LATEST TECHNOLOGICAL TRENDS VLSI PACKAGES DEVELOPMENT PACKAGES Hi
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LATEST TECHNOLOGICAL TRENDS VLSI PACKAGES DEVELOPMENT PACKAGES
Hisao Kasuga/Miwa Momma
Introduction Consumers expect constant progress electronic systems record-breaking size reduction each time product released. kindle consumers' interest, manufacturers required produce supply ever more sophisticated compact products. important points producing such products packaging technologies, i.e., reduce space necessary packaging devices mount devices printed circuit board without affecting their functions. This article introduces newest packages developed latest market trends. Market Trends Packages Increased demand (Ball Grid Array) packages Figure analyzes expected demand packages, based report Data Quest. According this analysis, demand BGAs expected grow substantially. balls placed grid pattern under
1997
Bare Others (Annual growth rate) Bare
2000
Others
4,444
(million units/month) Mpcs/M
115%
6,796
(million units/month) Mpcs/M
Packages
Bare
Bare
(Annual growth rate)
Gate Arrays
(million units/month) Mpcs/M
111%
(million units/month) Mpcs/M
Fig. Expected Global Demand Packages
VLSI Package Development Department, VLSI Packaging Testing Engineering Division
interposer, these balls interface printed circuit board place leads say, QFP. Although demand BGAs represents only small share overall demand packages, BGAs expected employed gate arrays year 2000. reason BGAs expected grow rapidly explained factors mounting characteristics. number pins device increases, number pins QFPs also increases. With QFP, however, only leads available four directions. increase number leads available, necessary increase package size narrow lead pitch. result, QFPs measuring with lead pitch available. However, difficult establish technology mounting QFPs with pitch less. also difficult ensure coplanarity leads when package produced. These problems faced both assembly manufacturers semiconductor device manufacturers. these problems solved
30.2mm
27mm
225-Pin 208-Pin
0.5mm Pitch
pitch increased 300% 0.75
1.5mm 0.75
Fig. 208-Pin 225-Pin packages. Because package have many rows balls grid form, increase number pins without increasing package size, expand lead pitch. Figure shows comparison example between BGA. shown, smaller than have lead pitch three times larger than that (there report that defect ratio mounting BGAs 1/20 that QFPs). Moreover, many packages mounted with circuit side device facing down (facedown mounting). result, inductance lowered compared with QFPs. This means that packages more suitable devices that required operate high frequencies more. Because above advantages, BGAs will inevitably employed products future, giving rise trend package development. Figure
From peripheral mounting area array mounting
Peripheral Mounting
Pitch (mm)
Area Mounting Peripheral Bare Area Bare 1000 2000
Number Package Pins
Fig. Trend High-Density Mounting Technology
(Pin Count) 1200 1100 1000
sample mass production sample mass production
Tape-BGA 1.0-mm pitch
0.5-mm pitch
Multi-Pin Packages family P-BGA family
Higher Count
1.5-mm pitch (mm)
Wire
Body size
Fig. Development shows trend high-density mounting technologies each type package. types packages Figure shows relation between number pins body size packages recently developed. This figure implies that recent packages
Miniaturization classified into following types: Large body with many pins (500 pins more) Super small body with fewer pins (200 pins) first type package mainly required high-end applications such workstations, second type required portable systems such handy cameras cellular telephones. calls type multi-pin package family type (Chip Size Package) family, develops several types packages each type satisfy various requirements performance usage requirements.
