August 1995 PRODUCT CHANGE NOTICE G51901 Additional Assembly Site

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August 1995 PRODUCT CHANGE NOTICE G51901 Additional Assembly Site

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August 1995
PRODUCT CHANGE NOTICE G51901 Additional Assembly Site DS500X DS53XX Devices
Description Change: DS500X DS53XX families microprocessors will have additional second source subcontractor assembly site added plastic package types. additional assembly site Carsem, located Malaysia. Once this additional capacity qualified on-line, Dallas Semiconductor will ship product assembled either site interchangeably. Traceability: Material from assembly subcontractor will easily identifiable country origin stamped bottom package (Malaysia Carsem facility, Korea current ANAM facility). Material from assembly facility will have date codes 9524 later, customers begin receiving material from assembly site early September 1995. Qualification Status: Material assembled assembly site currently undergoing qualification testing. Qualification data should available September 1995. further information, please contact Reliability Department Dallas Semiconductor. Cash Wendel
Sincerely,
Engineering Manager Reliability Manager
(214) 450-5305 (214) 450-8178 (214) 450-3726 (214) 450-8178
John Director Quality Reliability Assurance

August 1995 PRODUCT CHANGE NOTICE G51901 Additional Assembly Site

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