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FLASH MEMORY 8/1M FEATURES Single read, program erase M
Top Searches for this datasheetDS05-20846-4E FLASH MEMORY 8/1M FEATURES Single read, program erase Minimizes system level power requirements Compatible with JEDEC-standard commands Uses same software commands E2PROMs Compatible with JEDEC-standard world-wide pinouts 48-pin TSOP (Package suffix: PFTN-Normal Bend Type, PFTR-Reversed Bend Type) 46-pin (Package suffix: 48-pin CSOP (Package suffix: PCV) 48-ball FBGA (Package suffix: PBT) Minimum 100,000 program/erase cycles High performance maximum access time Sector erase architecture word, words, word, thirty-one words sectors word mode byte, bytes, byte, thirty-one bytes sectors byte mode combination sectors concurrently erased. Also supports full chip erase Boot Code Sector Architecture sector Bottom sector Embedded EraseAlgorithms Automatically pre-programs erases chip sector Embedded programAlgorithms Automatically programs verifies data specified address Data Polling Toggle feature detection program erase cycle completion Ready/Busy output (RY/BY) Hardware method detection program erase cycle completion Automatic sleep mode When addresses remain stable, automatically switches themselves power mode write inhibit (Continued) Embedded Eraseand Embedded Programare trademarks Advanced Micro Devices, Inc. (Continued) Erase Suspend/Resume Suspends erase operation allow read data and/or program another sector within same device Sector protection Hardware method disables combination sectors from program erase operations Sector Protection function Extended sector Protect command Temporary sector unprotection Temporary sector unprotection RESET accordance with (Common Flash Memory Interface) PACKAGE 48-pin plastic TSOP Marking Side 46-pin plastic Marking Side (FPT-48P-M19) (FPT-48P-M20) (LCC-46P-M02) 48-pin plastic CSOP 48-pin plastic FBGA (LCC-48P-M03) (BGA-48P-M03) (BGA-48P-M13) GENERAL DESCRIPTION MBM29LV160T/B 16M-bit, V-only Flash memory organized bytes bits each words bits each. MBM29LV160T/B offered 48-pin TSOP (I), 46-pin SON, 48-pin CSOP 48-ball FBGA packages. device designed programmed in-system with standard system supply. 12.0 required write erase operations. device also reprogrammed standard EPROM programmers. standard MBM29LV160T/B offers access times allowing operation high-speed microprocessors without wait states. eliminate contention device separate chip enable (CE), write enable (WE), output enable (OE) controls. MBM29LV160T/B command compatible with JEDEC standard E2PROMs. Commands written command register using standard microprocessor write timings. Register contents serve input internal state-machine which controls erase programming circuitry. Write cycles also internally latch addresses data needed programming erase operations. Reading data device similar reading from 12.0 Flash EPROM devices. MBM29LV160T/B programmed executing program command sequence. This will invoke Embedded Program Algorithm which internal algorithm that automatically times program pulse widths verifies proper cell margins. Typically, each sector programmed verified about seconds. Erase accomplished executing erase command sequence. This will invoke Embedded Erase Algorithm which internal algorithm that automatically preprograms array already programmed before executing erase operation. During erase, device automatically times erase pulse widths verifies proper cell margins. individual sector typically erased verified second. already preprogrammed.) device also features sector erase architecture. sector mode allows each sector erased reprogrammed without affecting other sectors. MBM29LV160T/B erased when shipped from factory. device features single power supply operation both read write functions. Internally generated regulated voltages provided program erase operations. detector automatically inhibits write operations loss power. program erase detected Data Polling DQ7, Toggle feature DQ6, RY/BY output pin. Once program erase cycle been comleted, device internally resets read mode. MBM29LV160T/B also hardware RESET pin. When this driven low, execution Embedded Program Algorithm Embedded Erase Algorithm terminated. internal state machine then reset read mode. RESET tied system reset circuitry. Therefore, system reset occurs during Embedded Program Algorithm Embedded Erase Algorithm, device automatically reset read mode will have erroneous data stored address locations being programmed erased. These locations need re-writing after Reset. Resetting device enables system's microprocessor read boot-up firmware from Flash memory. Fujitsu's Flash technology combines years Flash memory manufacturing experience produce highest levels quality, reliability, cost effectiveness. MBM29LV160T/B memory electrically erases bits within sector simultaneously Fowler-Nordhiem tunneling. bytes/words programmed byte/word time using EPROM programming mechanism electron injection. FLEXIBLE SECTOR-ERASE ARCHITECTURE word, words, word, thirty-one words sectors word mode. byte, bytes, byte, thirty-one bytes sectors byte mode. Individual-sector, multiple-sector, bulk-erase capability. Individual multiple-sector protection user definable. Sector SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 SA19 SA20 SA21 SA22 SA23 SA24 SA25 SA26 SA27 SA28 SA29 SA30 SA31 SA32 SA33 SA34 Sector Size Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Address Range 00000H 0FFFFH 10000H 1FFFFH 20000H 2FFFFH 30000H 3FFFFH 40000H 4FFFFH 50000H 5FFFFH 60000H 6FFFFH 70000H 7FFFFH 80000H 8FFFFH 90000H 9FFFFH A0000H AFFFFH B0000H BFFFFH C0000H CFFFFH D0000H DFFFFH E0000H EFFFFH F0000H FFFFFH 100000H 10FFFFH 110000H 11FFFFH 120000H 12FFFFH 130000H 13FFFFH 140000H 14FFFFH 150000H 15FFFFH 160000H 16FFFFH 170000H 17FFFFH 180000H 18FFFFH 190000H 19FFFFH 1A0000H 1AFFFFH 1B0000H 1BFFFFH 1C0000H 1CFFFFH 1D0000H 1DFFFFH 1E0000H 1EFFFFH 1F0000H 1F7FFFH 1F8000H 1F9FFFH 1FA000H 1FBFFFH 1FC000H 1FFFFFH Address Range 00000H 07FFFH 08000H 0FFFFH 10000H 17FFFH 18000H 1FFFFH 20000H 27FFFH 28000H 2FFFFH 30000H 37FFFH 38000H 3FFFFH 40000H 47FFFH 48000H 4FFFFH 50000H 57FFFH 58000H 5FFFFH 60000H 67FFFH 68000H 6FFFFH 70000H 77FFFH 78000H 7FFFFH 80000H 87FFFH 88000H 8FFFFH 90000H 97FFFH 98000H 9FFFFH A0000H A7FFFH A8000H AFFFFH B0000H B7FFFH B8000H BFFFFH C0000H C7FFFH C8000H CFFFFH D0000H D7FFFH D8000H DFFFFH E0000H E7FFFH E8000H EFFFFH F0000H F7FFFH F8000H FBFFFH FC000H FCFFFH FD000H FDFFFH FE000H FFFFFH MBM29LV160T Boot Sector Architecture Sector SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 SA19 SA20 SA21 SA22 SA23 SA24 SA25 SA26 SA27 SA28 SA29 SA30 SA31 SA32 SA33 SA34 Sector Size Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Kbytes Kwords Address Range 00000H 03FFFH 04000H 05FFFH 06000H 07FFFH 08000H 0FFFFH 10000H 1FFFFH 20000H 2FFFFH 30000H 3FFFFH 40000H 4FFFFH 50000H 5FFFFH 60000H 6FFFFH 70000H 7FFFFH 80000H 8FFFFH 90000H 9FFFFH A0000H AFFFFH B0000H BFFFFH C0000H CFFFFH D0000H DFFFFH E0000H EFFFFH F0000H FFFFFH 100000H 10FFFFH 110000H 11FFFFH 120000H 12FFFFH 130000H 13FFFFH 140000H 14FFFFH 150000H 15FFFFH 160000H 16FFFFH 170000H 17FFFFH 180000H 18FFFFH 190000H 19FFFFH 1A0000H 1AFFFFH 1B0000H 1BFFFFH 1C0000H 1CFFFFH 1D0000H 1DFFFFH 1E0000H 1EFFFFH 1F0000H 1FFFFFH Address Range 00000H 01FFFH 02000H 02FFFH 03000H 03FFFH 04000H 07FFFH 08000H 0FFFFH 10000H 17FFFH 18000H 1FFFFH 20000H 27FFFH 28000H 2FFFFH 30000H 37FFFH 38000H 3FFFFH 40000H 47FFFH 48000H 4FFFFH 50000H 57FFFH 58000H 5FFFFH 60000H 67FFFH 68000H 6FFFFH 70000H 77FFFH 78000H 7FFFFH 80000H 87FFFH 88000H 8FFFFH 90000H 97FFFH 98000H 9FFFFH A0000H A7FFFH