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NCHT TRENFE SO-8 0.197 (5.00) 0.189 (4.80) 0.157 (3.99) 0.15


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GF4936
NCHT TRENFE
SO-8
0.197 (5.00) 0.189 (4.80) 0.157 (3.99) 0.150 (3.81) 0.244 (6.20) 0.228 (5.79)
RDS(ON) 5.8A
Dimensions inches (millimeters)
0.019 (0.48) 0.010 (0.25)
0.05 (1.27) 0.04 (1.02) 0.245 (6.22) Min. 0.165 (4.19) 0.155 (3.94)
0.050 (1.27)
0.020 (0.51) 0.013 (0.33) 0.069 (1.75) 0.053 (1.35) 0.009 (0.23) 0.004 (0.10)
0.009 (0.23) 0.007 (0.18)
0.035 (0.889) 0.025 (0.635)
0.050(1.27) 0.016 (0.41)
0.050 typ. (1.27)
Mounting Layout
Mechanical Data
Case: SO-8 molded plastic body Terminals: Leads solderable MIL-STD-750, Method 2026 High temperature soldering guaranteed: 250°C/10 seconds terminals Mounting Position: Weight: 0.5g
Features
Advanced Trench Process Technology High Density Cell Design Ultra On-Resistance Specially Designed Voltage DC/DC Converters Fast Switching High Efficiency
Maximum Ratings Thermal Characteristics
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Maximum Power Dissipation(1) 25°C 70°C
25°C unless otherwise noted)
Symbol Tstg
Limit
Unit
62.5
°C/W
Operating Junction Storage Temperature Range Maximum Junction-to-Ambient Thermal Resistance
Note: Surface mounted board, sec.
4/11/01
GF4936
Electrical Characteristics
Parameter Static Drain-Source Breakdown Voltage Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Current
25°C unless otherwise noted)
Symbol
Test Condition
Unit
BVDSS VGS(th) IGSS IDSS ID(on) RDS(on)
250µA VGS, 250µA 30V, 10V, 5.8A 4.5V, 4.7A
23.5 32.5
Drain-Source On-State Resistance(2) Forward Transconductance(2) Dynamic Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Source-Drain Diode Maximum Diode Forward Current Diode Forward Voltage
15V, 5.8A
td(on) td(off) Ciss Coss Crss 15V, 5.8A 15V, VGEN 1.0MHZ
1.7A,
0.75
Notes: Surface mounted board, sec. Pulse test; pulse width duty cycle
toff
Switching Test Circuit
VGEN
VOUT
Switching Waveforms
td(on)
td(off)
INVERTED
Output, VOUT
Input,
PULSE WIDTH
GF4936
Ratings Characteristic Curves
25°C unless otherwise noted)
Fig. Output Characteristics
Drain-to-Source Current
7.0V 6.0V 5.0V 4.5V 4.0V
Fig. Transfer Characteristics
Drain Current
3.5V
3.0V 2.5V
125°C 25°C
-55°C
Drain-to-Source Voltage
Gate-to-Source Voltage
Fig. Threshold Voltage Temperature
VGS(th) Gate-to-Source Threshold Voltage
250µA 0.045 0.05
Fig. On-Resistance Drain Current
RDS(ON) On-Resistance
0.04 0.035 0.03 0.025 0.02 0.015 0.01 4.5V
Junction Temperature (°C)
Drain Current
Fig. On-Resistance Junction Temperature
RDS(ON) On-Resistance (Normalized)
5.8A
Junction Temperature (°C)
GF4936
Ratings Characteristic Curves
25°C unless otherwise noted)
Fig. On-Resistance Gate-to-Source Voltage
0.12
Fig. Gate Charge
Gate-to-Source Voltage
5.8A
5.8A
RDS(ON) On-Resistance
0.08
0.06 125°C
0.04 0.02
25°C
Gate-to-Source Voltage
Gate Charge (nC)
Fig. Capacitance
1200 1000 1MHZ
Fig. Source-Drain Diode Forward Voltage
Source Current
Capacitance (pF)
Ciss
125°C 25°C
Coss Crss
-55°C
0.01
Drain-to-Source Voltage
Source-to-Drain Voltage
GF4936
Ratings Characteristic Curves
25°C unless otherwise noted)
Fig. Breakdown Voltage Junction Temperature
250µA
Fig. Thermal Impedance
(norm) Normalized Thermal Impedance
0.05 0.02 0.01 0.01 Duty Cycle, t1/t2 RJA(norm) *RJA 82°C/W 1-in2 FR-4)
BVDSS Drain-to-Source Breakdown Voltage
Single Pulse 0.001 0.0001 0.001 0.01
Junction Temperature (°C)
Pulse Duration (sec.)
Fig. Power Pulse Duration
Single Pulse 82°C/W 25°C
Fig. Maximum Safe Operating Area
Drain Current
Power
RDS(ON) Limit
Single Pulse 1-in2 25°C
0.01
0.01
Pulse Duration (sec.)
Drain-Source Voltage

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