Quality assurance reliability ROHM product quality quality first

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

Quality assurance reliability ROHM product quality quality first

Datasheet Thumbnail

Top Searches for this datasheet

Quality assurance reliability
Quality assurance reliability
ROHM product quality quality first "Quality" here refers both integrity products that manufacture price timely delivery those products customers. Although utmost effort into each these factors, give particular emphasis integrity product. striving minimize defects semiconductor devices both initial defect stage incidental defect stage. incidental defect rate approaching constant value. Most device manufacturers approaching same level products where there major design problems. Therefore, making supreme efforts bring semiconductor devices customers which have already been appropriately screened. eliminating devices with hidden defects, have reduced customer-perceived defect rate level close possible incidental defect rate These efforts insure that customers receiving products with minimum defect rate. products have earned reputation their high reliability with customers. Quality assurance activities Education training accordance with fundamental goals company, educate train personnel every division they produce reliable, quality products. Particular emphasis placed quality control, production control, research design, purchasing, manufacturing, management. Inspection calibration measuring devices used manufacturing process undergo periodic inspection recalibration based critical measuring device standards. Manufacturing control ROHM developed internal standards control materials testing, manufacturing conditions, inspection methods, other operations. Additionally, dust, humidity temperature strictly controlled manufacturing areas, accordance with ROHM standards.
Quality assurance system quality assurance system requires testing each major step manufacturing process. addition, precise inspections conducted after final assembly. example, after wafers processed, electrical characteristics wafers measured gauge accuracy each process. short-term endurance test carried each wafer. These tests allow assure reliability wafers. After diodes assembled, ensure quality products conducting multiple measurements high degree precision. Fig. shows system quality assurance.
Quality assurance reliability
Reliability testing order verify reliability finished products state quality control program entire manufacturing process, periodically carry reliability test products that manufacture.
Table
Test Test conditions Immersion Tolerance Length solder lead must Related standards 7021
Solderability seconds
230°C solder bath Pull terminal lead with 500g load terminal lead seconds Tensile Immerse 1.5mm terminal lead 350°C solder bath hours 100°C
strength
7021 A-11
resistance Boiling cycling shock
Thermal
Solder heat
7021
Tstg (Min.) Tstg (Max.)
-65°C (5') 100°C (5') 125°C atmospheric pressure relative humidity 85%, hours Ta=85°C VF<U IR<U
7021 7021
Thermal
cooker
Pressure
temperature RH=85%,
Aging test high temperature Small signal
Exposure high
humidity 1,000 hours Ta=Tstg (Max.), 1,000 hours Ta=25°C, IF=IO hours hours off, repeated over 1,000 hours Ta=25°C
7021 B-11
diode load
life Constant operation Rectifier
7021 B-10 mechanical damage 7021
voltage diode Pd=Pd (Max.), continuous diode continuous
operation Variable capacitance diode, high temperature reverse bias life
1,000 hours
7021
IF=IO TaTj (Max.), 1,000 hours
7021 B-13
VR=VRM TaTj (Max.), 1,000 hours
7021
Upper limit standard
Quality assurance reliability
Diode quality assurance system
Related divisions
Quality assurance testing
Related divisions
Receive materials Monitor quality manufacturing supplier's factory. Confirm receipt monthly quality report. Inspect materials Inspect samples material batch, conduct physical chemical analysis. Initiate in-process quality control. Exterior inspection measurement electrical characteristics. Assess yield inspecting first assemblies. Test short term endurance static characteristics. Initiate in-process quality control. Screen products testing electrical thermal properties. Inspect exterior electrical characteristics products. Inspect exterior electrical characteristics random sampling products.
Manufacture wafers Inspect pellets
Quality assurance testing
Assemble diodes Screen diodes
Inspect diodes Inspect product
Ship products
Fig. Quality assurance testing system
Predicting reliability most frequently used methods predicting reliability electronic components described MILHDBK217F, "Prediction Reliability Electronic Devices". your reference, will summarize section related semiconductor devices.
Predicting failure rate discrete semiconductor devices model shown here predicts failure rate low-frequency diodes. This model predicts failure rate discrete semiconductor devices using formula where b=The basic failure rate shown Table determined diode type application. T=Temperature factor (Tables S=Electrical stress factor (Table C=Contact structure factor (Table Q=Quality factor (Table E=Environmental factor (Table
Table Basic failure rate model
Diode type/application Analog diode, general Switching diode Power rectifier, fast recovery Power rectifier, Schottky power diode High-voltage, multi-layered power rectifier Transient suppressor/varistor diode Current regulator Voltage regulator standard voltage application (avalanche Zener diodes) .0038 .0010 .069 .0030
.005 junction .0013 .0034 .0020
Quality assurance reliability
Table Temperature factor (Applicable voltage regulator, standard voltage application, current regulator diodes) Table Temperature factor (Applicable analog general use, switching, fast recovery, power rectifier, transient suppressor diodes)
(°C)
(°C)
(°C)
(°C)
=exp
-1925
Tj+273
=exp -3091
Tj+273
Tj=Junction temperature (°C)
Tj=Junction temperature (°C)
Table Electrical stress factor
Table Contact structure factor
Stress
Transient suppressor, voltage regulator, standard voltage application, current regulator
Contact structure Metal connectors
Non-metallic connectors spring-loaded contacts
others Vs.30 .3<Vs.40 .4<Vs.50 .5<Vs.60 .6<Vs.70 .7<Vs.80 .8<Vs.90 .9<Vs.1.0 0.054 0.11 0.19 0.29 0.42 0.58 0.77
Quality factor=2.4 (from MIL-HDBK-217F) Enviroment factor=9.0 (from MIL-HDBK-217F)
except transient suppressor, voltage regulator, standard voltage application, current regulator diodes: =0.54 (Vs.3) 2.43 (.3<Vs1) Applied voltage Constant voltage Voltage diode reverse voltage. Vs=Voltage stress ratio=
Quality assurance reliability
Table Quality factors
Table Environment factors
Quality JANTXV JANTX Lower quality Plastic
Environment Ground, benign Ground, fixed Ground, mobile Naval, sheltered Naval, unsheltered Airbone, inhabited, cargo Airbone, inhabited, fighter Airbone, uninhabited, cargo Airbone, uninhabited, fighter Airbone, rotary winged Space, flight Missile, free flight Missile, launch Cannon, launch
Example predicted failure rate calculations [Question] What would Predicted faibure rate switching diode (Specifications DO-35 package, TMax.=175°C, P=500mW, quality equivalence grade, contact structure non-metallic alloy spring -loaded contact) operated case temperature 62%, rated load 60%, constant voltage 30%, room temperature Ta=25°C? [Calculation] Because this switching diode, b=0.0010 (based Table P=500mW with load 50%, case temperature 55°C. Tj=Tc+JCP =62°C+10°C where T=3.4, based Table From Table S=0.054 From Table C=2.0 From Table Q=2.4 From Table E=9.0 0.0079/106hours junction-to-case thermal resistance diode with case similar DO-35 package.

Quality assurance reliability ROHM product quality quality first

Top Searches for this datasheet

Other recent searches