A8000H AFFFFH B0000H B7FFFH B8000H BFFFFH C0000H C7FFFH C8000H CFFFFH D0000H D7FFFH D8000H DFFFFH E0000H E7FFFH E8000H EFFFFH F0000H F7FFFH F8000H FFFFFH MBM29LV160B Bottom Boot Sector Architecture PRODUCT LINE Part Ordering Part Max. Address Access Time (ns) Max. Access Time (ns) Max. Access Time (ns) +0.3 -0.3 +0.6 -0.3 MBM29LV160T/160B BLOCK DIAGRAM RY/BY Buffer DQ15 RY/BY Erase Voltage Generator Input/Output Buffers BYTE RESET State Control Command Register Program Voltage Generator Chip Enable Output Enable Logic Data Latch Y-Decoder Y-Gating Detector Timer Program/Erase Address Latch X-Decoder Cell Matrix CONNECTION DIAGRAMS TSOP(I) N.C. RESET N.C. N.C. RY/BY (Marking Side) BYTE DQ15/A-1 DQ14 DQ13 DQ12 DQ11 DQ10 Standard Pinout FPT-48P-M19 RY/BY N.C. N.C. RESET N.C. (Marking Side) DQ10 DQ11 DQ12 DQ13 DQ14 DQ15/A-1 BYTE Reverse Pinout FPT-48P-M20 (TOP VIEW) RESET DQ12 DQ13 DQ14 BYTE DQ15/A-1 (Marking Side) RY/BY N.C. DQ11 DQ10 SON-46 LCC- 46P-M02 (Continued) (Continued) (TOP VIEW) RY/BY N.C. N.C. RESET N.C. DQ10 DQ11 DQ12 DQ13 DQ14 DQ15/A-1 BYTE CSOP-48 LCC-48P-M03 FBGA (TOP VIEW) Marking side (BGA-48P-M03) (BGA-48P-M13) RY/BY N.C. N.C. DQ10 DQ11 RESET N.C. DQ12 DQ14 DQ13 BYTE DQ15/A-1 LOGIC SYMBOL Table MBM29LV160T/B Configuration DQ15 RESET BYTE RY/BY Function Address Inputs Data Inputs/Outputs Chip Enable Output Enable Write Enable Ready/Busy Output Hardware Reset Pin/ Temporary Sector Unprotection Selects 8-bit 16-bit mode Connected Internally Device Ground Device Power Supply A-1, DQ15 RY/BY RESET BYTE N.C. Table Operation Auto-Select Manufacture Code Auto-Select Device Code Read Standby Output Disable Write (Program/Erase) Enable Sector Protection (2), Verify Sector Protection (2), Temporary Sector Unprotection Reset (Hardware)/Standby Table Operation Auto-Select Manufacture Code Auto-Select Device Code Read Standby Output Disable Write (Program/Erase) Enable Sector Protection (2), Verify Sector Protection (2), Temporary Sector Unprotection Reset (Hardware)/Standby MBM29LV160T/B User Operation (BYTE VIH) DQ15 RESET Code Code DOUT HIGH-Z HIGH-Z Code HIGH-Z MBM29LV160T/B User Operation (BYTE VIL) DQ-1 Code Code DOUT HIGH-Z HIGH-Z Code HIGH-Z RESET Legend: VIL, VIH, VIH. pulse input. Characteristics voltage levels. Notes: Manufacturer device codes also accessed command register write sequence. Table Refer section Sector Protection. VIL, initiates write operations. ±10% also used extended sector protection. ORDERING INFORMATION Standard Products Fujitsu standard products available several packages. order number formed combination MBM29LV160 PFTN PACKAGE TYPE PFTN 48-Pin Thin Small Outline Package (TSOP) Standard Pinout PFTR 48-Pin Thin Small Outline Package (TSOP) Reverse Pinout =46-Pin Small Outline Nonleaded Package (SON) 48-Pin leaded Small Outline Package (CSOP) 48-Pin Fine Pitch Ball Grid Array Package (FBGA:BGA-48P-M03) PBT- SF2= 48-Pin Fine Pitch Ball Grid Array Package (FBGA:BGA-48P-M13) SPEED OPTION Product Selector Guide BOOT CODE SECTOR ARCHITECTURE sector Bottom sector DEVICE NUMBER/DESCRIPTION MBM29LV160 Mega-bit 8-Bit 16-Bit) CMOS Flash Memory V-only Read, Write, Erase FUNCTIONAL DESCRIPTION Read Mode MBM29LV160T/B control functions which must satisfied order obtain data outputs. power control should used device selection. output control should used gate data output pins device selected. Address access time (tACC) equal delay from stable addresses valid output data. chip enable access time (tCE) delay from stable addresses stable valid data output pins. output enable access time delay from falling edge valid data output pins. (Assuming addresses have been stable least tACC time.) Figure timing specifications. Standby Mode There ways implement standby mode MBM29LV160T/B devices. using both RESET pins; other RESET only. When using both pins, CMOS standby mode achieved with RESET inputs both held ±0.3 Under this condition current consumed less than max. During Embedded Algorithm operation, Active current (ICC2) required even "H". device read with standard access time (tCE) from either these standby modes. When using RESET only, CMOS standby mode achieved with RESET input held ±0.3 "L"). Under this condition current consumed less than max. Once RESET taken high, device requires wake time before outputs valid read access. standby mode, outputs high-impedance state, independent input. Automatic Sleep Mode There function called automatic sleep mode restrain power consumption during read-out MBM29LV160T/B data. This mode used effectively with application requesting power consumption such handy terminals. activate this mode, MBM29LV160T/B automatically switches itself power mode when addresses remain stable necessary control this mode. During such mode, current consumed typically (CMOS Level). Standard address access timings provide data when addresses changed. While sleep mode, output data latched always available system. Output Disable input logic high level (VIH), output from device disabled. This will cause output pins high-impedance state. Autoselect Autoselect mode allows reading binary code from device will identify manufacturer type. intent allow programming equipment automatically match device programmed with corresponding programming algorithm. Autoselect command also used check status write-protected sectors. (See Tables 4.2.) This mode functional over entire temperature range device. activate this mode, programming equipment must force (11.5 12.5 address identifier bytes then sequenced from devices outputs toggling address from VIH. addresses DON'T CARES except (A-1). (See Table Table manufacturer device codes also read command register, instances when MBM29LV160T/B erased programmed system without access high voltage pin. command sequence illustrated Table Command Definitions. Byte VIL) represents manufacture's code byte VIH) represents device identifier code. MBM29LV160T/B these bytes given Table 4.2. identifiers manufactures device will exhibit parity with defined parity bit. order read proper device codes when executing Autoselect, must VIL. (See Tables device indentification word mode (BYTE VIH), DQ13 equal DQ8, DQ10 DQ12, DQ14, DQ15 equal `0'. BYTE (for byte mode), device code (for boot block) (for bottom boot block). BYTE (for word mode), device code 22C4H (for boot block) 2249H (for bottom boot block). order determine which sectors write protected, must while running through sector addresses; selected sector protected, logical will output (DQ0 =1). Table MBM29LV160T/B Sector Protection Verify Autoselect Code Type Manufacture's Code Byte MBM29LV160T Word Device Code Byte MBM29LV160B Word Sector Protection Byte mode. Outputs protected sector addresses outputs unprotected sector addresses. Table Expanded Autoselect Code Table Type Manufacture's Code MBM29LV160T A-1*1 Code (HEX) 22C4H 2249H 01H*2 Sector Addresses Code DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 A-1/0 HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z Device Code MBM29LV160B 22C4H HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 2249H Sector Protection (B): Byte mode (W): Word mode A-1/0 Table Sector Address SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 SA19 SA20 SA21 SA22 SA23 SA24 SA25 SA26 SA27 SA28 SA29 SA30 SA31 SA32 SA33 SA34 Sector Address Tables (MBM29LV160T) Address Range 00000H 0FFFFH 10000H 1FFFFH 20000H 2FFFFH 30000H 3FFFFH 40000H 4FFFFH 50000H 5FFFFH 60000H 6FFFFH 70000H 7FFFFH 80000H 8FFFFH 90000H 9FFFFH A0000H AFFFFH B0000H BFFFFH C0000H CFFFFH D0000H DFFFFH E0000H EFFFFH F0000H FFFFFH 100000H 10FFFFH 110000H 11FFFFH 120000H 12FFFFH 130000H 13FFFFH 140000H 14FFFFH 