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Access Times 120, 150ns Packaging lead, 40mm square, Hermetic CQFP (Pa
Top Searches for this datasheetWF128K64-XG4WX5 128Kx64 FLASH MODULE Access Times 120, 150ns Packaging lead, 40mm square, Hermetic CQFP (Package 504) Sector Architecture equal size sectors 16KBytes each combination sectors concurrently erased. Also supports full chip erase 100,000 Erase/Program Cycles Minimum (0°C 70°C) Data Retention, Year Minimum 125°C Organized 128Kx64, user configurable 256Kx32, 512Kx16 1Mx8. Commercial, Industrial Military Temperature Ranges Volt Programming; ±10%) Supply Power CMOS, Standby Typical Hardware Software Write Protection Compatible Inputs Outputs Built-in Decoupling Caps Multiple Ground Pins Noise Operation Weight WF128K64-XG4WX5 grams typical This data sheet describes product under development subject change without notice. Note: Programming information available upon request. PRELIMINARY* FIG. CONFIGURATION WF128K64-XG4WX5 BLOCK DIAGRAM VIEW I/O2 I/O1 I/O0 I/O63 I/O62 I/O61 A0-16 128K 128K 128K September 1998 I/O29 I/O30 I/O31 I/O32 I/O33 I/O34 I/O3 I/O4 I/O5 I/O6 I/O7 I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 I/O24 I/O25 I/O26 I/O27 I/O28 I/O60 I/O59 I/O58 I/O57 I/O56 I/O55 I/O54 I/O53 I/O52 I/O51 I/O50 I/O49 I/O48 I/O47 I/O46 I/O45 I/O44 I/O43 I/O42 I/O41 I/O40 I/O39 I/O38 I/O37 I/O36 I/O35 I/O0-7 I/O8-15 I/O. I/O56-63 DESCRIPTION I/O0-63 A0-16 WE1-8 CS1-8 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Connected FLASH MODULES White Microelectronics Phoenix, (602) 437-1520 WF128K64-XG4WX5 ABSOLUTE MAXIMUM RATINGS Parameter Operating Temperature Supply Voltage Range (VCC) Signal voltage range (any except Storage Temperature Range Lead Temperature (soldering, seconds) Data Retention Temp Endurance (write/erase cycles) Temp Voltage sector protect (VID) +125 -2.0 +7.0 -2.0 +7.0 +150 +300 years 10,000 cycles min. -2.0 +14.0 Parameter capacitance capacitance capacitance Data capacitance Address input capacitance Unit RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Input High Voltage Input Voltage Operating Temp. (Mil.) Voltage Sector Protect Symbol -0.5 11.5 +0.8 +125 12.5 Unit CAPACITANCE +25°C) Symbol CI/O Conditions VI/O Unit NOTES: Stresses above absolute maximum rating cause permanent damage device. Extended operation maximum levels degrade performance affect reliability. Minimum voltage input pins -0.5V. During voltage transitions, inputs overshoot -2.0 periods 20ns. Maximum voltage output pins 0.5V. During voltage transitions, outputs overshoot periods 20ns. Minimum input voltage -0.5V. During voltage transitions, overshoot periods 20ns. Maximum input voltage +13.5V which overshoot 14.0 periods 20ns. This parameter guaranteed design tested. CHARACTERISTICS CMOS COMPATIBLE (VCC 5.0V, -55°C +125°C) Parameter Input Leakage Current Output Leakage Current Active Current Read Active Current Program Erase Symbol LOx32 ICC1 Conditions 5.5, 5.5, VIL, 5.5, 5MHz 5.5, 12.0 -2.5 -100 0.85 -0.4 0.45 Unit FLASH MODULES Standby Current Static Current Output Voltage Output High Voltage Output High Voltage Lock Voltage NOTES: current listed includes both operating current frequency dependent component MHz). frequency component typically less than mA/MHz, with VIH. active while Embedded Algorithm (program erase) progress. test conditions: 0.3V, 0.3V White Microelectronics Phoenix, (602) 437-1520 WF128K64-XG4WX5 CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS, CONTROLLED (VCC 5.0V, -55°C +125°C) Parameter Symbol Write Cycle Time Chip Select Setup Time Write Enable Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Chip Select Hold Time Write Enable Pulse Width High AVAV ELWL WLWH AVWL DVWH WHDX WLAX WHEH WHWL 12.5 tOES tOEH 