Alternate Assembly Site Lead SOIC (300mil), AAPI Amkor Philippines
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Date: 11/11/97 Subject: PRODUCT CHANGE NOTICE K70301 Description:
Alternate Assembly Site Lead SOIC (300mil), AAPI Amkor Philippines
Description Change: AAPI being qualified alternate source Assembly Lead SOIC (300 mil) package. Device Affected: Lead SOIC' (300 mil) affected. Traceability: Customers will able distinguish between different assembly subcontractors Country Origin, which stamped bottom package. material built Amkor Philippines (AAPI) will marked "PHILIPPINES". Product built AAPI begin shipping early December 1997. Qualification Status: Dallas Semiconductor internal qualification process AAPI this product process. parts have been submitted Reliability testing. further information, please contact people listed below. further information, please contact people listed below. Swati Joshi Cash Wendel Sincerely, Assy/Packaging Engineer Engineering Manager Reliability Manager (972) 371-6561 (972) 371-4381 (972) 371-4305 (972) 371-6016 (972) 371-3726 (972) 371-6016
John Director Quality Reliability Assurance
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