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Programmable Synchronous DC/DC Converter with Controller Synchron
Top Searches for this datasheetSC1162/3 combines synchronous voltage mode controller with low-dropout linear regulator providing most circuitry necessary implement DC/DC converters powering advanced microprocessors such Pentium® SC1162/3 switching section features integrated converter, pulse pulse current limiting, integrated power good signaling, logic compatible shutdown. SC1162/3 switching section operates fixed frequency 200kHz, providing optimum compromise between size, efficiency cost intended application areas. integrated converter provides programmability output voltage from 2.0V 3.5V 100mV increments 1.30V 2.05V 50mV increments with external components. SC1162/3 linear section dropout regulator. SC1162 supplies 1.5V SC1163 features adjustable voltage. Programmable Synchronous DC/DC Converter with Controller Synchronous design, enables heatsink solution. efficiency (switching section). output programmability. chip power good function. Designed Intel Pentium® VRM8.1 requirements. 1.5V Adjustable linear section. SC1162 SC1163 Applications Pentium® microprocessor supplies Flexible motherboards 1.3V 3.5V microprocessor supplies Programmable triple power supplies Typical Application Circuit 4.7uF 1500uF 0.1uF 0.1uF PWRGOOD VID0 VID1 VID2 VID3 VID4 PWRGOOD VID0 VID1 VID2 VID3 VID4 AGND LDOV GATE LDOS CSVOSENSE BSTH BSTL PGNDH PGNDL 1500uF 0.1uF IRLR3103N 1.00k 5mOhm VCC_CORE 1.9uH IRLR3103N 2.32k 0.1uF SC1162/3CSW 3.3V 330uF IRLR024N 330uF 1.5V Revision January 2001 www.semtech.com SC1162 SC1163 POWER MANAGEMENT Absolute Maximum Ratings Parameter AGND PGNDL, PGNDH BSTH PGNDH, BSTL PGNDL Operating Temperature Range Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering) Sec. Thermal Impedance Junction Ambient Thermal Impedance Junction Case VBOOST TSTG Symbol Maximum -0.3 -0.3 +125 +150 Units °C/W °C/W Electrical Characteristics Unless specified: VIN=4.75V 5.25V; AGND=PGNDH=PGNDL=0V; VOSENSE=VO; 0mV< (CS+-CS-)< 60mV; LDOV= VBOOST= 11.4V 12.6V; 25°C Parameter Switching Section Output Voltage Supply Voltage Supply Current Load Regulation Line Regulation Minimum operating voltage Current Limit Voltage Oscillator Frequency Oscillator Duty Cycle Peak Sink/Source Current Peak Sink/Source Current Output Voltage Tempco Gain (AOL) threshold voltage source current Power good threshold voltage Dead time 2001 Semtech Corp. Conditions Units Application Circuit Output Voltage Table ppm/oC www.semtech.com 5.0V 0.8A BSTH 4.5V, BSTL 4.5V, PGNDH PGNDL VOSENSE VOVP 3.0V SC1162 SC1163 POWER MANAGEMENT Electrical Characteristics (Cont.) Parameter Linear Sections Quiescent current Output Voltage (SC1162) Reference Voltage (SC1163) Feedback Bias Current (SC1163) Gain (AOL) Load Regulation Line Regulation Output Impedance VGATE 6.5V VREF LDOS GATE LDOV 1.485 1.252 1.500 1.265 1.515 1.278 Symbol Conditions Units NOTE: This device sensitive. standard handling precautions required. 2001 Semtech Corp. www.semtech.com SC1162 SC1163 POWER MANAGEMENT Configuration VIEW AGND LDOS PWRGOOD CSCS+ PGNDH PGNDL GATE LDOV VID0 VID1 VID2 VID3 VID4 VOSENSE BSTH BSTL Ordering Information Part Number Package SO-24 SO-24 Linear Voltage 1.5V Adjustable Temp Range 125°C 125°C SC1162CSW.TR SC1163CSW.TR Note: Only available tape reel packaging. reel contains 1000 devices. SOIC) Descriptions Name AGND LDOS PWRGOOD CSCS+ PGNDH PGNDL BSTL BSTH Function Small Signal Analog Digital Ground Connection Connection Sense Input Input Voltage High signal setpoint +20% Open collector logic output, high within setpoint Current Sense Input (negative) Current Sense Input (positive) Power Ground High Side Switch High Side Driver Output Power Ground Side Swtch side Driver Output Supply Side Driver Supply High Side Driver Logic shuts down converter. High open normal operation. internal feedback chain Programming Input (MSB) Programming Input Programming Input Programming Input Programming Input (LSB) +12V section Gate Drive Output VOSENSE VID4 VID3 VID2 VID1 VID0 LDOV GATE Note: logic level inputs outputs open collector compatible. 