150000H 15FFFFH 160000H 16FFFFH 170000H 17FFFFH 180000H 18FFFFH 190000H 19FFFFH 1A0000H 1AFFFFH 1B0000H 1BFFFFH 1C0000H 1CFFFFH 1D0000H 1DFFFFH 1E0000H 1EFFFFH 1F0000H 1F7FFFH 1F8000H 1F9FFFH 1FA000H 1FBFFFH 1FC000H 1FFFFFH Address Range 00000H 07FFFH 08000H 0FFFFH 10000H 17FFFH 18000H 1FFFFH 20000H 27FFFH 28000H 2FFFFH 30000H 37FFFH 38000H 3FFFFH 40000H 47FFFH 48000H 4FFFFH 50000H 57FFFH 58000H 5FFFFH 60000H 67FFFH 68000H 6FFFFH 70000H 77FFFH 78000H 7FFFFH 80000H 87FFFH 88000H 8FFFFH 90000H 97FFFH 98000H 9FFFFH A0000H A7FFFH A8000H AFFFFH B0000H B7FFFH B8000H BFFFFH C0000H C7FFFH C8000H CFFFFH D0000H D7FFFH D8000H DFFFFH E0000H E7FFFH E8000H EFFFFH F0000H F7FFFH F8000H FBFFFH FC000H FCFFFH FD000H FDFFFH FE000H FEFFFH Table Sector Address SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 SA19 SA20 SA21 SA22 SA23 SA24 SA25 SA26 SA27 SA28 SA29 SA30 SA31 SA32 SA33 SA34 Sector Address Tables (MBM29LV160B) Address Range 00000H 03FFFH 04000H 05FFFH 06000H 07FFFH 08000H 0FFFFH 10000H 1FFFFH 20000H 2FFFFH 30000H 3FFFFH 40000H 4FFFFH 50000H 5FFFFH 60000H 6FFFFH 70000H 7FFFFH 80000H 8FFFFH 90000H 9FFFFH A0000H AFFFFH B0000H BFFFFH C0000H CFFFFH D0000H DFFFFH E0000H EFFFFH F0000H FFFFFH 100000H 1FFFFFH 110000H 11FFFFH 120000H 12FFFFH 130000H 13FFFFH 140000H 14FFFFH 150000H 15FFFFH 160000H 16FFFFH 170000H 17FFFFH 180000H 18FFFFH 190000H 19FFFFH 1A0000H 1AFFFFH 1B0000H 1BFFFFH 1C0000H 1CFFFFH 1D0000H 1DFFFFH 1E0000H 1EFFFFH 1F0000H 1FFFFFH Address Range 00000H 01FFFH 02000H 02FFFH 03000H 03FFFH 04000H 07FFFH 08000H 0FFFFH 10000H 17FFFH 18000H 1FFFFH 20000H 27FFFH 28000H 2FFFFH 30000H 37FFFH 38000H 3FFFFH 40000H 47FFFH 48000H 4FFFFH 50000H 57FFFH 58000H 5FFFFH 60000H 67FFFH 68000H 6FFFFH 70000H 77FFFH 78000H 7FFFFH 80000H 87FFFH 88000H 8FFFFH 90000H 97FFFH 98000H 9FFFFH A0000H A7FFFH A8000H 8FFFFH B0000H B7FFFH B8000H BFFFFH C0000H C7FFFH C8000H CFFFFH D0000H D7FFFH D8000H DFFFFH E0000H E7FFFH E8000H EFFFFH F0000H F7FFFH F8000H FFFFFH Write Device erasure programming accomplished command register. command register written bringing VIL, while VIH. Addresses latched falling edge whichever occurs later, while data latched rising edge pulse, whichever occurs first. Standard microprocessor write timings used. Figures Refer Write Characteristics Erase/Programming Waveforms specific timing parameters. Sector Protection MBM29LV160T/B features hardware sector protection. This feature will disable both program erase operations number sectors through 34). sector protection feature enabled using programming equipment user's site. device shipped with sectors unprotected. activate this mode, programming equipment must force address control VIL, VIL, VIH. sector addresses pins (A19, A18, A17, A16, A15, A14, A13, A12) should sector protected. Tables define sector address each thirty five (35) individual sectors. Programming protection circuitry begins falling edge pulse terminated with rising edge same. Sector addresses must held constant during pulse. figures sector protection waveforms algorithm. verify programming protection circuitry, programming equipment must force address with VIH. Scanning sector addresses (A19, A18, A17, A16, A15, A14, A13, A12) while (A6, will produce logical device output protected sector. Otherwise device will read unprotected sector. this mode, lower order addresses, except DON'T CARES. Address locations with reserved Autoselect manufacturer device codes. requires byte mode. also possible determine sector protected system writing Autoselect command. Performing read operation address location XX02H, where higher order addresses pins (A19, A18, A17, A16, A15, A14, A13, A12) represents sector address will produce logical protected sector. Tables Autoselect codes. Temporary Sector Unprotection This feature allows temporary unprotection previously protected sectors MBM29LV160T/B devices order change data. Sector Unprotection mode activated setting RESET high voltage During this mode, formerly protected sectors programmed erased selecting sector addresses. Once taken away from RESET pin, previously protected sectors will protected again. (See Figures 25.) Table Command Sequence (Notes Read/Reset (Note Read/Reset (Note Write Cycles Req'd MBM29LV160T/B Standard Command Definitions Second First Third Fourth Fifth Sixth Write Cycle Write Cycle Write Cycle Read/Write Write Cycle Write Cycle Cycle Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data XXXH 555H AAAH 555H AAAH 555H 2AAH 555H 2AAH 555H 2AAH 555H 2AAH 555H 2AAH 555H 555H AAAH 555H AAAH 555H AAAH 555H AAAH 555H AAAH 555H AAAH 555H AAAH 2AAH 555H 2AAH 555H 555H Word /Byte Word Byte Word Byte Autoselect Byte/Word Program (Notes Chip Erase Word Byte Word Byte Word Byte Word /Byte Word /Byte AAAH 555H AAAH 555H AAAH Sector Erase (Note Sector Erase Suspend Sector Erase Resume XXXH XXXH Notes: Address bits address commands except Program Address (PA) Sector Address (SA). operations defined Tables =Address memory location read. =Address memory location programmed. Addresses latched falling edge pulse. =Address sector erased. combination A19, A18, A17, A16, A15, A14, A13, will uniquely select sector. =Data read from location during read operation. =Data programmed location Data latched rising edge system should generate following address patterns: Word Mode: 555H 2AAH addresses Byte Mode: AAAH 555H addresses Both Read/Reset commands functionally equivalent, resetting device read mode. Table Command Sequence Fast Mode Fast Program Reset from Fast Mode Query Command Word Byte Word Byte Word Byte Word Byte Write Cycles Req'd MBM29LV160T/B Extended Command Definitions First Write Cycle Addr 555H AAAH XXXH XXXH XXXH XXXH XXXH Data Second Write Cycle Addr 2AAH 555H XXXH XXXH Data Third Write Cycle Addr 555H AAAH Data Fourth Read Cycle Addr Data Extended Sector Word Protect Byte Sector Address protected. sector address (SA) (A6, Sector protection verify data. Output protected sector addresses output unprotected sector addresses. This command valid while fast mode. Addresses from system other addresses "Don't care". This command valid while RESET. data" OOH" also acceptable. Command Definitions Device operations selected writing specific address data sequences into command register. Writing incorrect address data values writing them improper sequence will reset device read mode. Table defines valid register command sequences. Note that Erase Suspend (B0H) Erase Resume (30H) commands valid only while Sector Erase operation progress. Moreover both Read/Reset commands functionally equivalent, resetting device read mode. Please note that commands always written DQ15 bits ignored. Read/Reset Command order return from Autoselect mode Exceeded Timing Limits (DQ5 read mode, read/reset operation initiated writing Read/Reset command sequence into command register. Microprocessor read cycles retrieve array data from memory. device remains enabled reads until command register contents altered. device will automatically power-up Read/Reset state. this case, command sequence required read data. Standard microprocessor read cycles will retrieve array data. This default value ensures that spurious alteration memory contents occurs during power transition. Refer Read Characteristics Waveforms specific timing parameters. (See Figure 5.1.) Autoselect Command Flash memories intended applications where local alters memory contents. such, manufactures device codes must accessible while device resides target system. PROM programmers typically access signature codes raising high voltage. However, multiplexing high voltage onto address lines generally desired system design