November 1996 PRODUCT CHANGE NOTICE J63001 Alternate Assy Site TS
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November 1996
PRODUCT CHANGE NOTICE J63001 Alternate Assy Site TSSOP Package Carsem Malaysia
Description Change: Carsem Malaysia been qualified alternate source assembly plastic TSSOP package. Devices Affected: DS222 DS229 DS1033 DS1035 DS1210 DS1267 DS1305 DS1306 DS1610 DS1667 DS1710 DS1800 DS1801 DS1806 DS1807 DS2107A DS2107C
DS232 DS1055 DS1275 DS1312 DS1669 DS1802 DS1867 DS21S07
DS275 DS1321 DS1670 DS1803 DS1868
DS1685
Traceability: Customers will able distinguish between different assembly subcontractors Country Origin stamped bottom package. material built Carsem Malaysia will marked "MALAYSIA". Product built Carsem Malaysia begin shipping early January 1997. Qualification Status: Dallas Semiconductor internal qualification Carsem Malaysia TSSOP package process will complete prior parts being released shipment. further information, please contact people listed below. Loan Cash Sincerely, Product Engineering Engineering Manager (972) 371-3792 (972) 371-4178 (972) 371-4305 (972) 371-6016
John Director Quality Reliability Assurance
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