2001 Semtech Corp. www.semtech.com SC1162 SC1163 POWER MANAGEMENT Block Diagram CSCS+ BSTH 70mV LEVEL SHIFT HIGH SIDE DRIVE VID4 VID3 VID2 VID1 VID0 VOSENSE CURRENT LIMIT OSCILLATOR PGNDH SHOOT THRU CONTROL PWRGOOD OPEN COLLECTORS ERROR BSTL SYNCHRONOUS DRIVE AGND CONTROLLER 1.5V/ADJ. PGNDL 1.265V AGND LDOV GATE LDOS AGND Setting Output Voltage. SC1163, Output voltage must selecting appropriate resistor values. These values determined from equation below, from table right. VOUT 1.265 (IFB VOUT 3.45V 3.30V 3.10V 2.90V 2.80V 2.50V 1.50V 97.6 18.7 www.semtech.com where Feedback bias current feedback resistor Bottom feedback resistor layout diagram clarification must enough that (IFB term does cause significant error 2001 Semtech Corp. SC1162 SC1163 POWER MANAGEMENT Output Voltage Table Unless specified: 4.75V 5.25V; PGND VOSENSE (CS+-CS-) 60mV; 25°C Parameter Output Voltage Conditions Application circuit 43210 01111 01110 01101 01100 01011 01010 01001 01000 00111 00110 00101 00100 00011 00010 00001 00000 11111 11110 11101 11100 11011 11010 11001 11000 10111 10110 10101 10100 10011 10010 10001 10000 1.281 1.330 1.379 1.428 1.478 1.527 1.576 1.625 1.675 1.724 1.773 1.822 1.872 1.921 1.970 2.019 1.960 2.058 2.156 2.254 2.352 2.450 2.548 2.646 2.744 2.842 2.940 3.038 3.136 3.234 3.332 3.430 1.300 1.350 1.400 1.450 1.500 1.550 1.600 1.650 1.700 1.750 1.800 1.850 1.900 1.950 2.000 2.050 2.000 2.100 2.200 2.300 2.400 2.500 2.600 2.700 2.800 2.900 3.000 3.100 3.200 3.300 3.400 3.500 1.320 1.370 1.421 1.472 1.523 1.573 1.624 1.675 1.726 1.776 1.827 1.878 1.929 1.979 2.030 2.081 2.040 2.142 2.244 2.346 2.448 2.550 2.652 2.754 2.856 2.958 3.060 3.162 3.264 3.366 3.468 3.570 Units 2001 Semtech Corp. www.semtech.com SC1162 SC1163 POWER MANAGEMENT Layout Guidelines Careful attention layout requirements necessary successful implementation SC1162/3 controller. High currents switching 200kHz present application their effect ground plane voltage differentials must understood minimized. high power parts circuit should laid first. ground plane should used, number position ground plane interruptions should such unnecessarily compromise ground plane integrity. Isolated semi-isolated areas ground plane deliberately introduced constrain ground currents particular areas, example input capacitor bottom ground. loop formed Input Capacitor(s) (Cin), (Q1) Bottom (Q2) must kept small possible. This loop contains high current, fast transition switching. Connections should wide short possible minimize loop inductance. Minimizing this loop area will reduce EMI, lower ground injection currents, resulting electrically cleaner grounds rest system minimize source ringing, resulting more reliable gate switching signals. connection between junction output inductor should wide trace copper region. should short practical. Since this connection fast voltage transitions, keeping this connection short will minimize EMI. connection between output inductor sense resistor should wide trace copper area, there fast voltage current transitions this connection length important, however adding unnecessary impedance will reduce efficiency. 