practice. device contains Autoselect command operation supplement traditional PROM programming methodology. operation initiated writing Autoselect command sequence into command register. Following last command write, read cycle from address XX00H retrieves manufacture code 04H. read cycle from address XX01H (XX02H retrieves device code (MBM29LV160T MBM29LV160B mode; MBM29LV160T 22C4H MBM29LV160B 2249H mode). (See Tables 4.2.) manufactures device codes will exhibit parity with defined parity bit. sector state (protection unprotection) will indicated address XX02H (XX04H Scanning sector addresses (A19, A18, A17, A16, A15, A14, A13, A12) while (A6, will produce logical device output protected sector. programming verification should perform margin mode verification protected sector. (See Tables terminate operation, necessary write Read/Reset command sequence into register and, also write Autoselect command during operation, executing after writing Read/Reset command sequence. Word/Byte Programming device programmed byte-by-byte word-by-word) basis. Programming four cycle operation. There "unlock" write cycles. These followed program set-up command data write cycles. Addresses latched falling edge whichever happens later data latched rising edge whichever happens first. rising edge last (whichever happens first) begins programming. Upon executing Embedded Program Algorithm command sequence, system required provide further controls timings. device will automatically provide adequate internally generated program pulses verify programmed cell margin. (See Figures automatic programming operation completed when data equivalent data written this which time device return read mode addresses longer latched. (See Table Hardware Sequence Flags.) Therefore, device requires that valid address supplied system this time. Hence, Data Polling must performed memory location which being programmed. commands written chip during this period will ignored. hardware reset occures during programming operation, impossible guarantee whether data being written correct not. Programming allowed sequence across sector boundaries. Beware that data cannot programmed back "1". Attempting either hang device result apparent success according data polling algorithm read from read/reset mode will show that data still "0". Only erase operations convert "0"s "1"s. Figure illustrates Embedded ProgramAlgorithm using typical command strings operations. Chip Erase Chip erase six-bus cycle operation. There "unlock" write cycles. These followed writing "set-up" command. more "unlock" write cycles then followed chip erase command. Chip erase does require user program device prior erase. Upon executing Embedded Erase Algorithm command sequence device will automatically program verify entire memory zero data pattern prior electrical erase. (Preprogram Function.) system required provide controls timings during these operations. automatic erase begins rising edge last pulse command sequence terminates when data (See Write Operation Status section.) which time device returns read mode. (See Figure Figure illustrates Embedded EraseAlgorithm using typical command strings operations. Sector Erase Sector erase six-bus cycle operation. There "unlock" write cycles, followed writing "set-up" command. more "unlock" write cycles then followed Sector Erase command. sector address (any address location within desired sector) latched falling edge while command (Data 30H) latched rising edge After time-out from rising edge last sector erase command, sector erase operation will begin. Multiple sectors erased concurrently writing six-bus cycle operations Table This sequence followed with writes Sector Erase command addresses other sectors desired concurrently erased. time between writes must less than otherwise that command will accepted erasure will start. recommended that processor interrupts disabled during this time guarantee this condition. interrupts re-enabled after last Sector Erase command written. time-out from rising edge last will initiate execution Sector Erase command(s). another falling edge occurs within time-out window timer reset. Monitor determine sector erase timer window still open. (See section DQ3, Sector Erase Timer.) command other than Sector Erase Erase Suspend during this time-out period will reset device read mode, ignoring previous command string. Resetting device once excution begun will corrupt data sector. that case, restart erase those sectors allow them complete. (Refer Write Operation Status section Sector Erase Timer operation.) Loading sector erase buffer done sequence with number sectors 34). Sector erase does require user program device prior erase. device automatically programs memory locations sector(s) erased prior electrical erase (Preprogram Function). When erasing sector sectors remaining unselected sectors affected. system required provide controls timings during these operations. (See Figure automatic sector erase begins after time from rising edge pulse last sector erase command pulse terminates when data (See Write Operation Status section) which time device returns read mode. Data polling must performed address within sectors being erased. Multiple Sector Erase Time; [Sector Program Time (Preprogramming) Sector Erase Time] Number Sector Erase. Figure illustrates Embedded EraseAlgorithm using typical command strings operations. Erase Suspend/Resume Erase Suspend command allows user interrupt Sector Erase operation then perform data reads from program sector being erased. This command applicable ONLY during Sector Erase operation which includes time-out period sector erase. Erase Suspend command will ignored written during Chip Erase operation Embedded Program Algorithm. Writting Erase Suspend command during Sector Erase time-out results immediate termination time-out period suspension erase operation. Writing Erase Resume command resumes erase operation. addresses "DON'T CARES" when writing Erase Suspend Erase Resume commands. When Erase Suspend command written during Sector Erase operation, device will take maximum suspend erase operation. When devices have entered erase-suspended mode, output will logic "1", will stop toggling. user must address erasing sector reading determine erase operation been suspended. Further writes Erase Suspend command ignored. When erase operation been suspended, device defaults erase-suspend-read mode. Reading data this mode same reading from standard read mode except that data must read from sectors that have been erase-suspended. Successively reading from erase-suspended sector while device erase-suspend-read mode will cause toggle. (See section DQ2.) After entering erase-suspend-read mode, user program device writing appropriate command sequence Program. This Program mode known erase-suspend-program mode. Again, programming this mode same programming regular Program mode except that data must programmed sectors that erase-suspended. Successively reading from erase-suspended sector while devices erase-suspend-program mode will cause toggle. erasesuspended Program operation detected RY/BY output pin, Data polling DQ7, Toggle (DQ6) which same regular Program operation. Note that must read from Program address while read from address. resume operation Sector Erase, Resume command (30H) should written. further writes Resume command this point will ignored. Another Erase Suspend command written after chip resumed erasing. Extended Command Fast Mode MBM29LV160T/B Fast Mode function. This mode dispenses with initial unlock cycles required standard program command sequence writing Fast Mode command into