Qualification MP8000C Mold Compound adding Hana, Hong Kong second sour
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4401 South Beltwood Parkway Dallas, Texas 75244-3292 972-371-4000 Date: Subject: Description: 8/26/98 PRODUCT CHANGE NOTIFICATION
Qualification MP8000C Mold Compound adding Hana, Hong Kong second source PLCC packages.
Description Change: Dallas Semiconductor converting MP8000C mold compound adding Hana, Hong Kong alternate assembly source PLCC packages. switch MP8000C will improve moisture sensitivity level devices. addition, MP8000C mold compound will become standard mold compound this package assembly sites. Devices Affected: DS2141A DS2151 DS87520 Traceability: Customers will able distinguish between assembly locations looking Country Origin mark backside device. "Hong Kong" will marked material assembled Hana. first date code with mold compound will 9844. Qualification Status: Dallas Semiconductor internal qualification ongoing. further information please contact people below. Mark Wolfe Richard Shine Mike Strittmatter Wendel Sincerely, Assy/Packaging Engineer Engineering Manager Assembly Manager Reliability Manager (972) 371-6488 (972) 371-5305 (972) 371-4157 (972) 371-3726 DS2180A DS2153 DS80310 DS2181A DS80320 DS80323 DS2143 DS83520
Phil Adams Director Quality Reliability Assurance
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