0.1uF 0.1uF AGND LDOS PWRGOOD CSCS+ PGNDH PGNDL GATE LDOV VID0 VID1 VID2 VID3 VID4 VOSENSE BSTH BSTL Cout 1.00k 5mOhm Vout 2.32k SC1162/3 3.3V Cout Lin2 Lin2 Heavy lines indicate high current paths. SC1162, required. LDOS connects Layout Diagram SC1162/3 2001 Semtech Corp. www.semtech.com SC1162 SC1163 POWER MANAGEMENT Layout Guidelines Output Capacitor(s) (Cout) should located close load possible, fast transient load currents supplied Cout only, connections between Cout load must short, wide copper areas minimize inductance resistance. SC1162/3 best placed over quiet ground plane area, avoid pulse currents Cin, loop flowing this area. PGNDH PGNDL should returned ground plane close package. AGND should connected ground side (one output capacitor(s). this possible, AGND connected ground path between Output Capacitor(s) Cin, loop. Under circumstances should AGND returned ground inside Cin, loop. SC1162/3 should supplied from supply through resistor, should decoupled directly AGND 0.1µF ceramic capacitor, trace lengths should short possible. Current Sense resistor divider across should form small loop possible, traces running back SC1162/3 should parallel close each other. 0.1µF capacitor should mounted close pins possible. Ideally, grounds sections should returned ground side (one output capacitor(s). Vout Currents various parts power section 2001 Semtech Corp. www.semtech.com SC1162 SC1163 POWER MANAGEMENT Layout Guidelines COMPONENT SELECTION SWITCHING SECTION OUTPUT CAPACITORS Selection begins with most critical component. Because fast transient load current requirements modern microprocessor core supplies, output capacitors must supply transient load current requirements until current output inductor ramps level. Output capacitor therefore most important criteria. maximum simply calculated from: Where Maximum transient voltage excursion Transient current step calculated maximum inductor value assumes 100% duty cycle, some allowance must made. Choosing inductor value calculated maximum will guarantee that inductor current will ramp fast enough reduce voltage dropped across faster rate than capacitor sags, hence ensuring good recovery from transient with additional excursions. must also concerned with ripple current output inductor general rule thumb been allow maximum output current ripple current. Note that most output voltage ripple produced inductor ripple current flowing output capacitor ESR. Ripple current calculated from: ILRIPPLE fOSC example, meet 100mV transient limit with load step, output capacitor must less than 10m. meet this kind level, there three available capacitor technologies. Each Cap. Technology (µF) 1500 Qty. Rqd. (µF) 2000 7500 Total Ripple current allowance will define minimum permitted inductor value. POWER FETS FETs chosen based several criteria with probably most important being power dissipation power handling capability. power dissipation combination conduction losses, switching losses bottom body diode recovery losses. Conduction losses simply calculated PCOND RDS(on) Tantalum OS-CON Aluminum choice which simply cost/performance issue, with Aluminum being cheapest, taking most space. INDUCTOR Having decided suitable type value output capacitor, maximum allowable value inductor calculated. large inductor will produce slow current ramp rate will cause output capacitor supply more transient load current longer leading output voltage below excursion calculated above. maximum inductor value calculated from: where duty cycle Switching losses estimated assuming switching time, assume 100ns then: more generally, fOSC Body diode recovery losses more difficult estimate, first approximation, reasonable assume that stored charge bottom body diode will moved through starts turn resulting power dissipation will fOSC where lesser (VIN 2001 Semtech Corp. first order approximation, convenient only con9 www.semtech.com SC1162 SC1163 POWER MANAGEMENT Layout Guidelines sider conduction losses determine suitability. 