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25A, 50V, 0.047 Ohm, Logic Level, N-Channel Power MOSFET Title vel, OS
Top Searches for this datasheetRFP25N05L 25A, 50V, 0.047 Ohm, Logic Level, N-Channel Power MOSFET Title vel, OST) utho eyrds terrpoon, vel, OST, RFP25N05L N-Channel logic level power MOSFETs manufactured using MegaFET process. This process, which uses feature sizes approaching those integrated circuits gives optimum utilization silicon, resulting outstanding performance. RFP25N05L designed with logic level (5V) driving sources applications such programmable controllers, automotive switching, switching regulators, switching converters, motor relay drivers emitter switches bipolar transistors. This performance accomplished through special gate oxide design which provides full rated conductance gate biases range, thereby facilitating true on-off power control directly from logic circuit supply voltages. Formerly developmental type TA09871. Features 25A, rDS(ON) 0.047 Rating Curve (Single Pulse) Design Optimized Gate Drives Driven Directly from CMOS, NMOS, Circuits Compatible with Automotive Drive Requirements Power Dissipation Limited Nanosecond Switching Speeds Linear Transfer Characteristics High Input Impedance Majority Carrier Device Related Literature TB334 "Guidelines Soldering Surface Mount Components Boards" Ordering Information PART NUMBER RFP25N05L NOTE: PACKAGE TO-220AB BRAND RFP25N05L Symbol When ordering, include entire part number. Packaging JEDEC TO-220AB SOURCE DRAIN GATE DRAIN (FLANGE) ©2001 Fairchild Semiconductor Corporation RFP25N05L Rev. RFP25N05L Absolute Maximum Ratings 25oC, Unless Otherwise Specified RFP25N05L Refer Curve 0.48 UNITS W/oC Drain Source Voltage (Note Drain Gate Voltage (RGS 20k) (Note .VDGR Continuous Drain Current Pulsed Drain Current (Note Single Pulse Avalanche Energy Rating (See Figures 16). Gate Source Voltage Maximum Power Dissipation Linear Derating Factor above 25oC Operating Storage Temperature TSTG Maximum Temperature Soldering Leads 0.063in (1.6mm) from Case 10s. Package Body 10s, Techbrief .Tpkg CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied. NOTE: 25oC 125oC. Electrical Specifications PARAMETER 25oC, Unless Otherwise Specified SYMBOL BVDSS VGS(TH) IGSS IDSS TEST CONDITIONS 250µA (Figure VDS, 250µA (Figure ±10V, 40V, 150oC (Figures 40V, 25A, (Figures ±100 0.047 0.056 2.083 UNITS oC/W oC/W Drain Source Breakdown Voltage Gate Threshold Voltage Gate Source Leakage Zero Gate Voltage Drain Current Drain Source Resistance (Note rDS(ON) Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time Total Gate Charge (Gate Source Gate Drain) Gate Charge Threshold Gate Charge Thermal Resistance Junction Case Thermal Resistance Junction Ambient t(ON) td(ON) td(OFF) t(OFF) Qg(TOT) Qg(5) Qg(TH) 25V, =12.5A (Figures Source Drain Diode Specifications PARAMETER Source Drain Diode Voltage Diode Reverse Recovery Time NOTES: Pulse Test: Pulse width 80µs, duty cycle Repetitive Rating: Pulse width limited junction temperature. SYMBOL 25A, dISD/dt 100A/µs TEST CONDITIONS UNITS ©2001 Fairchild Semiconductor Corporation RFP25N05L Rev. RFP25N05L Typical Performance Curves POWER DISSIPATION MULTIPLIER DRAIN CURRENT Unless Otherwise Specified CASE TEMPERATURE (oC) CASE TEMPERATURE (oC) FIGURE NORMALIZED POWER DISSIPATION CASE TEMPERATURE FIGURE MAXIMUM CONTINUOUS DRAIN CURRENT CASE TEMPERATURE CONTINUOUS DRAIN CURRENT OPERATION