command register. this mode, required cycle programming cycles instead four cycles standard program command. write erase command this mode.) read operation also executed after exiting this mode. exit this mode, necessary write Fast Mode Reset command into command register. (Refer Figure Extended algorithm.) active current required even during Fast Mode. Fast Programming During Fast Mode, programming executed with cycles operation. Embedded Program Algorithm executed writing program set-up command (A0H) data write cycles (PA/PD). (Refer Figure Extended algorithm.) (Common Flash Memory Interface) (Common Flash Memory Interface) specification outlines device host system software interrogation handshake which allows specific vendor-specified software algorithms used entire families devices. This allows device-independent, JEDEC ID-independent, forward-and backwardcompatible software support specified flash device families. Refer specification detail. operation initiated writing query command (98H) into command register. Following command write, read cycle from specific address retrives device information. Please note that output data upper byte (DQ8 DQ15) word mode bit) read. Refer code table. terminate operation, necessary write read/reset command sequence into register. Extended Sector Protect addition normal sector protection, MBM29LV160T/B Extended Sector Protection extended function. This function enable protect sector forcing RESET write commnad sequence. Unlike conventional procedure, necessary force control timing control pins. only RESET requires sector protection this mode. extended sector protect requires RESET pin. With this condition, operation initiated writing set-up command (60H) into command register. Then, sector addresses pins (A19, A18, A17, A16, A15, A14, A12) (A6, should sector protected (recommend other addresses pins), write extended sector protect command (60H). sector typically protected verify programming protection circuitry, sector addresses pins (A19, A18, A17, A16, A15, A14, A12) (A6, should write command (40H). Following command write, logical device output will produce protected sector read operation. output data logical "0", please repeat write extended sector protect command (60H) again. terminate operation, necessary RESET VIH. Write Operation Status Table Status Embedded Program Algorithm Embedded/Erase Algorithm Progress Erase Suspend Read (Erase Suspended Sector) Erase Erase Suspend Read Suspend (Non-Erase Suspended Sector) Mode Erase Suspend Program (Non-Erase Suspended Sector) Embedded Program Algorithm Exceeded Time Limits Embedded/Erase Algorithm Erase Suspend Program (Non-Erase Suspended Sector) Hardware Sequence Flags Data Toggle Toggle Data Toggle (Note Toggle Toggle Toggle Data Data Toggle Toggle Data (Note Notes: Performing successive read operations from address will cause toggle. Reading byte address being programmed while erase-suspend program mode will indicate logic bit. However, successive reads from erase-suspended sector will cause toggle. reserve pins future use. Fujitsu internal only. Data Polling MBM29LV160T/B device features Data Polling method indicate host that Embedded Algorithms progress completed. During Embedded Program Algorithm, attempt read devices will produce complement data last written DQ7. Upon completion Embedded Program Algorithm, attempt read device will produce true data last written DQ7. During Embedded Erase Algorithm, attempt read device will produce output. Upon completion Embedded Erase Algorithm attempt read device will produce output. flowchart Data Polling (DQ7) shown Figure chip erase sector erase, Data Polling valid after rising edge sixth pulse six-write pulse sequence. Data Polling must performed sector address within sectors being erased protected sector. Otherwise, status valid. Once Embedded Algorithm operation close being completed, MBM29LV160T/B data pins (DQ7) change asynchronously while output enable (OE) asserted low. This means that device driving status information instant time then that byte's valid data next instant time. Depending when system samples output, read status valid data. Even device completed Embedded Program Algorithm operation valid data, data outputs still invalid. valid data will read successive read attempts. Data Polling feature only active during Embedded Programming Algorithm, Embedded Erase Algorithm sector erase time-out. Figure Data Polling timing specifications diagrams. Toggle MBM29LV160T/B also feature "Toggle method indicate host system that Embedded Algorithms progress completed. During Embedded Program Erase Algorithm cycle, successive attempts read toggling) data from device will result toggling between zero. Once Embedded Program Erase Algorithm cycle completed, will stop toggling valid data read next successive attempts. During programming, Toggle valid after rising edge fourth pulse four write pulse sequence. chip erase sector erase, Toggle valid after rising edge sixth pulse sixwrite pulse sequence. Toggle active during sector time out. programming, sector being written protected, toggle will toggle about then stop toggling without data having changed. erase, device will erase selected sectors except ones that protected. selected sectors protected, chip will toggle Toggle about then drop back into read mode, having changed none data. Either toggling will cause toggle. addition, Erase Suspend/Resume command will cause toggle. Figure Figure Toggle timing specifications diagrams. Exceeded Timing Limits will indicate program erase time exceeded specified limits (internal pulse count). Under these conditions will produce "1". This failure condition which indicates that program erase cycle successfully completed. Data Polling only operating function device under this condition. circuit will partially power down device under these conditions. pins will control output disable functions described Tables failure condition also appear user tries program blank location without erasing. this case device locks never completes Embedded Algorithm operation. Hence, system never reads valid data never stops toggling. Once device exceeded timing limits, will indicate "1." Please note that this device failure condition since device incorrectly used. this occurs, reset device with command sequence. Sector Erase Timer After completion initial sector erase command sequence sector erase time-out will begin. will remain until time-out complete. Data Polling Toggle valid after initial sector erase command sequence. Data Polling Toggle indicates device been written with valid erase command, used determine sector erase timer window still open. high ("1") internally controlled erase cycle begun; attempts write subsequent commands device will ignored until erase operation completed indicated Data Polling Toggle ("0"), device will accept additional sector erase commands. insure command been accepted, system software should check status prior following each subsequent sector erase command. high second status check, command have been accepted. Table Hardware Sequence Flags. Toggle This Toggle along with DQ6, used determine whether device Embedded Erase Algorithm Erase Suspend. Successive reads from erasing sector will cause toggle during Embedded Erase Algorithm. device erase-suspended-read mode, successive reads from erase-suspended sector will cause toggle. When device erase-suspended-program mode, successive reads from byte address non-erase suspended sector will indicate logic DQ2. different from that toggles only when standard program Erase, Erase Suspend Program operation progress. example, used