2.8V 14.2A requirement, typical losses would Using 1.5X Room temp RDS(ON) allow temperature rise. type IRL34025 IRL2203 4410 RDS(on) 10.5 1.69 1.19 2.26 S0-8 position, power dissipation will approximately halved temperature rise reduced factor INPUT CAPACITORS since ripple current input capacitors high output current, suitable capacitors must chosen accordingly. Also, during fast load transients, there restrictions input di/dt. These restrictions require useable energy storage within converter circuitry, either extra output capacitance more usually, additional input capacitors. Choosing input capacitors will help maximize ripple rating given size. BOTTOM Bottom losses almost entirely conduction. body diode forced into conduction beginning bottom switch conduction period, when turns off, there very little voltage across resulting switching losses. Conduction losses determined PCOND RDS( example above: type IRL34025 IRL2203 Si4410 RDS(on) 10.5 1.33 0.93 1.77 Package D2Pak D2Pak S0-8 Each package types characteristic thermal impedance, TO-220 package, thermal impedance mostly determined heatsink used. surface mount packages double sided FR4, printed circuit board material, thermal impedances 40oC/W D2PAK 80oC/W SO-8 readily achievable. corresponding temperature rise detailed below: Temperature rise (oC) type IRL34025 IRL2203 4410 67.6 47.6 180.8 Bottom 53.2 37.2 141.6 apparent that single SO-8 Si4410 adequate this application, using parallel pairs each 2001 Semtech Corp. www.semtech.com SC1162 SC1163 POWER MANAGEMENT Typical Characteristics Typical Efficiency Vo=3.5V Typical Efficiency Vo=2.8V Efficiency Efficiency 3.5V 3.5V Sync 3.5V Sync 2.8V 2.8V Sync 2.8V Sync Typical Efficiency Vo=2.5V Typical Efficiency Vo=2.0V Efficiency Efficiency 2.5V 2.5V Sync 2.5V Sync 2.0V 2.0V Sync 2.0V Sync (Amps) Typical Ripple, Vo=2.8V, Io=10A Transient Response Vo=2.8V, Io=300mA 2001 Semtech Corp. www.semtech.com 2001 Semtech Corp. VOUT 4.7uF 0.1uF POWER MANAGEMENT Typical Application Circuit 1500uF 1500uF CSVO SENSE EMPTY PWRGOOD VID0 0.1uF 1.9uH IRLR3103N 5mOhm VID1 VID2 VID3 VID4 PGNDH PGNDL AGND LDOV GATE LDOS BSTL BSTH IRLR3103N 1.00k 2.32k 0.1uF PWRGOOD VID0 43210 01111 01110 01101 01100 01011 01010 01001 01000 00111 00110 00101 00100 00011 00010 00001 00000 2.10 2.20 2.30 2.40 2.50 2.60 2.70 2.80 2.90 3.00 3.10 3.20 3.30 3.40 3.50 43210 1.30 11111 1.35 11110 1.40 11101 1.45 11100 1.50 11011 1.55 11010 1.60 11001 1.65 11000 1.70 10111 1.75 10110 1.80 10101 1.85 10100 1.90 10011 1.95 10010 2.00 10001 2.05 10000 VID1 SC1162CS VID2 VCC_CORE 0.1uF VID3 IRLR024N 330uF 330uF 1.5V VID4 1500uF 1500uF 1500uF 1500uF SCOP 3.3V 330uF Schematic SC1162 (fixed output voltage) SC1163, output voltage setting resistor. Layout Diagram "Setting Output Voltage" section details 330uF SC1162 SC1163 www.semtech.com SC1162 SC1163 POWER MANAGEMENT Materials List Item Qty. C11, C12, C14, Value 0.1uF 1500uF 330uF 4.7uF 1.9uH IRLR3103N IRLR024N EMPTY 1.00k 2.32k 5mOhm DIP-6 SC1162CS OAR-1 Series Turns 16AWG MICROMETALS T50-52D core Sanyo MV-GX equiv. Notes 2001 Semtech Corp. www.semtech.com SC1162 SC1163 POWER MANAGEMENT Outline Drawing Contact Information Semtech Corporation Power Management Products Division Mitchell Rd., Newbury Park, 91320 Phone: (805)498-2111 (805)498-3804 2001 Semtech Corp. www.semtech.com Other recent searchesZG-1435-5B - ZG-1435-5B ZG-1435-5B Datasheet ZG-1435-5BD - ZG-1435-5BD ZG-1435-5BD Datasheet SPT7820 - SPT7820 SPT7820 Datasheet SD4145 - SD4145 SD4145 Datasheet NDF433 - NDF433 NDF433 Datasheet MC13180PP - MC13180PP MC13180PP Datasheet Luxeon - Luxeon Luxeon Datasheet Star - Star Star Datasheet Technical - Technical Technical Datasheet Datasheet - Datasheet Datasheet Datasheet KA1M0880D - KA1M0880D KA1M0880D Datasheet EIC4853-25 - EIC4853-25 EIC4853-25 Datasheet
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