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August 19, 1995

PRODUCT CHANGE NOTICE ­ G51901 Additional Assembly Site for DS500X and DS53XX Devices

DALLAS SEMICONDUCTOR
4401 South Beltwood Parkway Dallas, Texas 75244-3292 (214) 450-0400
Date: Subject: Description:
August 19, 1995
PRODUCT CHANGE NOTICE - G51901 Additional Assembly Site for DS500X and DS53XX Devices
Description of Change: The DS500X and DS53XX families of microprocessors will have an additional second source subcontractor assembly site added for 80 pin QFP plastic package types. The additional assembly site is Carsem, located in Malaysia. Once this additional capacity is qualified and is on-line, Dallas Semiconductor will ship product assembled at either site interchangeably. Traceability: Material from the new assembly subcontractor will be easily identifiable by the country of origin stamped on the bottom of the package (Malaysia for the new Carsem facility, Korea for the current ANAM facility). Material from the new assembly facility will have date codes of 9524 or later, and customers may begin receiving material from the new assembly site as early as September 30, 1995. Qualification Status: Material assembled at the new assembly site is currently undergoing qualification testing. Qualification data should be available by September 15, 1995. For further information, please contact the Reliability Department of Dallas Semiconductor. Mr. Lee Cash Mr. Ken Wendel
Sincerely,
QA Engineering Manager Reliability Manager
(214) 450-5305 / FAX (214) 450-8178 (214) 450-3726 / FAX (214) 450-8178
John Rea Director Quality and Reliability Assurance