together determine erase-suspend-read mode progress. (DQ2 toggles while does not.) also Table Figure Furthermore, also used determine which sector being erased. When device erase mode, toggles this read from erasing sector. Table Mode Program Erase Erase Suspend Read (Erase Suspended Sector) (Note Erase-Suspend Program Toggle Status Toggle Toggle Toggle (Note Toggle Toggle (Note Notes: Performing successive read operations from address will cause toggle. Reading byte address being programmed while erase-suspend program mode will indicate logic bit. However, successive reads from erase-suspended sector will cause toggle. RY/BY Ready/Busy MBM29LV160T/B provides RY/BY open-drain output indicate host system that Embedded Algorithms either progress been completed. output low, device busy with either program erase operation. output high, device ready accept read/write erase operation. When RY/BY low, devices will accept additional program erase commands with exception Erase Suspend command. MBM29LV160T/B placed Erase Suspend mode, RY/BY output will high, means connecting with pull-up resister VCC. During programming, RY/BY driven after rising edge fourth pulse. During erase operation, RY/BY driven after rising edge sixth pulse. RY/BY will indicate busy condition during RESET pulse. Figure detailed timing diagram. RY/BY pulled high standby mode. Since this open-drain output, RY/BY pins tied together parallel with pull-up resistor VCC. RESET Hardware Reset MBM29LV160T/B device reset driving RESET VIL. RESET pulse requirement kept (VIL) least order properly reset internal state machine. operation process being executed will terminated internal state machine will reset read mode tREADY after RESET driven low. Furthermore, once RESET goes high, device requires additional before allows read access. When RESET low, device will standby mode duration pulse data output pins will tri-stated. hardware reset occurs during program erase operation, data that particular location will corrupted. Please note that RY/BY output signal should ignored during RESET pulse. Refer Figure timing diagram. Refer Temporary Sector Unprotection additional functionality. hardware reset occurs during Embedded Erase Algorithm, there possibility that erasing sector(s) will need erased again before they programmed. Word/Byte Configuration BYTE selects byte (8-bit) mode word (16-bit) mode MBM29LV160T/B device. When this driven high, device operates word (16-bit) mode. data read programmed DQ15. When this driven low, device operates byte (8-bit) mode. Under this mode, DQ15/A-1 becomes lowest address DQ14 bits tri-stated. However, command cycle always 8-bit operation hence commands written DQ15 bits ignored. Refer Figures timing diagrams. Data Protection MBM29LV160T/B designed offer protection against accidental erasure programming caused spurious system level signals that exist during power transitions. During power device automatically resets internal state machine Read mode. Also, with control register architecture, alteration memory contents only occurs after successful completion specific multi-bus cycle command sequence. device also incorporates several features prevent inadvertent write cycles resulting form power-up power-down transitions system noise. Write Inhibit avoid initiation write cycle during power-up power-down, write cycle locked less than (typically VLKO, command register disabled internal program/erase circuits disabled. Under this condition, device will reset read mode. Subsequent writes will ignored until level greater than VLKO. users responsibility ensure that control pins logically correct prevent unintentional writes when above Embedded Erase Algorithm interrupted, there possibility that erasing sector(s) will need erased again prior programming. Write Pulse "Glitch" Protection Noise pulses less than (typical) will change command registers. Logical Inhibit Writing inhibited holding VIL, VIH, VIH. initiate write, must logical zero while logical one. Power-up Write Inhibit Power-up devices with will accept commands rising edge internal state machine automatically reset read mode power-up. Handling Package metal portion marking side connected with internal chip electrically. Please attention occur electrical connection during operation. worst case, caused permanent damage device system excessive current. Table Common Flash Memory Interface Code Description Query-unique ASCII string "QRY" Primary Command AMD/FJ standard type Address Primary Extended Table Alternate Command (00h applicable) Address Alternate Extended Table Min. (write/erase) D7-4: volt, D3-0: mvolt Max. (write/erase) D7-4: volt, D3-0: mvolt Min. voltage Max. voltage Typical timeout single byte/word write Typical timeout Min. size buffer write Typical timeout individual block erase Typical timeout full chip erase Max. timeout byte/word write times typical Max. timeout buffer write times typical Max. timeout individual block erase times typical Max. timeout full chip erase times typical Device Size byte Flash Device Interface description Max. number byte multi-byte write Number Erase Block Regions within device DQ15 Description Erase Block Region Information DQ15 0051h 0052h 0059h 0002h 0000h 0040h 0000h 0000h 0000h 0000h 0000h 0027h 0036h 0000h 0000h 0004h 0000h 0000h 0040h 0000h 0001h 0000h 0020h 0000h 0000h 0000h 0080h 0000h 001Eh 0000h 0000h 0001h 0050h 0052h 0049h 0031h 0030h 0000h Erase Block Region Information Erase Block Region Information Erase Block Region Information Query-unique ASCII string "PRI" Major version number, ASCII 0000h 000Ah 0000h 0005h 0000h 0004h 0000h 0015h 0002h 0000h 0000h 0000h 0004h Minor version number, ASCII Address Sensitive Unlock Required Required Erase Suspend Supported Read Only Read Write Sector Protect Supported Number sectors group Sector Temporary Unprotect Supported Supported Reserve 0002h 0001h 0001h XXXXh XXXXh XXXXh XXXXh ABSOLUTE MAXIMUM RATINGS Storage Temperature -55°C +125°C Ambient Temperature with Power Applied -40°C +85°C Voltage with respect Ground pins except RESET (Note -0.5 +VCC +0.5 (Note -0.5 +5.5 RESET (Note -0.5 +13.0 Notes: Minimum voltage input pins -0.5 During voltage transitions, inputs negative overshoot -2.0 periods Maximum voltage output pins +0.5 During voltage transitions,outputs positive overshoot +2.0 periods Minimum input voltage RESET pins -0.5 During voltage transitions, RESET pins negative overshoot -2.0 periods Maximum input voltage RESET pins +13.0 which positive overshoot 14.0 periods Voltage difference between input voltage supply voltage (VIN VCC) exceed WARNING: Semiconductor devices permanently damaged application stress (voltage, current, temperature, etc.) excess absolute maximum ratings. exceed these ratings. RECOMMENDED OPERATING RANGES Ambient Temperature (TA) MBM29LV160T/B-80 .-20°C +70°C MBM29LV160T/B-90/-12.-40°C +85°C Supply Voltages MBM29LV160T/B-80 .+3.0 +3.6 MBM29LV160T/B-90/-12.