12.5 12.5 -120 12.5 -150 12.5 Unit Duration Byte Programming Operation (min) WHWH1 Chip Sector Erase Time Read Recovery Time Before Write Setup Time Chip Programming Time Output Enable Setup Time Output Enable Hold Time Toggle Data Polling. WHWH2 GHWL CHARACTERISTICS READ ONLY OPERATIONS (VCC 5.0V, -55°C +125°C) Parameter Read Cycle Time Address Access Time Chip Select Access Time Output Valid Chip Select Output High High Output High Output Hold from Address, Change, whichever first Guaranteed design, tested. Symbol AVAV AVQV ELQV GLQV EHQZ GHQZ AXQX -120 -150 Unit FLASH MODULES White Microelectronics Phoenix, (602) 437-1520 WF128K64-XG4WX5 CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS, CONTROLLED (VCC 5.0V, -55°C +125°C) Parameter Write Cycle Time Setup Time Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Hold from High Pulse Width High Duration Programming Operation Duration Erase Operation Read Recovery before Write Chip Programming Time Symbol AVAV WLEL ELEH AVEL DVEH EHDX ELAX EHWH tEHEL WHWH1 WHWH2 GHEL tCPH 12.5 12.5 12.5 -120 12.5 12.5 -150 Unit FLASH MODULES White Microelectronics Phoenix, (602) 437-1520 WF128K64-XG4WX5 FIG. WAVEFORMS READ OPERATIONS Addresses Stable tACC Output Valid High High FLASH MODULES Addresses Outputs White Microelectronics Phoenix, (602) 437-1520 WF128K64-XG4WX5 FIG. WRITE/ERASE/PROGRAM OPERATION, CONTROLLED Data Polling tWHWH1 FLASH MODULES 5555H tWPH tGHWL DOUT NOTES: address memory location programmed. data programmed byte address. output complement data written each chip. output data written device. Figure indicates last cycles four cycle sequence. Addresses White Microelectronics Phoenix, (602) 437-1520 Data WF128K64-XG4WX5 FIG. WAVEFORMS CHIP/SECTOR ERASE OPERATIONS 2AAAH 5555H 2AAAH 5555H 10H/30H tWPH FLASH MODULES 5555H tGHWL Addresses Data NOTES: sector address Sector Erase. White Microelectronics Phoenix, (602) 437-1520 tVCS WF128K64-XG4WX5 FIG. WAVEFORMS DATA POLLING DURING EMBEDDED ALGORITHM OPERATIONS High Valid Data D0-D7 Valid Data tWHWH Data D0-D6 D0-D6 Invalid FLASH MODULES White Microelectronics Phoenix, (602) 437-1520 tOEH WF128K64-XG4WX5 FIG. WRITE/ERASE/PROGRAM OPERATION, CONTROLLED Data Polling tWHWH1 tGHEL tCPH DOUT 5555H FLASH MODULES Addresses NOTES: represents address memory location programmed. represents data programmed byte address. output complement data written each chip. output data written device. Figure indicates last cycles four cycle sequence. White Microelectronics Phoenix, (602) 437-1520 Data WF128K64-XG4WX5 PACKAGE 504: LEAD, CERAMIC QUAD FLAT PACK, CQFP (G4W) (0.200) 39.6 (1.56) 0.38 (0.015) 1.27 (0.050) (0.005) IDENTIFIER 12.7 (0.500) (0.020) PLACES (0.200) 0.25 (0.010) PLACES 1.27 (0.050) (1.50) PLACES 0.38 (0.015) 0.08 (0.003) PLACES 0.25 (0.010) 0.05 (0.002) LINEAR DIMENSIONS MILLIMETERS PARENTHETICALLY INCHES ORDERING INFORMATION 128K64 PROGRAMMING VOLTAGE DEVICE GRADE: Military Screened Industrial Commercial FLASH MODULES White Microelectronics Phoenix, (602) 437-1520 -55°C +125°C -40°C +85°C 70°C PACKAGE TYPE: Lead 40mm Ceramic Quad Flat Pack, CQFP (Package 504) ACCESS TIME (ns) ORGANIZATION, 128K User configurable 256K 512K Flash PROM WHITE MICROELECTRONICS Other recent searchest85W - t85W t85W Datasheet S3C8095 - S3C8095 S3C8095 Datasheet P8095 - P8095 P8095 Datasheet MCH03 - MCH03 MCH03 Datasheet LT1K63-2K-RGB-S18 - LT1K63-2K-RGB-S18 LT1K63-2K-RGB-S18 Datasheet LM3875 - LM3875 LM3875 Datasheet ICS85314I-01 - ICS85314I-01 ICS85314I-01 Datasheet F0004 - F0004 F0004 Datasheet EE-163 - EE-163 EE-163 Datasheet CM400 - CM400 CM400 Datasheet RM440 - RM440 RM440 Datasheet RM800 - RM800 RM800 Datasheet 500to2000MHz - 500to2000MHz 500to2000MHz Datasheet
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