyor through soldering process contact wave. With vapour phase re-flow, device placed solder paste substrate. solder paste heated, re-flows solders unit board. recommended solder suppressor 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) 63/37 (Sn/Pb). Littelfuse also recommends solder flux. Wave soldering most strenuous processes. avoid possibility generating stresses thermal shock, preheat stage soldering process recommended, peak temperature solder process should rigidly controlled. 0402-size devices, re-flow recommended. When using re-flow process, care should taken ensure that subjected thermal gradient steeper than degrees second; ideal gradient being degrees second. During soldering process, preheating within degrees solder's peak temperature essential minimize thermal shock. Examples soldering conditions suppressor given tables below. Once soldering process been completed, still necessary ensure that further thermal shocks avoided. possible cause thermal shock printed circuit boards being removed from solder process subjected cleaning solvents room temperature. boards must allowed cool gradually less than before cleaning.
MAXIMUM WAVE
SECOND PREHEAT
FIRST PREHEAT
TIME (MINUTES)
FIGURE SOLDER PROFILE
MAXIMUM TEMPERATURE RAMP RATE
SECONDS ABOVE
PREHEAT ZONE
TIME (MINUTES)
FIGURE VAPOR PHASE SOLDER PROFILE
Recommended Outline
MAXIMUM TEMPERATURE
SECONDS
RAMP RATE
ABOVE
PREHEAT DWELL
PREHEAT ZONE
TIME (MINUTES)
TABLE LAYOUT DIMENSIONS DIMENSION millImeters 2.54 1.22 0.76 Inches 0.100 0.048 0.030
FIGURE REFLOW SOLDER PROFILE
Multilayer Hi-Speed Series
Ordering Information
Multilayer Hi-Speed Series DEVICE FAMILY Littelfuse TVSS Device DEVICE SIZE i.e. 40Mil 20Mil (1.0mm 0.5mm) SERIES DESIGNATOR Multilayer Hi-Speed 0402 PACKING OPTIONS (178mm) Diameter Reel TERMINATION Ag/Pd (Standard) CAPACITANCE DESIGNATION 12pF
Explanation Terms
Rated Voltage M(DC)
This maximum continuous voltage which applied maximum operating temperature device. rated operating voltage (working voltage) also used reference point leakage current. This voltage always less than breakdown voltage device.
Mechanical Dimensions
Leakage Specified Voltage
non-conducting mode, device very high impedance (>106) appears essentially open circuit system. leakage current drawn this level very low. device ratings.
Nominal Voltage N(DC))
This voltage which device changes from state state enters conduction mode operation. voltage usually characterized point specified minimum maximum voltage listed.
DIMENSION
DEVICE DIMENSIONS 0402 SIZE Inch
0.024 0.010 0.006 0.039 0.004 0.020 0.004 0.25 0.15
Clamping Voltage
This voltage appearing across suppressor when measured conditions specified pulse current specified eform. Device Ratings.
Capacitance
This capacitance device specified frequency (1MHz) bias (1Vp-p). Device Ratings.
Standard Shipping Quantities
INCH REEL ("H" OPTION) 10,000
61000-4-2
electrostatic discharge electromagnetic compatibility International Electrotechnical describes specific human methods.
requirements portion (EMC) standard written Commission. specification body model test conditions
Multilayer Hi-Speed Series
Tape Reel Specifications
Conforms EIA-481-1, Revision supplied publication 286-3 DESCRIPTION Width Cavity Length Cavity Depth Cavity Width Tape Distance Between Drive Hole Centers Cavity Centers Distance Between Drive Hole Centers Tape Edge Distance Between Cavity Center Axial Drive Distance Between Drive Hole Centers Cavity Centers Axial Drive Distance Between Drive Hole Centers Drive Hole Diameter Nominal Paper Thickness Bottom Tape Thickness DIMENSIONS MILLIMETERS 0.62 0.03 1.12 0.03 0.50 ±0.03 0.05 1.75 0.05 1.55 0.05 0.61 0.10 Max.
SYMBOL
Littelfuse products manufactured, assembled tested under ISO9000 quality systems certification.
Littelfuse products sold description only. Littelfuse reserves right make changes specification time without notice. Accordingly, reader cautioned verify that data sheets current before placing orders. Information furnished Littelfuse believed accurate reliable. However responsibility assumed Littelfuse subsidiaries use, infringements patents patent rights third parties which result from use. license granted implication otherwise under patent patent rights Littelfuse Inc. subsidiaries.

Multilayer High-Speed Surface Mount Voltage Suppressor Multilayer

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