+2.7 +3.6 Operating ranges define those limits between which functionality device quaranteed. WARNING: recommended operating conditions required order ensure normal operation semiconductor device. device's electrical characteristics warranted when device operated within these ranges. Always semiconductor devices within their recommended operating condition ranges. Operation outside these ranges adversely affect reliability could result device failure. warranty made with respect uses, operating conditions, combinations represented data sheet. Users considering application outside listed conditions advised contact their FUJITSU representatives beforehand. MAXIMUM OVERSHOOT +0.6 -0.5 -2.0 Figure Maximum Negative Overshoot Waveform +2.0 +0.5 +2.0 Figure Maximum Positive Overshoot Waveform +14.0 +13.0 +0.5 Note This waveform applied RESET. Figure Maximum Positive Overshoot Waveform CHARACTERISTICS Parameter Symbol ILIT Parameter Description Input Leakage Current Output Leakage Current RESET Inputs Leakage Current Test Conditions VCC, Max. VOUT VCC, Max. Max., RESET 12.5 VIL, ICC1 Active Current (Note VIL, ICC2 ICC3 ICC4 Active Current (Note Current (Standby) Current (Standby, RESET) VIL, Max., ±0.3 RESET ±0.3 Max., RESET ±0.3 Byte Word Byte Word Min. -1.0 -1.0 Max. +1.0 +1.0 Unit ICC5 Max., ±0.3 Current RESET ±0.3 (Automatic Sleep Mode) (Note ±0.3 ±0.3 Input Level Input High Level Voltage Autoselect,Sector Protection, Temporary Sector Unprotection (A9, RESET) (Note Output Voltage Level Output High Voltage Level -0.5 11.5 12.5 VOH1 VOH2 VLKO Notes: Min. -2.0 Min. -100 0.45 Lock-Out Voltage current listed includes both operating current frequency dependent component. active while Embedded Erase Embedded Program progress. Automatic sleep mode enables power mode when address remain stable (VID VCC) exceed CHARACTERISTICS Read Only Operations Characteristics Parameter Symbols JEDEC tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX Standard tACC tREADY tELFL tELFH Read Cycle Time Address Output Delay Chip Enable Output Delay Output Enable Output Delay Chip Enable Output HIGH-Z Output Enable Output HIGH-Z Output Hold Time From Address, Whichever Occurs First RESET Read Mode BYTE Switching High Min. Max. Max. Max. Max. Max. Min. Max. Max. (Note) (Note) (Note) Description Test Setup Unit Note: Test Conditions: Output Load: gate (MBM29LV160T/B-80/-90) gate (MBM29LV160T/B-12) Input rise fall times: Input pulse levels: Timing measurement reference level Input: Output: IN3064 Equivalent Device Under Test Diodes IN3064 Equivalent Notes: including capacitance (MBM29LV160T/B-80/-90) including capacitance (MBM29LV160T/B-12) Figure Test Conditions Write (Erase/Program) Operations Parameter Symbols Description JEDEC tAVAV tAVWL tWLAX tDVWH tWHDX tGHWL tGHEL tELWL tWLEL tWHEH tEHWH tWLWH tELEH tWHWL tEHEL tWHWH1 tWHWH2 Standard tOES tOEH tGHWL tGHEL tWPH tCPH tWHWH1 tWHWH2 tEOE tVCS tVLHT tWPP tOESP tCSP Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Output Enable Read Hold Time Toggle Data Polling Read Recover Time Before Write Read Recover Time Before Write High Low) Setup Time Setup Time Hold Time Hold Time Write Pulse Width Pulse Width Write Pulse Width High Pulse Width High Byte Programming Operation Word Sector Erase Operation (Note Delay Time from Embedded Output Enable Setup Time Voltage Transition Time (Note Write Pulse Width (Note Setup Time Active (Note Setup Time Active (Note Recover Time From RY/BY Typ. Max. Min. Min. Min. Min. Min. Min. Typ. Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. MBM29LV160T/B Unit (Continued) (Continued) Parameter Symbols Description JEDEC Standard tBUSY tFLQZ tFHQV tVIDR RESET Hold Time Before Read Program/Erase Valid RY/BY Delay BYTE Switching Output HIGH-Z BYTE Switching High Output Active Rise Time (Note RESET Pulse Width Min. Max. Max. Min. Min. Min. MBM29LV160T/B Unit Notes: This does include preprogramming time. This timing Sector Protection operation. SWITCHING WAVEFORMS Switching Waveforms WAVEFORM INPUTS Must Steady Change from Change from "L": Change Permitted Does Apply OUTPUTS Will Steady Will Change from Will Change from Changing, State Unknown Center Line HighImpedance "Off" State Addresses Addresses Stable tACC tOEH Outputs HIGH-Z Output Valid HIGH-Z Figure Waveforms Read Operations Addresses tACC Addresses Stable RESET Outputs HIGH-Z Output Valid Figure Waveforms Hardware Reset/Read Operations Cycle Addresses 555H Data Polling tGHWL tWPH tWHWH1 Data DOUT DOUT Notes: address memory location programmed. data programmed word address. output complement data written device. DOUT output data written device. Figure indicates last cycles four cycle sequence. These waveforms mode. (The addresses differ from mode.) Figure Waveforms Alternate Controlled Program Operations Cycle Data Polling Addresses 555H tGHEL tCPH tWHWH1 DOUT Data Notes: address memory location programmed. data programmed word address. output complement data written device. DOUT output data written device. Figure indicates last cycles four cycle sequence. These waveforms mode. (The addresses differ from mode.) Figure Waveforms Alternate Controlled Program Operations Addresses 555H 2AAH 555H 555H 2AAH tGHWL tWPH Sector Erase Data tVCS sector address Sector Erase. Addresses 555H (Word), AAAAH (Byte) Chip Erase. These waveforms mode. (The addresses differ from mode.) Figure Waveforms Chip/Sector Erase Operations tOEH Data Valid Data High-Z tWHWH1 High-Z Data Output Flag Valid Data (tEOE) Valid Data (The device completed Embedded operation.) Figure Waveforms Data Polling during Embedded Algorithm Operations tOEH tOES Toggle Stop Toggling Data Valid Data Toggle Stops toggling. (The device completed Embedded operation.) Figure Waveforms Taggle during Embedded Algorithm Operations rising edge last signal Entire programming erase operations RY/BY tBUSY Figure RY/BY Timing Diagram during Program/Erase Operations RESET RY/BY tREADY Figure RESET, RY/BY Timing Diagram BYTE DQ14 tELFH tFHQV DQ14 DQ15/A-1 DQ15 Figure Timing Diagram Word Mode Configuration BYTE tELFL DQ14 DQ14 DQ15/A-1 DQ15 tFLQZ Figure Timing Diagram Byte Mode Configuration falling edge last signal BYTE tSET (tAS) Input Valid tHOLD (tAH) Figure BYTE Timing Diagram Write Operations A19, A18, A16, A15, A13, tVLHT tWPP tVLHT tVLHT tOESP tCSP tVLHT Data tVCS Sector Address initial sector Sector Address next sector Note: byte mode. Figure Waveforms Sector Protection Timing Diagram tVCS RESET tVIDR tVLHT SPAX SPAX SPAY TIME-OUT Data SPAX Sector Address protected SPAY Next Sector Address protected TIME-OUT Time-out Window (min) Figure Extended Sector Protection Timing Diagram tVCS RESET tVIDR tVLHT tVLHT RY/BY Program Erase Command Sequence tVLHT Unprotection period Figure Temporary Sector Unprotection Timing Diagram Enter Embedded Erasing Erase Suspend Erase Enter Erase Suspend Program Erase Suspend Program Erase Resume Erase Suspend Read Erase Erase Complete Erase Suspend Read Toggle with Note: read from erase-suspended sector. Figure EMBEDDED PROGRAM ALGORITHM Start Write Program Command Sequence (See Below) Data Polling Device Verify Byte Increment Address Last Address Programming Completed Program Command Sequence* (Address/Command): 555H/AAH 2AAH/55H 555H/A0H Program Address/Program Data sequence applied mode. addresses differ from mode. Figure Embedded ProgramAlgorithm EMBEDDED PROGRAM ALGORITHM Start Write Erase Command Sequece (See Below) Data Polling Toggle from Device Data Erasure Completed Chip Erase Command Sequence* (Address/Command): 555H/AAH Individual Sector/Multiple Sector* Erase Command Sequence (Address/Command): 555H/AAH 2AAH/55H 2AAH/55H 555H/80H 555H/80H 555H/AAH 555H/AAH 2AAH/55H 2AAH/55H 555H/10H Sector Address/30H Sector Address/30H Additional sector erase commands optional. Sector Address/30H sequence applied mode. addresses differ from mode. Figure Embedded EraseAlgorithm Start Read Byte (DQ0 DQ7) Addr. Data? Read Byte (DQ0 DQ7) Addr. =Address programming =Any sector addresses within sector being erased during sector erase multiple erases operation. =Any sector addresses within sector being protected during sector erase multiple sector erases operation. Data? Fail Pass rechecked even because change simultaneously with DQ5. Figure Data Polling Algorithm Start Read (DQ0 DQ7) Addr. Toggle Read Byte (DQ0 