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PRODUCT CHANGE NOTICE J71601 Alternate Assembly Site Lead SOIC (1


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Date: 11/6/97 Subject: Description:
PRODUCT CHANGE NOTICE J71601
Alternate Assembly Site Lead SOIC (150mil), AAPI Amkor Philippines
Description Change: AAPI been qualified alternate source Assembly Lead SOIC (150 mil) package. Device Affected: Lead SOIC' (150 mil) affected. Traceability: Customers will able distinguish between different assembly subcontractors Country Origin, which stamped bottom package. material built Amkor Philippines (AAPI) will marked "PHILIPPINES". Product built AAPI begin shipping early December 1997. Qualification Status: Dallas Semiconductor internal qualification process AAPI this product been completed. further information, please contact people listed below. further information, please contact people listed below.
Swati Joshi Cash Wendel Sincerely,
Assy/Packaging Engineer Engineering Manager Reliability Manager
(972) 371-6561 (972) 371-4381 (972) 371-4305 (972) 371-6016 (972) 371-3726 (972) 371-6016
John Director Quality Reliability Assurance

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