Single layer Cavity PBGA count:
Chip Through hole Gold wire Resin Silver paste Substrate Solder ball Copper wiring
Multi layer Advanced count:
Heat spreader Chip Resin Substrate
PBGA
Low-cost 1-metal TBGA count:
Heat spreader Support ring
Solder resist
super high-speed device super-low thermal resistance 2-metal TBGA count: 1,000
Heat spreader Support ring Signal wiring Ground layer Ground ball
Solder ball
Chip Resin tape
Chip Resin Blind Solder ball
TBGA
Thin high-speed device
thermal resistance fine pitch
high count super high-speed device
Thin fine pitch
Table Multi-Pin Packages
NEC's Development Packages Multi-pin package family, PBGA TBGA offers types packages depending base materials used balls: plastic (PBGA) tape (TBGA). These types packages further classified into four types shown Table Table lists available packages. PBGA single-layer model this type package face-up mounting type excellent cost effectiveness. multi-layer type face-down mounting type improved thermal resistance frequency characteristics with heat spreader provided standard. This type called ABGA (Advanced BGA). TBGA TBGA packages divided into 1-metal models 2-metal models according number wiring layers tape. These packages slimmer than PBGAs suitable high-density wiring patterns. TBGA packages have many 1,000 pins. While PBGA packages wire bonding method, TBGA packages employ (Tape Automated Bonding) method, that they surpass PBGAs shrinking pitch device. Already, TBGAs with pitch available. Packages with 40-µm pitch under development. offers four types CSPs shown Photograph these packages small lightweight. Figure compares CSPs with QFPs. Table lists features CSPs. best suited structure selected based required performance semiconductor devices. Mold This type package under development package memories that have relatively small number pins which cost priority. internal structure basically same that TSOPs. This package sealed with plastic mold resin. FPBGA FPBGAs miniature versions
Type
Body Size (mm)
Count
Ball Pitch (mm) 1.27 1.27 2.54 staggered 1.27
Development Status
PBGA cavity
ABGA TBGA1 metal TBGA2 metal
Released, Under development
1.27 1.27 1.27 1.27
Table Multi-Pin Package Lineup
Photo NEC's CSPs
FPBGA: 0.8-mm pitch, pins 12mm 12mm 0.29g 32mm 32mm 5.2g
0.5-mm pitch, pins 10mm x10mm 0.18g 30.6mm 30.6mm 5.6g
Size: 85.9% down Weight: 94.4% reduction
Size: 89.3 down Weight: 96.8% reduction
Fig. Comparison Packages PBGA. Although these packages cannot size real chip, their bonding wires extremely short. addition, FPBGAs have excellent cost effectiveness. Because expansion coefficient materials used form balls equivalent that mother board which package mounted, FPBGAs have excellent solderjoint reliability after they mounted board. These packages mainly used house logic devices having medium number pins employed portable systems. (Lead Less Chip BGA) This flip chip type under development devices that required operate faster than devices housed FPBGAs. addition, because balls placed required, this package advantageous applications where maintaining compatibility with existing packages required. D2BGA (Die Dimension BGA) D2BGA package ultimate having these features: Size almost equal real chip (device size package size) Fanout structure possible (Ball wiring extracted outside device.) Useful shrinking pitch device area placement used wide range devices, from memory ASIC Excellent electrical characteristics This package been employed digital cameras, where there fierce competition miniaturization. features through-hole tape plate bump connect device. addition, "resin reinforcement technology" also been developed that this package mounted without problem even demand decreasing ball pitch arises future. D2BGA package used without underfill process even when ball pitch becomes less than 0.5mm. Figure shows data this package. Tables show available models FPBGA D2BGA. Future Environment Surrounding Packages Each semiconductor manufacturer competes with others developing
Structure Mold Usage General-purpose memory FPBGA Super small logic pins with many pins Package with compatibility also produced Real chip size Hight flexibility designing Very thin Excellent electrical characteristics About 40-µm staggered
Logic device with medium Logic device with medium count number pins cost Package with compatibility also produced Excellent solder-joint reliability temperature cycling test after mounted board About 60-µm staggered High flexibility designing Excellent electrical characteristics
Superiority
Super cost comparable TSOP
count Ball pitch Available pitch device
less (1.27) 60-µm staggered
About 80-µm staggered
Table NEC's CSPs
Body Size (mm)
Count
Size Mountable Chip
Ball Pitch (mm)
Ball Arrangement
10.5 10.5
11.5 11.5
12.5 12.5
13.5 13.5
14.5 14.5
17.5 17.5
Subject change depending layout chip
Table FPBGA Package Lineup production technology, tries satisfy user demands making best production lines, know-how, imagination. Therefore, many packages that look like BGAs have completely different internal structures have been introduced. other words, packages evolving quite differently from other packages. Each manufacturer packages trying establish facto standards. However, believes that four types packages described above satisfy demands. same time, also expects following types demand grow future: Demand packages with sophisticated functions devices that incorporate functions system (system-ona-chip) emerge Demand combining multiple devices
Body Size (mm)
Count
Size Mountable Chip
Ball Pitch (mm)
Ball Arrangement
11.9 11.9
(mm)
rows
7.83 14.76 7.38 14.76 (mm) rows
This example calculated based real-chip size type. data subject change depending layout chip.
Table D2BGA Package Lineup package create complete system (system-on-chips) Demand (Multi-Chip Module) satisfy these demands, plans develop more multi-pin packages. Conclusion expected that devices packages will more closely relate each other designing systems that boundary between them will gradually disappear. This article introduced many
coating reinforcement resin Coating reinforcement resin
packages developed NEC. promote better understanding these packages, preparing package catalogs. These catalogs explain package structures lineups, also present practical information mounting packages, which used when creating systems trial basis. Such catalog CSPs already been completed, family brochure, including PBGAs TBGAs, being prepared.
plans continue developing packages that satisfy user demands supply information related such packages timely basis.
Accumulated Failure Rate
Before measures Substantial improvement With under fill (defective board) side Improvement
side 1000 Number Cycles (-25°C 2000 125°C)
crack side
3000
Fig. Mounting Reliability with 0.5-mm Pitch (Life Soldered Junction)
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