DQ7) Addr. Toggle Fail Pass rechecked even because stop toggling same time changing "1". Figure Toggle Algorithm Start Setup Sector Addr. (A19, A18, A17, A16, A15, A14, A13, A12) PLSCNT VID, VIL, RESET VIL, Activate Pulse Increment PLSCNT Time VIH, should remain VID) Read from Sector VIH, VIL, Addr. VIL)* PLSCNT Remove from Write Reset Command Data 01H? Protect Another Sector? Device Failed Remove from Write Reset Command Sector Protection Completed byte mode. Figure Sector Protection Algorithm Start RESET (Note Perform Erase Program Operations RESET Temporary Sector Unprotection Completed (Note Notes: protected sectors unprotected. previously protected sectors protected once again. Figure Temporary Sector Unprotection Algorithm FAST MODE ALGORITHM Start 555H/AAH 2AAH/55H Fast Mode 555H/20H XXXXH/A0H Program Address/Program Data Fast Program Data Polling Device Verify Byte? Increment Address Last Address Programming Completed XXXXH/90H Reset Fast Mode XXXXH/F0H sequence applied mode. addresses differ from mode. Figure Embedded Programming Algorithm Fast Mode FAST MODE ALGORITHM Start RESET Wait Device Operating Temporary Sector Unprotect Mode Extended Sector Protect Entry? Setup Sector Protect Write XXXH/60H PLSCNT Sector Protect Write Sector Address VIL, VIH, VIL) Time Increment PLSCNT Verify Sector Protect Write Sector Address VIL, VIH, VIL) Read from Sector Address VIL, VIH, VIL) Setup Next Sector Address PLSCNT Remove from RESET Write Reset Command Data 01H? Protect Other Sector Remove from RESET Write Reset Command Device Failed Sector Protection Completed Figure Extended Sector Protect Algorithm ERASE PROGRAMMING PERFORMANCE Limits Parameter Min. Sector Erase Time Byte Programming Time Word Programming Time Chip Programming Time Erase/Program Cycle 100,000 Typ. 16.8 Max. cycles Excludes programming time prior erasure Excludes system-level overhead Excludes system-level overhead Unit Comments TSOP CAPACITANCE Parameter Symbol COUT CIN2 Parameter Description Input Capacitance Output Capacitance Control Capacitance Test Setup VOUT Typ. Max. Unit Note: Test conditions 25°C, CAPACITANCE Parameter Symbol COUT CIN2 Parameter Description Input Capacitance Output Capacitance Control Capacitance Test Setup VOUT Typ. Max. Unit Note: Test conditions 25°C, FBGA CAPACITANCE Parameter Symbol COUT CIN2 Parameter Description Input Capacitance Output Capacitance Control Capacitance Test Setup VOUT Typ. Max. Unit Note: Test conditions 25°C, PACKAGE DIMENSIONS 48-pin plastic TSOP (FPT-48P-M19) LEAD Resin protruction. (Each side: 0.15(.006) Max) INDEX Details part 0.15(.006) 0.15(.006) 0.35(.014) 0.25(.010) 20.00±0.20 (.787±.008) 18.40±0.20 (.724±.008) 12.00±0.20 (.472±.008) 11.50REF (.460) 1.10 -0.05 +.004 .043 -.002 (MOUNTING HEIGHT) 0.05(0.02)MIN STAND +0.10 0.10(.004) 0.50(.0197) 0.15±0.05 (.006±.002) 0.20±0.10 (.008±.004) 0.10(.004) 19.00±0.20 (.748±.008) 0.50±0.10 (.020±.004) 1996 FUJITSU LIMITED F48029S-2C-2 Dimensions (inches) (Continued) 48-pin plastic TSOP (FPT-48P-M20) LEAD Resin protrusion. (Each side: 0.15(.006) Max) INDEX Details part 0.15(.006) 0.15(.006) 0.35(.014) 0.25(.010) 19.00±0.20 (.748±.008) 0.50±0.10 (.020±.004) 0.15±0.10 (.006±.002) 0.20±0.10 (.008±.004) 0.10(.004) 0.10(.004) 0.50(.0197) 0.05(0.02)MIN STAND 18.40±0.20 (.724±.008) 20.00±0.20 (.787±.008) 11.50(.460)REF 12.00±0.20(.472±.008) 1.10 -0.05 +.004 .043 -.002 (MOUNTING HEIGHT) +0.10 1996 FUJITSU LIMITED F48030S-2C-2 Dimensions (inches) (Continued) 46-pin plastic (LCC-46P-M02) Note Resin residue marked dimensions 0.15 single side. Note geometry change with models. *12.00±0.10(.472±.004) 0.75(.030)MAX (TOTAL HEIGHT) 0.50(.020)TYP 10.10±0.20 (.398±.008) 10.00±0.10 (.394±.004) INDEX 0.05(.002) Details part 0.10(.004)TYP Details part *0.50(.020)TYP 0.05(.002) 0(0)MIN (STAND OFF) 0.50(.020)TYP 0.32±0.05 (.013±.002) 1997 FUJITSU LIMITED C46002S-4C-3 Dimensions (inches) (Continued) (Continued) 48-pin plastic CSOP (LCC-48P-M03) 10.00±0.20 (.394±.008) 9.50±0.10 (.374±.004) INDEX INDEX 0.05 +0.05 +.002 .002 (Stand off) LEAD 10.00±0.10(.394±.004) 0.95±0.05(.037±.002) (Mounting height) 0.22±0.035 (.009±.001) Details part 0°~10° 0.65(.026) 1.15(.045) 0.40(.016) 9.20(.362)REF 0.08(.003) 1998 FUJITSU LIMITED C48056S-1C-1 Dimensions (inches) (Continued) (Continued) 48-pin plastic FBGA (BGA-48P-M03) Note: actual shape corners differ from dimension. 9.00±0.20(.354±.008) 1.20(.047)MAX (Mounting height) 0.35±0.10(.014±.004) (Stand off) 5.60(.221) 0.80(.031)NOM 0.80(.031) 4.00(.157) 8.00±0.20 (.315±.008) INDEX (.016±.004) 0.10(.004) 1997 FUJITSU LIMITED B48003S-1C-2 Dimensions (inches) (Continued) (Continued) 48-pin plastic FBGA (BGA-48P-M13) Note: actual shape corners differ from dimension. 9.00±0.20(.354±.008) 1.05 -0.10 .041 -.004 (Mounting height) 0.38±0.10(.015±.004) (Stand off) +0.15 +.006 5.60(.221) 0.80(.031)TYP 8.00±0.20 (.315±.008) INDEX 4.00(.157) C0.25(.010) (48-.018±.004) 0.10(.004) 1998 FUJITSU LIMITED B480013S-1C-1 Dimensions (inches) FUJITSU LIMITED further information please contact: Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-8588, Japan Tel: 81(44) 754-3763 Fax: 81(44) 754-3329 Rights Reserved. contents this document subject change without notice. Customers advised consult with FUJITSU sales representatives before ordering. information circuit diagrams this document presented examples semiconductor device applications, intended incorporated devices actual use. Also, FUJITSU unable assume responsibility infringement patent rights other rights third parties arising from this information circuit diagrams. FUJITSU semiconductor devices intended standard applications (computers, office automation other office equipment, industrial, communications, measurement equipment, personal household devices, etc.). CAUTION: Customers considering products special applications where failure abnormal operation directly affect human lives cause physical injury property damage, where extremely high levels reliability demanded (such aerospace systems, atomic energy controls, floor repeaters, vehicle operating controls, medical devices life support, etc.) requested consult with FUJITSU sales representatives before such use. company will responsible damages arising from such without prior approval. semiconductor devices have inhereut chance inherently certain rate failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. products described this document represent goods technologies subject certain restrictions export under Foreign Exchange Foreign Trade Japan, prior authorization Japanese government will required export those products from Japan. http://www.fujitsu.co.jp/ North South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street Jose, 95134-1804, Tel: (408) 922-9000 Fax: (408) 922-9179 Customer Response Center Mon. Fri.: (PST) Tel: (800) 866-8608 Fax: (408) 922-9179 http://www.fujitsumicro.com/ Europe FUJITSU MIKROELEKTRONIK GmbH Siebenstein 6-10 D-63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122 http://www.fujitsu-ede.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA #05-08, Lorong Chuan Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220 http://www.fmap.com.sg/ F9904 FUJITSU LIMITED Printed Japan Other recent searchesTLV2381 - TLV2381 TLV2381 Datasheet TLV2382 - TLV2382 TLV2382 Datasheet TC7WH00FU - TC7WH00FU TC7WH00FU Datasheet TC7WH00FK - TC7WH00FK TC7WH00FK Datasheet TB62777FNG - TB62777FNG TB62777FNG Datasheet MCH6652 - MCH6652 MCH6652 Datasheet FDMS2572 - FDMS2572 FDMS2572 Datasheet CM300E3U-12H - CM300E3U-12H CM300E3U-12H Datasheet 2SD1271 - 2SD1271 2SD1271 Datasheet
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