THIS AREA LIMITED rDS(ON) RATED, 25oC IAS, AVALANCHE CURRENT STARTING 25oC STARTING 150oC (L)(IAS)/(1.3 RATED BVDSS VDD) (L/R)ln[(IAS*R)/(1.3 RATED BVDSS VDD) 0.01 0.10 tAV, TIME AVALANCHE (ms) VDSS (MAX) VDS, DRAIN SOURCE VOLTAGE FIGURE FORWARD BIAS SAFE OPERATING AREA FIGURE UNCLAMPED INDUCTIVE SWITCHING (SINGLE PULSE SOA) IDS, DRAIN SOURCE CURRENT 5.0V 25oC 4.0V IDS(ON), DRAIN SOURCE CURRENT VGS, GATE SOURCE VOLTAGE PULSE DURATION 80µs DUTY CYCLE 0.5% PULSE DURATION 80µs DUTY CYCLE 0.5% 3.0V 2.0V VDS, DRAIN SOURCE VOLTAGE FIGURE SATURATION CHARACTERISTICS FIGURE TRANSFER CHARACTERISTICS ©2001 Fairchild Semiconductor Corporation RFP25N05L Rev. RFP25N05L Typical Performance Curves NORMALIZED DRAIN SOURCE RESISTANCE PULSE DURATION 80µs DUTY CYCLE 0.5% VGS, GATE SOURCE VOLTAGE Unless Otherwise Specified (Continued) NORMALIZED DRAIN SOURCE RESISTANCE 25A, PULSE DURATION 80µs DUTY CYCLE 0.5% JUNCTION TEMPERATURE (oC) FIGURE DRAIN SOURCE RESISTANCE GATE VOLTAGE DRAIN CURRENT NORMALIZED GATE THRESHOLD VOLTAGE FIGURE NORMALIZED DRAIN SOURCE RESISTANCE JUNCTION TEMPERATURE 250µA NORMALIZED DRAIN SOURCE BREAKDOWN VOLTAGE 250µA JUNCTION TEMPERATURE (oC) JUNCTION TEMPERATURE (oC) FIGURE NORMALIZED GATE THRESHOLD JUNCTION TEMPERATURE 2000 1MHz CISS CRSS COSS FIGURE NORMALIZED DRAIN SOURCE BREAKDOWN VOLTAGE JUNCTION TEMPERATURE GATE SOURCE VOLTAGE IG(REF) 0.60mA PLATEAU VOLTAGES DESCENDING ORDER: BVDSS 0.75 BVDSS 0.50 BVDSS BVDSS 0.25 BVDSS GATE SOURCE VOLTAGE 1600 CAPACITANCE (pF) DRAIN SOURCE VOLTAGE 37.5 1200 CISS 12.5 DRAIN SOURCE VOLTAGE TIME (µs) COSS CRSS VDS, DRAIN SOURCE VOLTAGE NOTE: Refer Intersil Application Notes AN7254 AN7260 FIGURE CAPACITANCE VOLTAGE FIGURE NORMALIZED SWITCHING WAVEFORMS CONSTANT GATE CURRENT ©2001 Fairchild Semiconductor Corporation RFP25N05L Rev. RFP25N05L Test Circuits Waveforms BVDSS VARY OBTAIN REQUIRED PEAK 0.01 FIGURE UNCLAMPED ENERGY TEST CIRCUIT FIGURE UNCLAMPED ENERGY WAVEFORMS tOFF td(OFF) td(ON) PULSE WIDTH FIGURE SWITCHING TIME TEST CIRCUIT (ISOLATED SUPPLY) FIGURE RESISTIVE SWITCHING WAVEFORMS CURRENT REGULATOR SAME TYPE Qg(TOT) BATTERY 0.2µF 0.3µF Ig(REF) CURRENT SAMPLING RESISTOR CURRENT SAMPLING RESISTOR Ig(REF) FIGURE GATE CHARGE TEST CIRCUIT FIGURE GATE CHARGE WAVEFORMS ©2001 Fairchild Semiconductor Corporation RFP25N05L Rev. TRADEMARKS following registered unregistered trademarks Fairchild Semiconductor owns authorized intended exhaustive list such trademarks. Quiet SeriesDISCLAIMER FAST PACMANPOPPowerTrench QFETQSQT OptoelectronicsQuiet SeriesSILENT SWITCHER SMART STARTStar* PowerStealth SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices critical component component life support device system whose failure perform systems which, intended surgical implant into reasonably expected cause failure life body, support sustain life, whose support device system, affect safety failure perform when properly used accordance with instructions provided labeling, effectiveness. reasonably expected result significant injury user. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data, supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice order improve design. Preliminary First Production Identification Needed Full Production Obsolete Production This datasheet contains specifications product that been discontinued Fairchild semiconductor. datasheet printed reference information only. Rev. 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