Date: 7/29/98 Subject: Description: PRODUCT CHANGE NOTICE G80101
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Date: 7/29/98 Subject: Description:
PRODUCT CHANGE NOTICE G80101
Alternate assembly site Amkor Philippines, Lead SOIC (150 mil) package.
Description Change: AAPI Amkor Philippines qualified alternate source assembly Lead SOIC (150 mil) package. Device Affected: DS21T05, DS21T07, DS232, DS1321, DS1803, DS2058, DS2105, DS2110, DS2114 Traceability: Customers will able distinguish between different assembly subcontractors Country Origin (CoO) stamped bottom package. material built Amkor Philippines (AAPI) will marked "PHILIPPINES". Product built AAPI begin shipping early Aug. 1998. Qualification Status: Dallas Semiconductor internal qualification process AAPI this product completed with issues. further information, please contact people listed below. Mike Strittmatter Reza Khan Richard Shine Wendel Sincerely, Assy/Pack. Eng. Mgr. Assy/Pack. Eng. Engineering Manager Reliability Manager (972) 371-4157 (972) 371-4381 (972) 371-6561 (972) 371-4381 (972) 371-3874 (972) 371-6016 (972) 371-3726 (972) 371-6016
Philip Adams Director Quality Reliability Assurance
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